|
|
contents
3 ?$ ^+ N( Y* K& K2 g: [
2 h* Y! D* R1 A5 e1 Introduction ................................. 19 I" b9 Y2 @9 Q0 b* I
What You Will Learn from This Book ............ 1; F. D. f7 ^. j) n) c
Who Will Benefit from This Book ............... 2
9 D: } g: G$ O2 u5 W) n! wThe General Format of This Book ............... 2
7 `' ?3 [ D3 \+ Y' ]Why Measure .......................... 37 ^; \0 L1 g4 W; B& _2 Z6 `+ L8 h
Obtain or Validate Data ................. 3& k- A% |8 ` ~ L: |1 a i
Design, Selection, and Optimization ....... 5+ v5 f4 ~9 ]/ s- C) M$ [- ~
Troubleshooting ........................ 5, [) R; Y- c) ?- I( d# S) z0 {3 k, s8 Y
Validation or Verification ................. 7" w4 h" I1 @9 T8 E9 O2 R
Terminology ........................... 7
6 O1 v1 a+ M7 ~- Q1 I 2 Measurement Philosophy ..................... 11
. W+ U' a: z" TCause No Damage ............................ 11 O3 q2 `2 J3 _6 M
Measure without Influencing the Measurement ... 11
, c' i4 l% X/ ~0 s3 y5 A) M! AValidate the Test Setup and 0 G3 t7 d) n( d- |) l7 i. `: R# }
Measurement Limits ........................ 12$ Q. R! n+ U0 ^. A( m0 ?
Measure in the Most Efficient and Direct Way .... 146 v/ w; M. ^* {
Noninvasive versus Invasive
/ z, d; w& F S* T* ~4 F& ]Measurement ........................ 14; ~* _+ f$ n/ b$ ]4 s' I: _
In situ Measurement .................... 14
2 f7 e+ \+ N1 q& mIndirect versus Direct Measurement ....... 14% W. U3 i7 i3 g, M% m$ ~* d) s9 v4 V
Document Measurements Thoroughly ........... 15( Z0 E5 P6 A& T
The Test Engineer and Contact
; |" A' j. y- B5 J1 r/ qInformation .......................... 15
+ t# l, c% R7 W+ g6 g0 IThe Purpose of the Test .................. 16
5 z, z, t1 Q5 F. v$ C9 j$ CSimulated or Expected Results if
; u7 i v# z" S6 VAvailable ............................ 17
- ?* \- e. Q" c; Y: G8 cThe Date and Physical Location " `5 D' y l! U
of the Testing ........................ 18
8 `7 L2 \1 D2 L5 U) LOperational Test Environment : A8 `6 C) ~) [
and Conditions ....................... 183 A& r& W8 ], N0 n% _, e
The Model of Each Piece of Test Equipment
. r; p# } V* u9 B* o3 l' b) Z(Including Probes) and Verification That
) w& Q# k. l- l" b# r9 P EThey Are Calibrated .................. 18' g8 ]. W& U* s2 W: q6 D
Setup Diagram and/or Picture ............ 19
1 F/ l s" f" @+ g' k3 cMeasurement Annotations and
W9 G- M. I; \: W$ sComments .......................... 204 f3 N; j9 e/ L t. m6 B
Any Observed Anomalies ............... 20
5 m B# e2 ~+ v) Z! V) i" l
; ~, V; z( K" m3 m1 ~3 Measurement Fundamentals ................... 21
8 n2 N( i7 ]7 ]7 c3 j% z4 C2 c5 ZSensitivity ................................... 21' [) `4 [$ R. o
Noise Floor .................................. 22
' ]9 R- t; Z9 k" a$ Q) G3 }Dynamic Range .............................. 22' ]. h, x9 o0 a
Noise Density ................................ 274 ]5 d1 H* V$ h" }$ w( k
Signal Averaging ............................. 31' m# {3 z) t& C
Scaling ...................................... 33/ @- b1 A& j- O" Z' n
Attenuators .................................. 34" p4 l1 m+ H' A
Preamplifiers ................................. 35, n9 R8 v- Q9 u i$ H2 f
Linear versus Log Display ............... 36
& W2 }# H0 `2 f/ L5 cMeasurement Domains ........................ 38
7 N1 U V6 ~3 U# }Frequency Domain ...................... 38
. o) V* o& q3 m' X5 i7 Z( RGain and Phase ......................... 38& B! {2 N C9 Y5 h
S-Parameters ........................... 388 y( `* M- \) B6 ]6 J4 a5 o
Impedance ............................. 391 [7 A. j4 k$ l+ r" ?9 p! O. ~7 M
Time Domain ........................... 40
3 a: b- I) r, l3 {- N. u: f. ASpectrum Domain ....................... 42; D4 i- w# q5 L
Comparing Domains .................... 44
; R) M$ U+ b, yEndnotes .................................... 46
! v3 g; x) {0 _/ d5 R2 E3 ]2 S 4 Test Instruments ............................. 47
2 Q6 ^/ J7 }- h7 {* T. _! Z5 o1 i" EFrequency Response Analyzers and Vector
5 Y, t; G5 J* z5 HNetwork Analyzers ......................... 47
, T9 ?; i |+ KOMICRON Lab Bode 100 ................ 49
+ k$ p6 d- k, Q( x1 G: A9 }- GAgilent Technologies E5061B ............. 50% }3 m% h( O. O l* `& V0 a' B
Oscilloscopes ................................. 507 z& j6 b- l+ q% f4 J! x
Teledyne Lecroy Waverunner 6Zi ......... 51
# q/ [8 g: x$ b( F# GRohde & Schwarz RTO1044 .............. 52
! n( Q9 B F. M, Q, ?Tektronix DPO7000 . . . . . . . . . . . . . . . . . . . . . . 53
# ?9 R$ I% ~6 z% b2 ATektronix DPO72004B ................... 54) e7 Q0 h$ q" h+ S j
Teledyne Lecroy Wavemaster 8Zi ......... 55. C' g: F# s4 |1 F* m% E8 l3 d
Tektronix MSO5204 ..................... 56. q. s* P; i' }9 h. { k. s
Teledyne Lecroy HDO6104 ............... 560 v D8 J9 R0 o$ J% C2 W, h. y
Tektronix MDO4104-6 ................... 588 s. d; X l, _& V
OMICRON Lab ISAQ 100 ................ 59, V2 E) A9 e* o( `
Spectrum Analyzers ........................... 59- b* |) o1 ^+ G! w
Tektronix RSA5106A .................... 59
8 n' z/ i, N+ f3 B6 Y4 QAgilent Technologies N9020A ............. 60
3 C# D% T5 w7 J1 V8 D8 m: ^* LAgilent Technologies E5052B ............. 61; O( a, C$ U9 H7 q# i
Signal Generators ............................. 628 j8 ?. D$ `; m0 I7 B
Agilent Technologies E8257D ............. 62
* f( g; f& D% K; pTDR/TDT S-Parameter Analyzers ............... 63
4 k$ ^: F* h: Q& w* A3 hPicotest G5100A ........................ 637 j, p3 B, U2 E5 |- n* {; a
' s4 h9 i3 I: C3 u A4 HTektronix DSA8300/E8010E .............. 63
S8 [( h6 i; y9 |! o/ e% LTeledyne Lecroy SPARQ 4012E ........... 65
( g" a& }/ a9 b, f9 c( `Agilent Technologies E5071C ............. 665 S1 c$ k5 e/ `& S3 ]! I
5 Probes, Injectors, and Interconnects ............ 69' V5 a, X& F# m6 @
Voltage Probes ................................ 69
, S9 K4 z8 M0 Q6 r7 M0 GProbe Circuit Interaction ................. 70
- e" q4 E8 Q1 U! \1 ?Flattening the Probe Response ............ 725 s: k+ _' b; `; x
Confirming Measurements ............... 74
+ M' L0 Y5 _# q3 ? ~/ A$ MSelecting a Voltage Probe ................. 759 {3 Y6 X' ?; E8 b. p
Passive Probes .......................... 77" R: ^) d2 G3 k6 h2 @. W! v
Active Probes .......................... 79
# D3 f; q2 z& ODifferential Probes ...................... 79
: X, Q. ]0 r0 _Specialty Probes ........................ 80
- {% J3 p4 K! k0 x% ~2 dOther Connections ...................... 91- I0 g5 }8 e1 m) i, b$ a. `
Endnotes .................................... 91/ u; ]. |6 m7 u u) l8 X
6 The Distributed System ....................... 93( v- N0 y4 X/ t* L# d6 \( K$ d
Noise Paths within a Voltage Regulator .......... 93+ d; R, y8 C' i' v5 p
Internal Noise .......................... 95$ R0 W( `' ~% i( b) u
Power Supply Rejection Ratio (PSRR) ...... 95 K5 Z$ W+ `9 u! M
Output Impedance ...................... 99& }$ T# @3 b0 j3 d' j
Reverse Transfer and Crosstalk ........... 99
4 a: P, R4 M$ F8 rControl Loop Stability ......................... 101
" R( r4 R! F( G/ |. X/ \5 H4 }2 JImpact on Output Impedance ............ 101. Z" u. }( ~* I! {
Impact on Noise ........................ 102
$ `* b T n, |Impact on PSRR ........................ 102 R8 \6 d+ U: G' s2 j- W3 H
Impact on Reverse Transfer ............... 1039 K0 |3 b; a6 B
How Poor Stability Propagates through 1 w2 U; Z- `4 R2 l3 z
the System ................................. 103/ T. ^3 B. V3 v$ h8 V
Adding the PDNs ....................... 106' Y( q, Z9 E$ |/ a2 c% F2 E
Endnotes .................................... 108
4 h- q. p! u& ~7 ? 7 Measuring Impedance ........................ 109" Q, |8 G) z( u: R- Y Y
Selecting a Measurement Method ............... 109: G& \4 r5 \2 S, u8 J
Single-Port Measurements ............... 1094 K. T3 j' Q: w- o
Two-Port Measurements ................. 123
: {3 l8 p3 v! W2 ]6 ~1 n7 tCurrent Injection Measurements .......... 1393 H- A% {% Q. p
Impedance Adapters .................... 142
0 Q/ ~0 s% s% J1 k' u" lEndnotes .................................... 148
& s4 O# q, U& Y5 i: { 8 Measuring Stability .......................... 151
9 H' R1 L% [0 Y$ IStability and Why It Matters .................... 151- x. }6 h5 y, u7 T
Control Loop Basics ..................... 151! \: R) {) V3 d- y% v
Gain Margin, Phase Margin, Delay
% p9 q4 }- c6 {# i1 S+ S3 M& XMargin, and Stability Margin ........... 153
$ q z4 J: K- G3 K) o; ZBode Plots and Nyquist Charts ........... 154
' s- m2 i0 d9 j* W* O2 _4 c8 Cx! ~* ^( T2 |! ?# Z6 x
Contents2 R- N7 C. s X2 Y% m
Open-Loop Measurement ................ 159
8 P# p# u" q. \2 ZInjection Devices ........................ 161$ J& o8 Z( n" l7 I# l# F
Small Signal versus Large Signal .......... 1644 I/ j& _" G: ^; g: h( _( [3 K$ m
Closed-Loop Measurement ............... 169
6 m6 K, n: y2 `; xON and OFF Measurements .............. 170' n- w# y1 A0 g. b3 X/ f
Forward Measurements .................. 171/ \, ?' o1 p. J; F9 }4 _, ^5 x o4 P K- O
Minor Loop Gain ....................... 171
* a% K+ v4 E% ]( Z, JNoninvasive Closed-Loop Measurement ... 174
( _" U- u! C( W3 _, Q4 `/ \1 HEndnotes .................................... 1798 j) E" }( Z# \- U" v1 z" k
2 H2 R( ^$ L+ w) a. s3 H2 i7 v9 Measuring PSRR ............................. 181+ S! h+ m9 w0 A- O: t7 { ?+ h6 o
Measurement Methods ........................ 182! G+ S4 H4 C* P& l: O
In-Circuit or Out-of-Circuit ............... 182: ?* F7 x* O: ~! Z/ P$ ~. ^2 N
Direct or Indirect Measurement ........... 182
0 m/ t0 U' [$ h; zModulating the Input ......................... 183
; [* o2 t! i7 O: P9 j( aLine Injector ............................ 184& J5 d$ m! T% g! ~
Current Injector ......................... 188
1 G5 I( b5 M0 D1 W; N' sDC Amplifier ........................... 189+ p% r+ i. V% d- |/ A! u
Choosing the Measurement Domain ............. 189
$ w9 s6 [; R& G0 PVNA .................................. 189
" x8 @8 d2 Q" F7 p4 F; bSpectrum Analyzer ...................... 189 p+ _# P, H/ r/ B: b4 e& K
Oscilloscope ............................ 190
# z! {8 k5 D" |2 }Probes and Sensitivity ................... 190
: e, K: l3 {, f: Z o% EEndnotes .................................... 2003 X) }4 C( h% N+ B
10 Reverse Transfer and Crosstalk ................ 2018 B* @& Z# D5 f* ?2 ^5 H; J# [
Reverse Transfer of Various Topologies .......... 201
! O& x& R( k( U- tSeries Linear Regulators ................. 201) x5 V0 F# ]4 p) O: B8 ^
Shunt Regulators ....................... 201+ s, J1 [- u* g/ N
POL Regulators ......................... 2036 ]: d& t! }2 p7 m! w+ o
Operational Amplifiers .................. 204! t7 T2 l# w: a2 }
Modulating the Output Current ................ 204
. t6 ~ M# L9 j1 y1 M! sCurrent Injector ......................... 205
# S: `+ _% p/ k3 P6 JDC Bias Injector ........................ 2059 t- g7 i- h6 d, @: X& N" v. J
Measuring the Input Current ................... 205
- j& R3 y0 I3 jCalibrating the Measurement ............. 205
" G7 ^# B: I" ]3 a: k$ ^1 X/ \Measuring the Input Voltage ................... 207$ T1 O( P+ u; `$ o
Calibrating the Measurement ............. 209& p1 @! s' K' k1 n% ~! c/ v
Indirect Measurement ......................... 209
: i3 W9 e ]2 H9 A' dEndnotes .................................... 216) X" E/ V$ k/ \2 V7 e& K, {
11 Measuring Step Load Response ................ 217
$ G- K% L9 w* S! z$ j" uGenerating the Transient ....................... 217
9 y' m2 f" {" q" r1 y3 e) BCurrent Injector versus Electronic Load .... 2172 ] `" P9 F- r+ ~: W1 o6 U
Slew Rate .............................. 219
8 P6 P2 P+ |8 D$ I0 \* [! W' x) uCurrent Modulation Waveform ........... 221
( [* _0 Y0 `; Q. m Contents
o9 L5 u0 t! L* Jxi) C3 { n! d& _0 ~, H. J
Measuring the Response(s) ..................... 2235 P5 K& [9 ?% Q: c9 U
Large Signal versus Small Signal .......... 223/ I* S! o& s1 ?9 h0 a* C
Notes about Averaging .................. 224& {5 h% c4 o5 O$ T* s' X9 ~4 j* d
Sample Rate and Time Scale .............. 226
2 u, z/ ~/ `. O$ SEndnotes .................................... 2326 z+ R! r0 w* o
12 Measuring Ripple and Noise .................. 233
- R7 n- N9 P' ~, [' y% ^2 x/ y% ESelecting a Measurement Method ............... 234
* s# Y7 j( {. s5 V# [& c! mIn or Out of System ..................... 2340 F- a) c2 H# P9 b" u0 p1 W6 \
Direct or Indirect ....................... 234
: r4 u, W# w" [) D9 R2 pTime or Spectral Domain ................. 234
6 X' I8 i6 J; b" w/ L7 BConnecting the Equipment ..................... 235
$ Z9 P9 ]' ~ ~Passive Scope Probes .................... 235
6 p% d F# T( K7 A# W6 \$ BActive Scope Probes ..................... 236' D6 x" y7 Q1 ~% u3 M
Direct 50-W Terminated Connection ....... 236
) e0 e9 M0 V7 z6 H& JChoosing the Equipment . . . . . . . . . . . . . . . . . . . . . . . 237
' \- z- ^* W p, n4 \" K+ d, w" I" VAveraging and Filtering ....................... 2523 t; O5 I) ?* D7 F
Endnotes .................................... 2525 K2 L+ @9 e; \0 ^ E- |
13 Measuring Edges ............................. 253
$ s, Z, O- Z! P+ }6 qRelating Bandwidth and Rise Time .............. 253
: D% a) X) Y& T; F" e* r9 f: a1 MCascading Rise Times ................... 256/ [& r" ?1 W5 L* n! I( r7 l2 s
Impact of Filters and Bandwidth . l6 E: { f* ^0 b- k- q r5 h) r
Limiting ............................. 257+ X$ a8 r( A! ]9 c9 G1 S. O
Sampling Rate and Interleaved Sampling ........ 261
+ ^7 Y+ k: ~7 @, F6 EInterpolation ................................. 264
, t* C( F9 _$ z9 l1 K; G. C5 l- zCoaxial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265
* g. h! p+ z( G `! }% E3 T JEffects of High-Frequency Losses ......... 265
; W- \! J: A# o# W& uThe Criticality of the Probe Connection .......... 267
( q1 ?3 q. l+ p$ V+ rPrinted Circuit Board Issues ................... 269$ l4 o3 I2 o0 S. I
Probes ....................................... 269
' k" W! P0 C/ J+ J9 t' e$ GEndnotes .................................... 273
2 J8 T/ x0 N# B: v7 ] T8 X2 j7 F 14 Troubleshooting with Near-Field Probes ........ 275
- B' v/ b. \( B A! O) t+ XThe Basics of Emissions ........................ 2755 l2 l, b( m! q4 I# N0 M. \9 s
The Near-Field Probes ......................... 277 c1 q0 ^. K/ J- i! N% b& C! p
Probe and Orientation ......................... 2783 }! M' ?3 N7 s" r& P
The Measurement Instrument .................. 2811 j7 S$ y$ Q/ x" g; P
Spectrum Gating .............................. 281
4 v, v* f! }( e; N4 oEndnotes .................................... 295
6 f' a. ]8 g- `+ i 15 High-Frequency Impedance Measurement ...... 297
2 U' V& y A! rTime Domain ................................. 297! U' G; M$ ]- j' C% h1 e
Time Domain Reflectometry .............. 298; O2 d, w' `8 G, j& W
Calibration ................................... 299, N6 U( ^; D* X+ F. T- ]2 Z
Reference Plane ............................... 300
" _8 S# A2 s- ~ |) ~xii
9 e7 p! ~ e3 P/ N Contents7 S0 @/ {/ F8 c
Setting TDR Pulse Rise Time ................... 303
1 \' q: H& p6 l; }Interpreting TDR Measurements ................ 3042 }9 J( ]3 z7 k, Q+ c% {
Estimating Inductance and Capacitance .......... 307
( E* U' N# H2 H+ K) d" }S-Parameter Measurements .................... 314! a+ z" V! a3 Q$ B$ q
Endnotes .................................... 316
. B- _; s% P! {* f9 q1 u Index ....................................... 319 |
|
[复制链接]
/1 
发表于 2015-5-4 09:17
QQ好友和群
QQ空间
腾讯微博
腾讯朋友
微信
收藏
支持！
反对！
来自 2#
发表于 2015-6-24 00:59
楼主
