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Padstack Enhancements
! t8 G2 ^% n2 r# gSame Net DRC System& ]+ r) d0 A2 y7 n
Via-in-Pad DRC
5 I+ C7 I5 i% r6 m3 [Adding HDI Via Structures
: S3 N6 H: m& }2 L5 o9 t# W. NHDI Utilities
4 p5 U4 I- n( `( V2 {& b* |9 }; g$ P6 eDynamic Unused Pad Suppression
q; D7 q* k0 C! v$ iDrill to Metal DRC
( j, G% a" K; zDynamic Filleting
% X' ?# H3 E# X, o3 g! E) dPlacement Application Mode
* V$ s& s( L2 a% A$ x/ O/ X2 ISnap Functions
" U4 T2 m& G4 F$ U0 tColor Enhancements! E1 U7 C: `0 F' b. m6 S
Diff Pair Enhancements
$ S' p. t: v, a9 I$ e" Y* `5 f Layer-based Design Partitioning
$ U ]* M4 H K& pPCB的增强,估计对于一般用户,比较有用的功能是
- ~& z* k6 w. T; d, Y. @9 S, _' P2 aPlacement Application Mode
) c! M, {! ~# I6 O+ |; W$ m0 v" uSnap Functions0 d: | C+ ?+ r5 t
其他各方面的增强,主要体现在高密度板卡方面! i3 }( _. P3 Q Z/ w: w" N
" ?5 u# P( k6 w[ 本帖最后由 shg_zhou 于 2008-11-18 14:22 编辑 ] |
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