|
EDA365欢迎您!
您需要 登录 才可以下载或查看,没有帐号?注册
x
1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5
- t9 s# A5 d2 @1 _. O/ D1.1 半导体三极管及其开关特性..................................................................................... 5, i0 O# a2 h! G Q5 ~
1.2 MOS 管的开关特性......................................................................................................7/ a$ X8 P, v1 K- _$ n I
2、逻辑电平简介.................................................................................................................... 8- [! n1 V+ U F* P( u( b. r3 H
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
4 U/ b% E( V1 f* p, K$ K6 Y3.1:逻辑电平的一些概念............................................................................................... 10! `: |# p: A Y1 d6 V
3.2:常用的逻辑电平....................................................................................................... 11( u- Q3 i# Y+ ]6 D5 a( X' f: j+ z
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 11
1 R* N9 q5 O2 w4、TTL 和CMOS 逻辑器件.................................................................................................... 13
! X' L% y0 N: G. y" `3 ~; o6 e4.1:TTL 和CMOS 器件的功能分类.................................................................................. 131 q1 m2 n) ?1 @6 `9 b# R
4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................134 ]' P5 A0 a1 G0 `* d6 y3 {3 ]) X8 v
4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13! r! d _3 `5 {3 x7 k" A
4.4:包含特殊功能的逻辑器件....................................................................................... 14% d5 v& \. O' m% r, y
4.5:逻辑器件的使用指南............................................................................................... 15" Z$ N- ], m" H4 p0 a) [1 f
5、TTL、CMOS 器件的互连.................................................................................................. 16' h* B% W' o5 l& \
5.1:器件的互连总则.......................................................................................................16
4 v+ C) W6 Q, Z2 }: i5.2:5V TTL 门作驱动源..................................................................................................199 G0 N/ J& b0 q) L
5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19
) B9 ]# H8 j: \% S( Z6 X5.4:5V CMOS 门作驱动源................................................................................................ 19
& _- X, d8 a$ v0 r& ^5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
( n( z _5 ^/ v% l' W3 Q6、ECL 器件的原理和特点................................................................................................... 20
% o3 K R: i! }/ Z- i6.1:ECL 器件的原理........................................................................................................20
/ o s# K6 }7 j6.2:ECL 电路的特性........................................................................................................21
. u: B9 v" |1 k( e& a8 [: z6.3:ECL 器件的使用原则................................................................................................ 22
( G3 [ r2 [, E% }7、GTL 器件的原理和特点................................................................................................... 23
1 ?- H, _1 D/ _+ v7.1:GTL 器件的特点和电平............................................................................................ 237 w- w4 |) b% N2 H. J6 }
7.2:GTL 信号的PCB 设计................................................................................................ 24- w( \" f) Y5 s& s7 d4 g- a+ Z
7.3:GTL 信号的测试........................................................................................................25/ D- c7 H4 o7 L+ K0 y- L% w
7.4:GTL 信号的时序........................................................................................................25
" r2 |# U V+ |( X+ s8 HSTL 电平......................................................................................................................... 25+ C. ^0 D6 @0 F) A+ ^
8.1 基本定义..................................................................................................................... 25
5 U3 V$ G! p3 g! k3 i8 \7 c* B' @1.2 HSTL 分类.................................................................................................................... 26
3 K# a$ X' b7 e9 `2 J8.3 HSTL 特点及SSTL .....................................................................................................26
3 T( [4 V6 P, P- V3 ?/ s$ ^$ k9 PECL、LVPECL 电平........................................................................................................... 27/ j- B, p: ^8 _# W4 B9 r/ M# v' a$ R
9.1:PECL/LVPECL 器件的原理和特点............................................................................277 Z4 c" O |4 ?
9.2. PECL/LVPECL 电平输出结构................................................................................... 27
6 y4 D1 h+ H+ {2 v, q2 J9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
0 i: m! W0 J) S' w6 H" X6 Z9 ?10 CML 电平......................................................................................................................... 30
, X0 J" E5 [; X" V10.1. CML 接口输出结构............................................................................................... 30
$ I1 W* a0 Y) e# H8 W2 J( Z2 D10.2 CML 接口输入结构...................................................................................................306 p9 j* [# w4 l, m$ y
10.3 CML 电平的输出门和输入门的特点: ....................................................................31
) v1 R5 g. [! M: ]8 d( t( B' ?11. LVDS 器件的原理和特点.......................................................................................... 328 j* N4 Q, @' m& |
11.1:LVDS 器件简介........................................................................................................32! j \+ X" d+ b8 v! A4 ]* ?! d7 j4 I% q. _
11.2 LVDS 器件的工作原理.............................................................................................. 33. J7 c7 k& y6 j; T0 v3 c6 A2 N1 E
11.3 LVDS 输入输出结构.................................................................................................33
, N8 t4 l2 e. [& F$ a. n! b11.4 LVDS 电平的特点...................................................................................................350 r( `5 [3 Y# T% d8 L) s1 ^1 G L
12. CML LVPECL LVDS 简单比较及互连......................................................................... 35' [+ m6 z! L9 q$ j
12.1 CML LVPECL LVDS 简单比较..............................................................................355 @ K# s% R5 |& Q
12.2 CML LVPECL LVDS 的互连综述..........................................................................38
# Y, _+ I! |2 [2 q: m2 g; I12.3 LVPECL 的互连........................................................................................................39' C, Y( F1 h- B! e
12.4 LVDS 的互连............................................................................................................44
# w/ a8 e5 }$ ?12.5 CML 的互连..............................................................................................................45
4 G9 b& Q9 B. w附录:.................................................................................................................................... 47
" N3 n* Y+ ^/ E* j, x' c. t! s附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47
1 j. H* O3 |( m( s9 F附录2. CMOS 门电路及其特点.................................................................................... 59 B3 [, G0 ^0 r& u- E
) ^2 c: q# H% P9 ?2 L; p
|
|