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IPC-2252射频/微波电路板设计指南1 |8 E$ A) F, f6 B1 f+ o. M) ]/ o
IPC 2252射频微波电路板设计指南.pdf
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| 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发2 Y6 n S4 p3 I" h+ ?
目录) o8 J1 U# o: j# n
1 概述(GENERAL)................................................................................................................................ 1
5 S3 s' o# C) x0 L5 ^; h. T% s1.1 目的(Purpose)........................................................................................................................... 1+ X* P) s- Y2 r9 T. V9 H
1.2 范围(Scope).............................................................................................................................. 1" l# `) {& n9 ^5 o
1.3 术语和定义(Terms and Definitions)......................................................................................... 1
% L2 R, L9 e3 J5 U; r2 应用文档(Application Documents) ..................................................................................................... 35 v8 S! `4 z2 o; ~( z! [ k
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3; S8 a# i, V; o% z9 f& U5 ]% A
2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 31 H# z. h8 Z5 ]2 E# l8 Y& u
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3
^- ]; [6 C# E' O. h- @! p2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
3 o5 z5 G( k9 Z( E/ h2.5 国际标准化组织(International Organization for Standardization)........................................... 3" R+ V) C9 Q9 q; J) Z: f7 M
2.6 参考文档(Reference Information) ............................................................................................ 3
$ g6 s9 ]. ~7 W( b8 R: B3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
0 l. q2 y, k1 k+ q3.1 最初输入(Initial Input).............................................................................................................. 3' q# E: i! y% I/ ~- `! @
3.2 设计方案(Design Options)........................................................................................................ 3
* }1 u, D r' R3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3; q0 z5 c/ o' l
3.4 电气设计(Electrical Design)..................................................................................................... 3
+ }6 `& x/ X0 B3 G' d4 W: _1 @3.5 机械设计(Mechanical Design).................................................................................................. 3
& A+ P5 \9 q% O: D3.6 设计预审(Preliminary Design Review) .................................................................................... 3
; Y/ |5 G+ S' {" y3.7 电路实验板(Breadboard).......................................................................................................... 39 H% |5 g" @! }- b8 y; `0 T. q% p. V+ G
3.8 原型(Prototype)........................................................................................................................ 3
+ O, N% t, i4 _0 I; c) B3.9 文件编制(Documentation)........................................................................................................ 3
4 }. Q! R1 Z# [) f0 G1 w# G3.10 最终设计评审(Final Design Review)..................................................................................... 3
: f* h! [0 X' R1 p- M$ b6 p4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5& I/ w; `7 [7 d# ?
4.1 产品特性列表(Design Features Listing) .................................................................................. 53 z$ D% n9 G: s8 s/ S% j
4.2 原图(Master Drawing) .............................................................................................................. 5% [' ]; V# u: h) c, |
4.3 原始图形(Master Pattern) ......................................................................................................... 5
9 c2 w- }& @$ Z/ a7 S2 }5 材料(MATERIALS)............................................................................................................................ 5
2 R* |; T1 f+ \0 g( m6 b; L5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
4 P+ e0 R0 ^, J' S5.1.1 基材选择(Substrate Selection)....................................................................................... 5
( p' j4 o1 ^6 g: c/ a0 a/ S- y5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5
. Z: i9 A. b3 b7 M, u$ T) F0 V5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6! s7 x0 v/ y7 M; \6 T2 p
5.1.1.3 厚度(Thickness) .................................................................................................. 6
& D. X3 p% \# O: O$ W/ p4 V7 t5.1.1.4 环境(Environment).............................................................................................. 7
8 H9 v9 r( {: i2 G+ o8 s; [5.1.1.5 成本(Cost) ........................................................................................................... 70 Y1 K! M1 v6 \& @
5.1.1.6 供应商(Supplier) ................................................................................................. 75 W2 p; ^7 k/ [! Y5 L
5.2 粘接膜(Bonding Films)............................................................................................................. 7/ Q; i: T. _* b) r+ R0 U
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7: [) v& v) l( _# `$ d! \# I
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5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7
/ v# m& V- J# j9 j. G( _/ }5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8" X T% g7 X9 k! M' x
5.3 金属(Metals)............................................................................................................................. 8
1 R3 @9 O+ j& p) H8 X' n5.3.1 金属覆层(Cladding) ....................................................................................................... 8/ u" D. H& P. ~5 _3 G- y$ C4 N2 Y
5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8" ?5 \ Q& X" {# y i
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8
7 }) m9 O ~. m% m# q5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
( f. v# Y' d4 n; }; ?5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9
d- @2 l- r- \7 ]& _$ _3 @5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 91 c# g0 N% n0 w+ O& a' z
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
3 P" G6 C* U3 |7 X* W: g4 z5.3.2.4 镀金(Gold)........................................................................................................... 9
# g# Z/ w0 N3 t" ]$ Q4 t4 r, P5.3.2.5 镀银(Silver) ......................................................................................................... 9+ T+ ^( H4 `* p
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
: N5 G; {& @9 L6 l4 D4 {5.3.2.7 焊料镀层Solder Coating...................................................................................... 9
6 a/ H9 x' b1 g8 j( r1 @6 P/ j5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9/ @" Y" Z: Z1 I: u/ k# A. G
5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9! T0 W' l; u$ w3 Q1 |0 p
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 99 U9 F5 _: E$ t1 [7 x- `
5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
; R8 J# G1 Q: [/ ~+ D' M* k" [5.4 仿型涂层(Conformal Coating)................................................................................................ 104 ^ c) j) \& g" y5 E1 z4 H3 [# a. y
5.4.1 一般注意事项(General Caution).................................................................................. 10
9 s, e; |8 B; q0 X6 I6 a5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10
3 i5 x2 F$ f) A" w# J% H6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10
; [2 ?$ I8 ]6 {* h- b2 U9 ]" a0 X+ x6.1 带状线(Stripline) ..................................................................................................................... 11. _! Q! c# y& X0 M9 O: T# D
6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
& J. T! }8 @' Q. ~$ N* y6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11- y4 G, Z$ b; h, s# u/ }3 F
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 128 C }5 `" h6 Q/ K! d: ?
6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 120 f- `3 |, ?: ^
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12. c t; M4 _) f( s- Z$ F, h) `
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12
/ P0 @8 _3 R6 P' S8 B. M6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13
p8 @2 O0 g0 V: A0 R6.3 微带线(Microstrip) .................................................................................................................. 13
: W7 b0 o( R1 M' o |9 e6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective9 g1 f, H' H8 _5 \& a& k! O! E
Permittivity f Microstrip)................................................................................................................ 136 W0 h" C; W+ L# a0 o
6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15
# U7 s* D9 m* q6 h; @- |7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15. ] J8 `" Z/ n# @) G2 X- `$ M
7.1 机械特性(Machined Features) ................................................................................................ 15
2 V1 y- C0 C4 n4 B G7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15 O3 {7 E1 S" n2 k. w
7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16" {9 R& G1 U# A* z6 J
7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 173 b9 J" Y: j! J* s, \0 {# z
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7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
: B; m: P/ @- }7 w5 R# n9 }7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18" B2 j1 ]7 K1 ~, J( r6 H
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18% C7 u' _7 W- a9 ]
7.1.6 外形(Periphery)............................................................................................................ 18& D5 n0 H$ e0 O. |) T" |
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18 r+ ~& X0 V6 L% h( Y) Z2 P( F
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 182 j+ O) ]; Q! Y1 g6 x/ p( c
7.2 出图(Imaging) ......................................................................................................................... 186 k5 w6 ~! J' j4 }9 C' \8 X7 u- ?) t+ X
7.2.1 底片(Artwork).............................................................................................................. 19
1 y: D, j/ A; I& o; _7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 194 w, W& C; }! A6 m' l r$ ^
7.2.3 环孔(Annular Rings) .................................................................................................... 19
6 n2 o. ]1 F m, N$ X5 T; w7.3 PTFE活化(PTFE Activation) ................................................................................................... 19* Z. Z5 F3 s1 I: o8 M6 [
7.4 金属化(Metallization) ............................................................................................................. 19 S+ k1 `+ j F" {6 }, Z
7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19+ c6 s- E: O8 ?4 r3 ]
7.4.2 镀铜(Copper Plating) ................................................................................................... 19
2 m. g7 \, Y6 R( B1 {; k1 I7.5 蚀刻(Etching) .......................................................................................................................... 20
) Q" O1 | _! J1 ~9 d% c* F, c( j( Q, W7.6 粘接(Bonding)........................................................................................................................ 20
* a: C0 S! b0 J7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21' F5 x; K1 w, G- S+ }6 ~: z
7.8 测试(Testing).......................................................................................................................... 21
" `% D D1 P; E2 v& N8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
% x( V7 k6 X0 c3 }8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21( s4 r# _8 Z% q! ^8 F
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
- {/ x) h* ^) Z C% U8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21 V, J* ~7 t& Q$ x- p! k' U7 x
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
4 i2 e, y* v6 M4 N8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22! i; W! b3 u* B
8.1.4 软钎焊（Soldering）................................................................................................... 22
+ i! Q# A( k: N- g" X4 V8.1.4.1 温度警示（Temperature Caution）.................................................................. 22* x- p5 ~% j! Y( M' { `
8.1.5 直接粘结（Direct Bonding）...................................................................................... 22 r6 z6 V6 M2 f9 C3 \ R6 G
8.2 连接器安装（Connector Attachment） ................................................................................. 22
. t9 s; x0 L# G' \; R9 `5 \8.2.1 边缘连接器（Edge Connector） ................................................................................ 222 D6 t8 m& L2 e+ M0 D* y) T6 H
8.2.2 表面连接器（Surface Connector） ............................................................................ 23, C- V6 @$ |9 N3 O0 p
8.3 器件安装（Device Attachment）........................................................................................... 23
. E# C/ j& ^& v% z8 ]8.3.1 焊接连接（Welded Bonds）....................................................................................... 23' N( G( E4 @8 H$ S" x
8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 231 S/ @5 i9 j0 ~2 p5 r& |
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23; I6 {* Q2 g7 M6 t7 l& S7 W' t
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 242 g$ u: s; {8 `. u0 u
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
+ e) p ]9 Y& D8.3.1.5 软钎焊（Soldering）........................................................................................ 24
& R& C W. J( Q* ^& ]& Q6 a8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
7 q1 v9 c* W4 I& e" S8 v% c8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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' c. w! k2 k6 _" |1 U8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24! G g7 L; b: I7 i, H, V
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
/ @! T- Y6 J: [" K8.3.3 器件安装（Device Attachment）................................................................................ 24
' Z' [, X" E) v a6 h, X( O7 o! T& N8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24. f$ p" i" u% N% ?- |
8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
4 ^8 }2 ?3 I1 M: s1 i8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25, V, P& O: @/ i
8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25- Z7 k. Y& S# N- F
8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
, l, l; D+ F8 Y! z. ^% y% u9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25
( V' q) P% Z) Z9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
% l4 g, s2 c! _+ ^1 c3 ?3 ?9.2 可靠性（Reliability）.............................................................................................................
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发表于 2010-11-30 12:42
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