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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5
/ V/ H9 f! d8 g8 }2 b1.1 半导体三极管及其开关特性..................................................................................... 5
8 A. x3 @' K3 t7 w% y1.2 MOS 管的开关特性......................................................................................................7
3 ]0 ^% @2 u. l. r9 e2、逻辑电平简介.................................................................................................................... 8( _; k) L4 R' ]/ I
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10; B( x- }1 \" h* e/ X* {
3.1:逻辑电平的一些概念............................................................................................... 10! y9 ~1 o1 [- ]- ?
3.2:常用的逻辑电平....................................................................................................... 11" Q) U' t/ b" }& G
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 11
* |% X. ]' O, M! e. D4、TTL 和CMOS 逻辑器件.................................................................................................... 13
7 l; v" b/ V; y9 y0 ?" A3 z5 l o4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13, ?7 q; s9 r1 D* X, o" M" S0 S
4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................135 T h2 n2 h4 i: r1 A/ o( e$ t
4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
! d1 ~, X, i) e4.4:包含特殊功能的逻辑器件....................................................................................... 14
2 o0 n* U3 N1 F0 ], {: I" c- v4.5:逻辑器件的使用指南............................................................................................... 15
2 P1 f/ o) t$ \ ?% R5、TTL、CMOS 器件的互连.................................................................................................. 164 i8 }$ ? g: I; m5 Q |
5.1:器件的互连总则.......................................................................................................16
' f, F! W/ ]2 Y! N. t, h5.2:5V TTL 门作驱动源..................................................................................................19
, g3 R: J$ [: k5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19# m7 i7 s2 M+ Q; Q
5.4:5V CMOS 门作驱动源................................................................................................ 19
" q7 _; ?8 B" T' y: j5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19" e6 ?. k, ?$ Q) S5 z" N5 z
6、ECL 器件的原理和特点................................................................................................... 20
7 q. Z; Z# D6 `: F. \( Z6.1:ECL 器件的原理........................................................................................................205 Q* } X8 ?& f% a
6.2:ECL 电路的特性........................................................................................................21
% b& ^0 Y* [' u8 O7 _6.3:ECL 器件的使用原则................................................................................................ 22
- s' p+ b+ ~3 \5 ?7 ?1 u' P7、GTL 器件的原理和特点................................................................................................... 23
( n- y( \* N( L. y. n7.1:GTL 器件的特点和电平............................................................................................ 23
) V; U6 k+ G3 G2 c" @6 y7.2:GTL 信号的PCB 设计................................................................................................ 243 v/ T) B5 Q% I8 P( u
7.3:GTL 信号的测试........................................................................................................252 C3 Q- `; t: Q. w+ Y( d$ L
7.4:GTL 信号的时序........................................................................................................25
3 i6 T% \5 \8 j! x' H8 HSTL 电平......................................................................................................................... 258 ^5 u) ?0 f# E0 r2 s. r
8.1 基本定义..................................................................................................................... 25
' E; r, Q ^; {4 \% V) U" C1.2 HSTL 分类.................................................................................................................... 265 y6 a4 J4 A. [) h @# O& { d
8.3 HSTL 特点及SSTL .....................................................................................................26/ G' K& x, N* J2 C& X; A* \2 I, p& s* l
9 PECL、LVPECL 电平........................................................................................................... 27
: b; C- B+ E9 x9 C: f7 e, C9.1:PECL/LVPECL 器件的原理和特点............................................................................27$ h9 j5 b4 E7 Y( j2 p' m6 h
9.2. PECL/LVPECL 电平输出结构................................................................................... 270 G. Y% @6 ]2 ]% H! D. `- n/ g
9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
# U4 v$ s ]: \1 i( e: A( J10 CML 电平......................................................................................................................... 30 g7 ^& f# Z! m! k
10.1. CML 接口输出结构............................................................................................... 30
z7 n+ G' Q! }6 o2 O9 A9 s10.2 CML 接口输入结构...................................................................................................30
: u+ m: Z& p6 e& u) ^10.3 CML 电平的输出门和输入门的特点: ....................................................................31
: x* ?; z9 l$ D2 k11. LVDS 器件的原理和特点.......................................................................................... 32
7 y# I6 K0 r7 V9 X11.1:LVDS 器件简介........................................................................................................32
0 H- I \1 j# E/ d11.2 LVDS 器件的工作原理.............................................................................................. 33. S& m% B) U; D/ J3 q4 y6 F/ h
11.3 LVDS 输入输出结构.................................................................................................33
& f7 O, N! i5 _) }; V; _11.4 LVDS 电平的特点...................................................................................................35
5 k) x, M* @! K12. CML LVPECL LVDS 简单比较及互连......................................................................... 355 |$ _2 U3 J- F/ i4 h
12.1 CML LVPECL LVDS 简单比较..............................................................................356 e* g4 I z; w5 O
12.2 CML LVPECL LVDS 的互连综述..........................................................................38! Q9 |0 ^7 Z' c( w! p
12.3 LVPECL 的互连........................................................................................................39
# ^+ S- S6 P* g' X0 x12.4 LVDS 的互连............................................................................................................44" V7 |- b4 ?* p( _
12.5 CML 的互连..............................................................................................................45
* R" ]7 p( C. b! s+ r% V附录:.................................................................................................................................... 479 A& E4 L6 O( p3 @' R5 y" M
附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 478 ?7 o- h/ r1 C6 ^
附录2. CMOS 门电路及其特点.................................................................................... 59
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