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Padstack Enhancements
; T9 i6 V" n$ A$ X$ W7 k3 n4 [Same Net DRC System
6 k' P w. ~0 H( `! N. eVia-in-Pad DRC
: A& h% o6 u L3 }! j+ D, RAdding HDI Via Structures
# b& Z( w6 n: {9 r1 F, h1 V- k% U+ CHDI Utilities- T; K2 g1 V8 |8 K( Z. x1 Z# N' o
Dynamic Unused Pad Suppression
) ~5 V5 f7 l$ IDrill to Metal DRC
. L* C% B0 T% L/ MDynamic Filleting$ m; h( e, Y. J* b& \' E
Placement Application Mode4 d5 h) @* M1 S; B$ j
Snap Functions
8 A. ?# }4 I" g, Y7 mColor Enhancements: B5 J* L2 U$ _$ O
Diff Pair Enhancements
9 ^6 D3 ~: A" K+ l# a- N6 ? Layer-based Design Partitioning
5 I# V2 `9 N- ^. h* z5 bPCB的增强,估计对于一般用户,比较有用的功能是; V8 `3 m1 X! b- _2 X5 \
Placement Application Mode
3 t3 I- T* O1 ySnap Functions; A, H. l! W/ {: N* v2 j
其他各方面的增强,主要体现在高密度板卡方面
3 i! |* `1 R: p$ j" k( s! l. |( u2 K6 m; z/ J" c1 a
[ 本帖最后由 shg_zhou 于 2008-11-18 14:22 编辑 ] |
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