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本帖最后由 Cadence_CPG_Mkt 于 2018-5-31 23:03 编辑 ! V7 |) X5 U0 U
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6 \& D2 v: u6 {* W) {' R/ r) i2018 Cadence - PCB, IC封装设计、仿真分析 - 全国技术巡回交流展圆满落幕，相信北京、深圳、上海、西安和成都的粉丝们都是收获满满~
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现场演讲资料已开放免费下载↓↓↓ ; X" d) m& n* I5 B0 V' V( h* }
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Track 1: Allegro PCB and IC Package Allegro Real-Time Co-Work and In-Design DFM Check High-Speed Optimization: Visual Results for Analysis and DRCs Allegro System Design Authoring Routing Vision: New Routing Check Tools Co-Design Using OrbitIO™ Interconnect Designer: Die-PKG-PCB Interconnect Planning and Optimization Enterprise ECAD/MCAD-Collaboration Environment
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- H' H/ w/ z" p3 JTrack 2: Sigrity Solutions An Innovative Methodology for PDN Design and Analysis Using Allegro and Sigrity Technologies Responding to Rapidly Evolving Thermal Challenges: Including but Beyond Conventional Approaches Performance Analysis for Next-Generation PCIe® Interface Designing Next-Generation DDR Interfaces Today Using Advanced IBIS-AMI Modeling Technology to Facilitate High-Speed Serial Link and Parallel Bus SI Signoff Simulating High-Frequency Electromagnetic Fields in Full 3D
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( }; r. a8 T* i \* i+ c3 Q欢迎您的评论！ 您可以通过PCB_marketing_China@cadence.com联系我们，非常感谢您的关注以及宝贵意见。 % y+ [4 U, X h, i7 r
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发表于 2018-5-31 23:02
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