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1 逻辑电平的基本组成单元－三极管、MOS 管及其开关特性........................................... 5$ K/ f( r( D) j" X$ d! h- [' W
1．1 半导体三极管及其开关特性..................................................................................... 5
H# y( G0 Z" Y: X/ O Y G! B1．2 MOS 管的开关特性......................................................................................................7
) O0 U/ l/ F: ^/ X2、逻辑电平简介.................................................................................................................... 82 C$ H* n8 `8 W2 A
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 108 G) s* r/ H; r( d. j0 w2 w
3.1：逻辑电平的一些概念............................................................................................... 10; A/ w$ ~! R! }5 d% `7 W g# |
3.2：常用的逻辑电平....................................................................................................... 11' p" j0 |1 d5 ?& a( e1 V0 a$ i
3.3：TTL 和CMOS 的逻辑电平关系.................................................................................. 11
$ g7 I+ `+ x% i* \6 c/ B1 {4、TTL 和CMOS 逻辑器件.................................................................................................... 13
/ t7 s4 K- q- S, Q# s, A4.1：TTL 和CMOS 器件的功能分类.................................................................................. 13
& O1 i5 O/ W: k) R4.2：TTL 和MOS 逻辑器件的工艺分类特点....................................................................13/ i% n" o1 s( ]' W" ]; G% v5 ^- N
4.3：TTL 和CMOS 逻辑器件的电平分类特点..................................................................13% W# ]; E/ g. e; v
4.4：包含特殊功能的逻辑器件....................................................................................... 14; l7 i1 L/ x ?2 ?9 c. k% D: a5 @. p: f1 b
4.5：逻辑器件的使用指南............................................................................................... 15
! c1 F4 I7 U% c5、TTL、CMOS 器件的互连.................................................................................................. 16
1 k6 Z/ w" v/ r/ G' @) b7 y6 ]5.1：器件的互连总则.......................................................................................................16
[$ G, K& _" N# H s( B5.2：5V TTL 门作驱动源..................................................................................................19$ F K8 H( ]; E4 k7 y: w
5.3：3.3V TTL/CMOS 门作驱动源..................................................................................... 19
/ k b6 q* s; h5.4：5V CMOS 门作驱动源................................................................................................ 19
) j5 j4 l% a: w, Y( X( I1 Q" e5 p" r5.5：2.5V CMOS 逻辑电平的互连.................................................................................... 19$ X5 i7 _! z# v: D
6、ECL 器件的原理和特点................................................................................................... 20
E3 B& C+ K5 t, O' d: |* z6.1：ECL 器件的原理........................................................................................................20
E5 y1 _1 M& t, {$ P$ k5 V3 t6.2：ECL 电路的特性........................................................................................................21
5 c/ U# [) S. J" c0 T9 G6.3：ECL 器件的使用原则................................................................................................ 22
% w( p3 ]7 J [6 G7、GTL 器件的原理和特点................................................................................................... 23: x2 Q3 P- M- S
7.1：GTL 器件的特点和电平............................................................................................ 23
, L; U5 f, E4 F2 u, H7.2：GTL 信号的PCB 设计................................................................................................ 24
& p# \0 P+ {0 L7.3：GTL 信号的测试........................................................................................................25
( E: _) D9 K, T5 u! p+ c2 b8 G7.4：GTL 信号的时序........................................................................................................256 j5 l3 q" E7 L
8 HSTL 电平......................................................................................................................... 25* M7 L7 `' u2 i9 Z# X9 ?0 h; {5 @% {) a
8.1 基本定义..................................................................................................................... 25
4 e& g8 Z0 D% L2 }( K1.2 HSTL 分类.................................................................................................................... 26
4 T2 g' n' N" a. f$ T8.3 HSTL 特点及SSTL .....................................................................................................26
. @6 W1 k5 o1 G9 PECL、LVPECL 电平........................................................................................................... 271 }7 i) d# ]: `+ W' q
9.1：PECL/LVPECL 器件的原理和特点............................................................................27" v f* A" P$ f$ ~; p
9.2. PECL/LVPECL 电平输出结构................................................................................... 27) r9 z f* }; j! l- Y" W
9.3 PECL/LVPECL 信号的输入输出门特点： ..................................................................294 @4 ?/ U4 h- g- X0 [7 F8 x/ |- P- Q, R3 j
10 CML 电平......................................................................................................................... 30
3 I, H! H7 I0 W g5 M+ ^; ]( N10.1. CML 接口输出结构............................................................................................... 30
* {4 q2 G) Y/ D; Y( {( P+ q+ C7 K/ y10.2 CML 接口输入结构...................................................................................................30' l& e6 v" i. _- V+ U# C* K4 }
10.3 CML 电平的输出门和输入门的特点： ....................................................................31
# a- `( W L2 r& v) f+ ?11. LVDS 器件的原理和特点.......................................................................................... 32& v' c& A0 Y: G. U7 |/ `9 j
11.1：LVDS 器件简介........................................................................................................32
4 I8 Y! F! \# [& F- S% B11.2 LVDS 器件的工作原理.............................................................................................. 33
+ d4 l, z1 h& ?) ?& q11.3 LVDS 输入输出结构.................................................................................................33
8 k% r! w0 M8 r+ n$ N11.4 LVDS 电平的特点...................................................................................................35; C( K" \! l( L. k
12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
7 f( O+ ]9 O+ l/ l8 D12.1 CML LVPECL LVDS 简单比较..............................................................................35. ^, U T! z7 R- _
12.2 CML LVPECL LVDS 的互连综述..........................................................................38
5 v; N9 i* V2 Q+ y% F+ o0 p8 b12.3 LVPECL 的互连........................................................................................................39
* E/ ~0 m+ H u7 Z12.4 LVDS 的互连............................................................................................................44
* F4 J/ ]! W1 C" R! L12.5 CML 的互连..............................................................................................................45
# ]9 R, T6 s; c' x% L% o附录：.................................................................................................................................... 47
8 Y0 _( @8 N o3 D* {. y附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47
- E+ z' t0 ^. Z附录2． CMOS 门电路及其特点.................................................................................... 59
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发表于 2017-11-13 16:15
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