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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5( h8 W5 ?' h( r4 l" J
1.1 半导体三极管及其开关特性..................................................................................... 5
, P5 v% n. {2 |1.2 MOS 管的开关特性......................................................................................................7 P8 L6 U; d& a; s: C9 E
2、逻辑电平简介.................................................................................................................... 8; w! b1 C2 V5 p, ?* k" P# r" i: S
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10" y/ A$ Y& `$ ^
3.1:逻辑电平的一些概念............................................................................................... 107 m) l$ F' R7 U& @4 w
3.2:常用的逻辑电平....................................................................................................... 11
4 Q5 U$ z0 X# v8 Q e3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 11
( y, m0 \) g4 U# O. M4、TTL 和CMOS 逻辑器件.................................................................................................... 13% }3 I9 v1 X8 i
4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13
" q2 D& H$ J0 G" `# m4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
# L. _& Q; j3 n- g! o4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
9 t8 v9 P l( ^- r- |4 \) C3 W* K4.4:包含特殊功能的逻辑器件....................................................................................... 140 a* N Y1 V; l
4.5:逻辑器件的使用指南............................................................................................... 15/ o) Q5 S4 t- \8 [% l! [2 o, `
5、TTL、CMOS 器件的互连.................................................................................................. 16
& C% f: c; K- m7 k) W4 W# J; z8 \5.1:器件的互连总则.......................................................................................................16! ?& m5 g8 H' B
5.2:5V TTL 门作驱动源..................................................................................................19
' f* U8 V$ [2 U1 ? C5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19. X" V5 ^$ @. ~& M4 A
5.4:5V CMOS 门作驱动源................................................................................................ 19
! f& f2 g1 B5 {3 |5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19( A) u) J" c0 H8 G/ z
6、ECL 器件的原理和特点................................................................................................... 20! m9 @! ]/ n. J3 T5 j4 [
6.1:ECL 器件的原理........................................................................................................205 w2 j7 n$ l1 J- \, a+ `
6.2:ECL 电路的特性........................................................................................................21. b- U# c& r+ c8 h. r7 {
6.3:ECL 器件的使用原则................................................................................................ 22$ J8 @: @, i! B1 C u! F
7、GTL 器件的原理和特点................................................................................................... 23/ a! T9 b9 S' | s
7.1:GTL 器件的特点和电平............................................................................................ 23
+ i! s* j- @; L, D$ R7 j7.2:GTL 信号的PCB 设计................................................................................................ 24
1 p# f& Q1 D6 F# m: y3 s3 z7.3:GTL 信号的测试........................................................................................................253 D# [7 R* l5 G/ o
7.4:GTL 信号的时序........................................................................................................255 m8 k6 A6 F* n B
8 HSTL 电平......................................................................................................................... 25- p; e- s2 E0 A9 C" t- k4 A! W7 N
8.1 基本定义..................................................................................................................... 25! w4 g8 q f+ g, f2 T9 E/ F$ q
1.2 HSTL 分类.................................................................................................................... 26
! z; Q6 A, Y4 W2 r" [: U8.3 HSTL 特点及SSTL .....................................................................................................26" ~! _6 p- W8 ~1 G7 S
9 PECL、LVPECL 电平........................................................................................................... 27
' w6 E+ z/ w4 Y! \9.1:PECL/LVPECL 器件的原理和特点............................................................................27
2 r6 @" t6 S/ P0 U6 \" [9.2. PECL/LVPECL 电平输出结构................................................................................... 27. z$ `, {; | g1 J; y
9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................295 k" L* L* X; H) P( q# O, W, F
10 CML 电平......................................................................................................................... 30+ k) y; g4 P7 M4 T$ R8 {
10.1. CML 接口输出结构............................................................................................... 30
0 g" X; \- R! g, \3 i10.2 CML 接口输入结构...................................................................................................30
: \' ]; D$ z0 i$ x! r% A/ G10.3 CML 电平的输出门和输入门的特点: ....................................................................31& f' P2 N: u9 E- ~4 g# [3 [
11. LVDS 器件的原理和特点.......................................................................................... 324 z. G& }- D! d4 m! y
11.1:LVDS 器件简介........................................................................................................322 s' l i6 Q5 y# _7 Z8 t- Y$ f" g3 s
11.2 LVDS 器件的工作原理.............................................................................................. 33: d/ a5 }0 \2 ?! U
11.3 LVDS 输入输出结构.................................................................................................33
( C) {2 @" Y5 t11.4 LVDS 电平的特点...................................................................................................351 s( |6 C1 e6 V% p" o
12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
- H" n$ v- D6 F3 S& ?: j1 v8 `12.1 CML LVPECL LVDS 简单比较..............................................................................35# H, a' T+ v. s- b9 K9 M
12.2 CML LVPECL LVDS 的互连综述..........................................................................38
5 V i% S2 b- [4 e12.3 LVPECL 的互连........................................................................................................395 p! W5 A& P# j1 r
12.4 LVDS 的互连............................................................................................................44+ @2 s& }0 t1 @$ [
12.5 CML 的互连..............................................................................................................45( c: a9 ]/ r& @- ?! B
附录:.................................................................................................................................... 47
& c& n. M7 m& ?: s7 z) Z% U附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47! I; A' @% T9 }* r$ K7 o! S
附录2. CMOS 门电路及其特点.................................................................................... 59$ {* d+ v3 b3 k4 e ^9 Z9 E9 D
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