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本帖最后由 超級狗 于 2017-11-11 15:11 编辑 : E1 ~# c8 L# @% [- K/ ~
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Microsemi 建議參考的標準︰
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- NEDA Publication: Managing Date Code Restrictions on Orders for Electronic Components, An Industry Position Paper at:
( f0 C9 _: M$ P8 z; ?http://www.ecianow.org/wp-content/uploads/White-Paper-Date-Code-NEDA-MASTER.pdf - Joint IPC/JEDEC Standard J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices at:
, i; f& u1 S3 u) k) Ahttp://www.jedec.org/standards-documents/results/J-STD-033 - JEDEC Publication, JEP160: Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices at:
3 U, i# k$ }4 I. n3 Q! _% e. u9 Q rhttp://www.jedec.org/standards-documents/docs/jep160 - Joint IPC/JEDEC standard J-STD-020, Standard for Moisture/Reflow Sensitivity Classification for Nonhermetic: ?6 i6 r2 S* t5 u3 `
Surface-Mount Devices at:& R8 z; L1 @ M. v
http://www.jedec.org/standards-documents/results/J-STD-020 - Joint IPC/JEDEC standard J-STD-002D, Solderability Tests for Component Leads, Terminations, Lugs,# X5 c, C. j# c; @; _! v- Q
Terminals and Wires at:
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第一項和最後一項需付費,其它的註冊 JEDEC 會員,均可免費下載!
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