|
EDA365欢迎您!
您需要 登录 才可以下载或查看,没有帐号?注册
x
本帖最后由 alexwang 于 2018-7-2 14:33 编辑 & `+ _1 N A7 c
5 U- L5 C4 T7 |作者----书名----年度 1) Steven Sandler: Power Integrity. 2014.5 \5 I9 H! l0 s/ |/ R) K* R
# e% r( a0 C- F& ^& G$ y5 t: V. ^7 F
+ [! Y7 K- d8 E* q |2)Douglas Brooks: PCB Currents: How TheyFlow, How They React. 2013 Signal Integrity Issues and Printed CircuitBoard Design. 2012.
8 p& c' B: H! c- R6 F) A' ^ f
t q3 Z: r- u4 }
# q8 S# p T, o! A/ n, T) m
1 h8 f2 l) m) {; y3 u9 o
' x. [& x; A* `$ v( @
& z. M+ o3 ]( k: L" |1 o+ n3)Christophe Basso: Designing Control Loopsfor Linear and Switching Power Supplies: A Tutorial Guide.2012
2 V M; k D6 U+ D
% W0 d' ?' {$ L- b8 k4 v + }+ V F. {; C8 n% ]2 l9 q
7 \- h, D: y/ |1 z/ h
4)Sanjaya Maniktala: Switching Power SuppliesA-Z 2012
6 O/ ]; ^( K- i9 X! g: s6 L" g& h
$ ?: J6 _7 Q3 e1 s( z" u7 I6 {
* Y- @9 A. b- c* S" h( {0 e* ]" r6 X$ j$ K
5)ErPing Li: Electrical Modeling and Designfor 3D System Integration: 3D Integrated Circuits and Packaging, SignalIntegrity, Power Integrity and EMC. 2012
5 H/ V/ r$ V% \, h% E
w7 X3 e/ \, H. {/ G4 g
3 |* E1 x* S D1 y8 W- _) ~
% s; }1 D- S! E7 n
6)Renatas Jakushoka, et al.: PowerDistribution Networks with On-Chip Decoupling Capacitors 2011
5 i% a; U3 m" M! p
5 L0 m1 B; J$ h
( e1 ~4 G: A7 _1 m- d9 M$ g
( T, U4 L5 q+ l7)Dan Oh, Chuck Yuan: High-Speed Signaling:Jitter Modeling, Analysis, and Budgeting. 2011/ t- U7 H- p9 W3 U
) m4 V7 M+ O2 B' C' j
$ V( }9 U, L6 F' ]: W
6 Q8 c1 S$ v/ a, U
8)Bob Dobkin, Jim Williams: Analog CircuitDesign.2011
, h' ]; ?1 V# T5 D; F5 Y
, q; v, Z& G8 L
0 w. Q$ P5 p. f
! \! y3 ~9 ]6 L- A, `( D5 s# e9)Raj Nair, Donald Bennett: Power IntegrityAnalysis and Management for Integrated Circuits. 2010
# H" b& H3 ?% L8 \/ O
0 ^ T3 u1 y0 o0 s. e { R
" o" ^7 X1 I: Y [6 m8 G: |9 w/ n中文译本
# x& {9 \9 I8 @" U- m5 v7 L4 y
. @& ?. d3 }: z) a: v* t5 N+ q( d1 W, q+ C6 u
( M9 m3 \7 i" U0 Y# E/ b9 O( R7 Q10)Vishram Pandit: Power Integrity for I/OInterfaces: With Signal Integrity/ Power Integrity Co-Design. 2010+ K- w/ o7 q7 L& x1 X) I6 H w4 F
2 Z$ |' q7 J& F2 j: r
5 C9 ], Y* Q$ e% ?5 `$ B, _, q) {
11)Andrzej Trzynadlowski: Modern PowerElectronics. 2010
6 n N$ m {3 A, L2 t# Z
# i5 `4 f8 n+ Y* g
0 p& W b. [3 h/ W* l
B2 v! t1 K* x" ~/ k d9 J, X5 Y- A12)Jose Moreira, Hubert Werkmann: AnEngineer's Guide to Automated Testing of High-Speed Interfaces. 2010
3 e. T$ E! i# D: L c1 a
# c5 V: q: M& L" ~9 A; @, _3 z) C
j2 f; l! u( _, M! w13)Joffe, Lock: Grounds for Grounding. 2010: R% E) H1 y: p$ s
0 \+ p' k8 g4 V0 D$ l* j* W$ _ # \) g" F: p. P$ N V" Q2 p
; T, j. G& `, w14)Paul G. Huray: The Foundations of SignalIntegrity. 2010
6 l T: I# z! x/ i: b
' z1 o! f. Y, ?7 o2 q
, s* x! U+ z# Y# R& d- K4 ^
& q' k) @: n9 m15)Henry W Ott: Electromagnetic CompatibilityEngineering. 2009
- E& s! t& B& y* L" _/ z
, m. x6 ^" L+ V R, E: m; d1 Z; m" C u
- W4 F) C7 t, k ?# h& T16)Stephen Hall, Howard Heck: Advanced SignalIntegrity for High-Speed Digital Designs. 2009
8 C9 h ?8 U; x4 b
h+ K" @0 ?8 F5 y1 h: y. b8 p
" F& H5 u6 v( w T% g8 M% Z8 B1 v
中文译本
( V1 Z7 e4 G$ K
; u+ t9 T. m5 B9 j) |- g
6 D) ^+ M' h* { A6 Z4 R2 Z5 s g, O7 T3 U, s& k
17)Mike Resso, Eric Bogatin: Signal IntegrityCharacterization Techniques. 20096 X) `" H! E' @. e( O: ]
n4 s: X/ l6 ~$ \8 V7 B& J: c+ N. z
: [( @6 f# U" h" l! n7 o/ V
; D' ~" [, p# o5 b% M, u
18)Vikas Shukla: Signal Integrity for PCBDesigners. 2009
$ E% _3 I# M3 B% q/ {中文译本
! W8 ?& F& U2 B, }
/ L! L& N' o4 \- s3 i- }6 C: x: b$ ?) D, T+ L
+ f, X/ Z6 ~3 l% q) _; W# a. P o( m4 \) n$ F+ y( ? R
' g9 d( p( s. p. v* Y
: z X3 u/ b* ~ |
评分
-
查看全部评分
|