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本帖最后由 Cadence_CPG_Mkt 于 2018-5-31 23:03 编辑
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; d/ l( Z; I, k; ?# g0 l m: S$ U2018 Cadence - PCB, IC封装设计、仿真分析 - 全国技术巡回交流展圆满落幕，相信北京、深圳、上海、西安和成都的粉丝们都是收获满满~
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现场演讲资料已开放免费下载↓↓↓
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演讲资料大纲：
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Track 1: Allegro PCB and IC Package Allegro Real-Time Co-Work and In-Design DFM Check High-Speed Optimization: Visual Results for Analysis and DRCs Allegro System Design Authoring Routing Vision: New Routing Check Tools Co-Design Using OrbitIO™ Interconnect Designer: Die-PKG-PCB Interconnect Planning and Optimization Enterprise ECAD/MCAD-Collaboration Environment ! a- H0 T) u% u
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Track 2: Sigrity Solutions An Innovative Methodology for PDN Design and Analysis Using Allegro and Sigrity Technologies Responding to Rapidly Evolving Thermal Challenges: Including but Beyond Conventional Approaches Performance Analysis for Next-Generation PCIe® Interface Designing Next-Generation DDR Interfaces Today Using Advanced IBIS-AMI Modeling Technology to Facilitate High-Speed Serial Link and Parallel Bus SI Signoff Simulating High-Frequency Electromagnetic Fields in Full 3D , m7 U! Y/ N+ U9 I/ i% Y
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欢迎您的评论！ 您可以通过PCB_marketing_China@cadence.com联系我们，非常感谢您的关注以及宝贵意见。
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发表于 2018-5-31 23:02
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