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1 逻辑电平的基本组成单元－三极管、MOS 管及其开关特性........................................... 51 K7 f$ S! L1 S9 \0 g: q4 X7 Z
1．1 半导体三极管及其开关特性..................................................................................... 5
9 U! L2 _. M( w( m+ \& i1．2 MOS 管的开关特性......................................................................................................7( U. u2 y- S% B$ u& {2 m
2、逻辑电平简介.................................................................................................................... 80 ]; L% D& s3 z1 }9 ? Q
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
' s# y: c* g5 B+ W: F2 X4 k3.1：逻辑电平的一些概念............................................................................................... 104 i1 H6 }- g# Y" A( a% H8 x7 p9 h
3.2：常用的逻辑电平....................................................................................................... 11) ~, t3 `" f: ?0 Z
3.3：TTL 和CMOS 的逻辑电平关系.................................................................................. 11$ b% h$ C" G* y2 x. K9 O
4、TTL 和CMOS 逻辑器件.................................................................................................... 13, Z& W2 T$ e. e3 N0 B
4.1：TTL 和CMOS 器件的功能分类.................................................................................. 13
' b' j7 B/ [) G4.2：TTL 和MOS 逻辑器件的工艺分类特点....................................................................13: P f, u0 ?: `& ~( Z' l
4.3：TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
3 N% a( [5 U: T5 F. E4.4：包含特殊功能的逻辑器件....................................................................................... 14; ?) D& J# ^( c
4.5：逻辑器件的使用指南............................................................................................... 15
! r9 U4 ]" ^3 a% @5、TTL、CMOS 器件的互连.................................................................................................. 16
& E5 S% o- Z6 P+ G" z; k% r( m5.1：器件的互连总则.......................................................................................................167 ^' Q- p+ I% x
5.2：5V TTL 门作驱动源..................................................................................................19
/ v4 t6 f, _2 G4 q9 s8 z0 E1 F/ {5.3：3.3V TTL/CMOS 门作驱动源..................................................................................... 19+ p& Q; y! D9 n# m
5.4：5V CMOS 门作驱动源................................................................................................ 196 ~/ O. {8 U6 \. s; c
5.5：2.5V CMOS 逻辑电平的互连.................................................................................... 19
! n0 U% L+ \8 k7 [% s9 a6、ECL 器件的原理和特点................................................................................................... 20( |" j* H5 v; d+ q( d; c
6.1：ECL 器件的原理........................................................................................................207 B8 |6 T9 b/ T
6.2：ECL 电路的特性........................................................................................................218 n( }" j2 N- _" f+ a
6.3：ECL 器件的使用原则................................................................................................ 22
: w- k4 Q. ]; g v( a5 V$ s( k; }7、GTL 器件的原理和特点................................................................................................... 23
0 b2 @ _3 H1 V- b( J7 z1 U7 W7.1：GTL 器件的特点和电平............................................................................................ 23. n+ B7 w9 y" g* D6 J6 o7 R4 m
7.2：GTL 信号的PCB 设计................................................................................................ 24
' v% G' D. ^3 _( e! h }2 a' z7.3：GTL 信号的测试........................................................................................................25! H& } |! z0 R! K( ?( t! c6 e
7.4：GTL 信号的时序........................................................................................................258 i: z/ D$ v$ e% A" ]
8 HSTL 电平......................................................................................................................... 25: x9 Y+ U2 u" Y( T% u/ V _
8.1 基本定义..................................................................................................................... 25
% y2 Y; G5 p' l0 q( x4 Z9 A2 |! n1.2 HSTL 分类.................................................................................................................... 26
$ q6 B7 z+ [ _3 I7 x# K1 e8 l. y8.3 HSTL 特点及SSTL .....................................................................................................26
- x8 M2 s1 C* Q. G1 J' y$ P; o- M4 f9 PECL、LVPECL 电平........................................................................................................... 27
# g+ Q- B) `2 `2 E1 B9.1：PECL/LVPECL 器件的原理和特点............................................................................27
- j; z9 b. x4 V0 B' b, [9.2. PECL/LVPECL 电平输出结构................................................................................... 27
$ x! b7 Z3 M, O" @# \9.3 PECL/LVPECL 信号的输入输出门特点： ..................................................................29
7 }( G) [3 y3 b& W: m) V7 z- O10 CML 电平......................................................................................................................... 30, V0 i: T. P$ J/ R0 l
10.1. CML 接口输出结构............................................................................................... 30
( N+ f4 y, I4 k10.2 CML 接口输入结构...................................................................................................30" V, w, {) E" }( b' t
10.3 CML 电平的输出门和输入门的特点： ....................................................................315 n, v. i0 V5 i% H* v
11. LVDS 器件的原理和特点.......................................................................................... 32& \9 O9 `, [# X: x
11.1：LVDS 器件简介........................................................................................................32
# C0 m: D9 p0 \+ b/ Z11.2 LVDS 器件的工作原理.............................................................................................. 33
4 [: b& ~1 r# `- p. M9 L11.3 LVDS 输入输出结构.................................................................................................337 R n5 z2 X9 K- h5 n" \& \
11.4 LVDS 电平的特点...................................................................................................357 U( ]3 e; g4 h1 g- W4 h* |
12. CML LVPECL LVDS 简单比较及互连......................................................................... 35" q% V1 D" a% k: F5 h
12.1 CML LVPECL LVDS 简单比较..............................................................................35$ B+ {/ _4 \: o1 J3 o4 Y' w7 e# q! _
12.2 CML LVPECL LVDS 的互连综述..........................................................................38! Q/ V( D4 H( k5 Q, D
12.3 LVPECL 的互连........................................................................................................39. W' S$ ~8 f; m# n, u3 q
12.4 LVDS 的互连............................................................................................................44
& n! u" l9 B! E- v- W12.5 CML 的互连..............................................................................................................459 P. j( K8 J( {0 l' |; E. f% k% _
附录：.................................................................................................................................... 47
9 _& C+ e0 ]& Z( i2 H附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47* T& t0 O! _. E! f: V
附录2． CMOS 门电路及其特点.................................................................................... 59
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发表于 2017-11-13 16:15
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