最新拿到一家IC厂家的推荐设计文件 n; f5 r0 N. D+ Z发现里面的大封装电容的两个焊盘全部贴的很近,1206封装的电容,焊盘间距大概只有10mil左右。 : {& B4 z( \8 H" O% ]3 A" cThe +V and GND traces between the capacitors should be as close to each other as possible.so that the gap between the two nodes is minimized. 3 _0 T& O# ]" z: {) ] 7 l# i$ V: {8 l* p* U1 ^这样处理的意义何在? . @+ s j( ]8 P3 v r$ O; W- s' y减小ESR吗?