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本帖最后由 超級狗 于 2017-11-11 15:11 编辑
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# i& l2 X- l3 r5 D( a8 T6 k1 }5 _& `Microsemi 建議參考的標準︰. N- G+ o- ^7 F' ]& W
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+ J4 b6 A! I+ q5 a1 x G$ T- NEDA Publication: Managing Date Code Restrictions on Orders for Electronic Components, An Industry Position Paper at:
4 |' P, R3 ]: b0 }& k) Z* D; _http://www.ecianow.org/wp-content/uploads/White-Paper-Date-Code-NEDA-MASTER.pdf - Joint IPC/JEDEC Standard J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices at:9 v5 ~5 `7 W% {( q" N! p; m1 X
http://www.jedec.org/standards-documents/results/J-STD-033 - JEDEC Publication, JEP160: Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices at:
$ z6 Z/ J0 O- Z- _http://www.jedec.org/standards-documents/docs/jep160 - Joint IPC/JEDEC standard J-STD-020, Standard for Moisture/Reflow Sensitivity Classification for Nonhermetic; ]0 C( g/ q$ w. A1 T
Surface-Mount Devices at:
3 {6 o* v! J' [: J7 Z: v" {http://www.jedec.org/standards-documents/results/J-STD-020 - Joint IPC/JEDEC standard J-STD-002D, Solderability Tests for Component Leads, Terminations, Lugs,% k' G( d! l' z- P7 S
Terminals and Wires at:7 v: l3 `2 w0 ^' d+ ?/ Y: L
http://www.jedec.org/standards-documents/results/J-STD-002D! o) x% x: e, r3 R1 t" o# |8 G3 `
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第一項和最後一項需付費,其它的註冊 JEDEC 會員,均可免費下載!( e# g+ \$ D& W/ a
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