逻辑电平接口

liubingbuku

1 逻辑电平的基本组成单元－三极管、MOS 管及其开关特性........................................... 5
1．1 半导体三极管及其开关特性..................................................................................... 5
8 E4 l  Y! L6 m0 }1．2 MOS 管的开关特性......................................................................................................7
2、逻辑电平简介.................................................................................................................... 8
# J. N: D' u/ h6 ^8 k3 W3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
, w, d. f& K) [  X, t# f, F. L3.1：逻辑电平的一些概念............................................................................................... 10
; }6 z/ X: \8 A1 Q! V! Q( A: S3.2：常用的逻辑电平....................................................................................................... 11
3.3：TTL 和CMOS 的逻辑电平关系.................................................................................. 11
+ K5 _, z) x9 y# P3 g4、TTL 和CMOS 逻辑器件.................................................................................................... 13
: A& b% k4 T3 {1 o+ Y4.1：TTL 和CMOS 器件的功能分类.................................................................................. 13
% [; ]: N) W& y4.2：TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
9 a& u2 v) e: M' {8 ^+ E4.3：TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
4.4：包含特殊功能的逻辑器件....................................................................................... 14
4.5：逻辑器件的使用指南............................................................................................... 15
5、TTL、CMOS 器件的互连.................................................................................................. 16
' h6 c1 l# i0 y. J3 l5.1：器件的互连总则.......................................................................................................16
5.2：5V TTL 门作驱动源..................................................................................................19
5.3：3.3V TTL/CMOS 门作驱动源..................................................................................... 19
5.4：5V CMOS 门作驱动源................................................................................................ 19
/ R' H6 [* G8 T0 B7 @5.5：2.5V CMOS 逻辑电平的互连.................................................................................... 19
6、ECL 器件的原理和特点................................................................................................... 20
  B: j7 n: }# r( m* p# U. P  s6.1：ECL 器件的原理........................................................................................................20
" N) z% c1 s! X! w) W8 S* F% e- r' L6.2：ECL 电路的特性........................................................................................................21
( b  q( l, g( R% @& O6.3：ECL 器件的使用原则................................................................................................ 22
9 o/ F" F9 Y8 @, L" A7、GTL 器件的原理和特点................................................................................................... 23
7.1：GTL 器件的特点和电平............................................................................................ 23
7.2：GTL 信号的PCB 设计................................................................................................ 24
7.3：GTL 信号的测试........................................................................................................25
% H1 x5 N2 y4 O0 B; {7.4：GTL 信号的时序........................................................................................................25
8 HSTL 电平......................................................................................................................... 25
; E, T  f* I6 ?2 N0 T$ c8.1 基本定义..................................................................................................................... 25
1.2 HSTL 分类.................................................................................................................... 26
$ A) P1 e5 J  L! q8.3 HSTL 特点及SSTL .....................................................................................................26
9 PECL、LVPECL 电平........................................................................................................... 27
3 P) g& p0 @4 }9.1：PECL/LVPECL 器件的原理和特点............................................................................27
9.2. PECL/LVPECL 电平输出结构................................................................................... 27
9.3 PECL/LVPECL 信号的输入输出门特点： ..................................................................29
8 G& d* a) U3 b" }1 F% s10 CML 电平......................................................................................................................... 30
10.1. CML 接口输出结构............................................................................................... 30
10.2 CML 接口输入结构...................................................................................................30
% ^2 j3 _- n1 `  r' f7 f/ ^10.3 CML 电平的输出门和输入门的特点： ....................................................................31
11. LVDS 器件的原理和特点.......................................................................................... 32
11.1：LVDS 器件简介........................................................................................................32
) S  R4 A+ |. J. _: [; b  f11.2 LVDS 器件的工作原理.............................................................................................. 33
11.3 LVDS 输入输出结构.................................................................................................33
11.4 LVDS 电平的特点...................................................................................................35
$ v. H  b; H' x, P- N8 W% J12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
12.1 CML LVPECL LVDS 简单比较..............................................................................35
12.2 CML LVPECL LVDS 的互连综述..........................................................................38
5 _: Q5 X& K* X, ~5 X4 v; K12.3 LVPECL 的互连........................................................................................................39
12.4 LVDS 的互连............................................................................................................44
12.5 CML 的互连..............................................................................................................45
附录：.................................................................................................................................... 47
附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47
附录2． CMOS 门电路及其特点.................................................................................... 59