现发现客户要求 Via Fill: Board uses VIP technology.All laser vias on SMT lands to be filled, planarized and plated with non-conductive via fill per IPC-6016./ B" G, N, V c1 ]0 m
请问VIP technology是什么技术?1 E- r- t+ H* P% W
后面用非导电的塞孔可以用阻焊么?还是用树脂? |; G% R2 n' w& J
请高人解答!!!