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获奖论文在各公司的分布情况
本帖最后由 stupid 于 2013-2-16 14:49 编辑
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1. A reusable generic platform for validation and characterization of high speed mixed signal designs9 c2 h5 d2 ~4 l
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Rambus 出品。
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$ ~- t3 x$ v* ^5 O2. A rapid prototyping of FPGA-Based duobinary transmitter/receiver for high speed electrical backplane transmission# u" h; t; O% S4 }
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宾大和Agilent联手，Agilent方面是Mike Resso.$ m! U* A2 Y# h6 }1 Q6 T4 J+ C, I5 v
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3. channel to channel crosstalk behavior and design optimization for ddr4 memory buses; Z* k+ Q) r: b! K
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Intel，Xiang Li，DDR4连接器规范的制定者。
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. s; W" E! u ~! w0 ?4. signal and power integrity(SPI) co-analysis for high speed communication channels
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6 f( v( s7 ]; W) `: T- sIBM美德研发中心联手。
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5. innovative PDN design guidelines for practical high-layer-count pcbs
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" {6 n0 Z- u& _% E作者主要来自密苏里理工，其中Siming Pan 和Jun Fan都来自清华，后都就读于密苏里，俩人貌似有师生之谊。
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?2 N u. x- n, h b6. Time domain and statistical model development,correlation,and analysis methods for high speed SerDes , g& H, ~' E% D3 p! V
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LSI和Agilent联合，Agilent是Fangyi Rao。
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7. applying microwave techiques to digital systems: a simple case study3 ~; O8 ^* r9 J7 ~( N
* }5 l6 f; {: bCray、SiSoft联合出品。& w* m, Y6 _* K6 N1 C( Y/ W$ [
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8. high throughput,hign-sensitivity measurement of power supply-induced bounded,uncorrelated jitter in time,frequency,and statistical domains
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+ K- d5 `$ ?. F/ `. }- FAltera出品，3个作者都是亚裔，其中大家熟悉的Daniel Chow，以及一位疑似华人Shishuang Sun。& `7 x4 S* c& C! p" U4 P7 o( n3 s
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9. beyond 25Gbps:a study of NRZ and multi-level modulation in alternative backplane architectures
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$ [9 [4 c$ e! k& I5 ^% N: o& ULSI、TE联合出品& ?- T) D$ }0 l1 ~
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10. Memory interface on-chip PDN noise Charachterization,modeling and its impact on timing
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) ~( }' ]2 ]% TAltera出品，9位作者。* }: D' a$ l3 m
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11. Enabling DFT logic and timing verification in mixed signal designs' U) r- P0 d' i% ~5 p2 y( C1 O
2 K% t; k1 R2 p. i7 ZRambus和Synopsys联合出品。
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; `- N0 n9 C% ?1 t2 p12. analytic solutions for periodically loaded transmission line modeling9 c2 T$ q0 \; i* n4 a
/ I+ \' u3 C6 J, L9 |' m6 lIntel 和 Ansys 联合出品。
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7 p: ^2 b5 t3 j; E13. power-signal co-integrity design for multi-Gbps low-power DDR3 mobile platforms
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Samsung出品，目前似乎还没有用LPDDR3的手机，但是毫无疑问，这将会很快成为智能手机的标配。
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14. power/Ground bump optimization technique on early design stage- r- ?* c: z' }( t: o: C7 a3 ^
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Smasung出品。
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15. DDR memory channel design from passive stub eqalizer perspective
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) z a+ A1 a' L+ A! }Intel，貌似1位华人 Qin Li。, a3 @( a1 \+ {
8 [) |9 P- E8 u16. using power aware IBIS v5.0 behavioral IO models to simulate simultaneous Switching Noise5 h+ ?. X( J7 p
9 S$ ]/ K! F3 q8 FXilinx 和 Cadence出品，非常有用的SSN仿真文章。6 H% N% C& c' e0 e
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17. validating EMC simulation by measurement in reverberation chamber: H+ h' o& c& w6 p( o/ A+ t
2 g2 q8 N+ v( K' Y来自Cisco，作者中有4位华人，3位来自思科中国研发中心，分别是Xiaoxia Zhou，Hongmei Fan，Jinghan Yu
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18. 3D interposer design and electrical performance study. q! y( k- M7 Q X2 e
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Rambus 联合出品。: B# y: M0 P7 |
2 a; I, w3 ~/ ^; O6 O19. Dramatic noise reduction using guard traces with optimized shorting vias- T. q/ W& d4 d* @
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Eric Bogatin和Lambert Simonovich联手! V( M0 l) Y& X* S( m
, F7 e4 \6 d5 o8 E0 Z& Q- U+ b20. effects of ground via asymmetry on mode conversion for high speed differential signals5 B8 @" p. t1 q* U) a6 N
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IBM独家出品。
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, v. ~' t3 u- q8 r8 h9 G, G3 U21. design and analysis of a high-speed parallel interface for 16Gbps coded differential signaling' d1 {4 X/ P, E& u' ~$ }
3 C4 c2 O* ^6 e' J6 o- Y/ t- Z1 E5 IRambus、Samsung联合出品。
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22. measurement-based simulation:increasing IBIS-AMI model Accuracy with Data from lab measurements
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9 z3 p! u" `: K" L' qSiSoft、Ericsson联合出品。
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$ J: g% D2 n% e% L0 q23. accurate receiver clock positioning in high speed parallel buses 3 w' T3 Q! Z6 p F
8 f) }7 }3 }) O/ G PRambus、Altera、xilinx、Qualcomm 联合出品。
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! w; `' s* e) z7 _6 C! Z" e24. partial response and noise predictive maximum likelihood(PRML/NPML) Equalization and Detection for high speed serial link systems1 l5 n; i: ?1 A4 p1 Y+ c" F6 F
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LSI出品，3作者中有一个中国人，Cathy Ye Liu，1995年清华毕业，后去了美国。
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25. Which one is better?comparing options to describe frequency dependent losses: `. N% y. M( Z% q6 q3 e. [
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Eric Bogatin联合CCN，Simberian出品。
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% }- A! Z* s; Y+ d6 K( J26. a reverse nyquist approach to understanding the importance of low frequency information in scattering matrices 7 d) g' b, q# s) Y {
: u( x3 A- C$ G* I- c; yAnsys出品
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1 r( f" p7 s& V/ P27. Terabit/s packaging design for testing of high speed IC transceivers
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6 P+ z' ?1 E) q出自鼎鼎大名的IBM T.J.Watson Research Center，Xiaoxiong Gu是众多作者中的一位。
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28. Channel operating margin(COM):evolution of channel specification for 25Gbps and beyond; S2 m; k- U" f
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Intel、Altera联合出品，Mike Peng Li出手啦。3 z4 r# ]2 g2 V( o/ J7 H
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从今年DesignCon的获奖论文看，Rambus依然是论文大户，共有5片论文获奖，其中4篇是和别人合作。Intel 4篇，2篇与人合作。Altera 4篇。IBM独自贡献了3篇。 Samsung 3篇，一篇和Rambus联合，跟最近整个三爽的势头一样，表现的很猛。LSI 3篇。Agilent、xilinx、Sisoft都是2篇。多产的Bogatin博士，也是2篇。仿真大户Ansys这次只收获了1篇。 整机厂商，如Cisco、Cray、Ericsson则均收获了一篇。
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; k" F1 U1 m; [! f$ e) u密苏里理工表现优秀，乔治亚理工则没有收获。2 b9 V. V k( y" h
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国内SI的领头羊，华为亦有论文宣讲，但未中奖。另外Qualcomm的有线部门开始发力，他们目前的重心应该在10G 以太网上。
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% ~7 ?% W& r [- d' r# d另外，几乎每篇获奖论文的作者都有一个华裔，从侧面反映出来中国人苦逼，到哪儿都是做民工的命，呵呵……/ G9 a+ X* E* C; X
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发表于 2013-1-25 04:47
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发表于 2013-1-30 00:44
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