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本帖最后由 dbit 于 2011-7-16 19:32 编辑 ; J+ w* r( F( @# v9 D4 K
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所有计算依据:IPC-2221标准制定;) e3 H# R* {3 ]. }
IPC-2221标准描述:是由IPC组织制定的关于PCB设计的通用标准,英文名为:+ f$ y4 j( h2 E5 Q% ?
Generic Standard on Printed Board Design! T1 d" | H3 e
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trace width calc
- C$ W v) }0 E2 C) s$ }" D2 [Area[mils^2] = (Current[Amps]/(k*(Temp_Rise[deg. C])^b))^(1/c)
# v8 Y! o5 d9 J$ a5 v# T4 F" S- |0 kThen, the Width is calculated: 3 _9 B" q5 @2 q+ |- @4 p8 K
Width[mils] = Area[mils^2]/(Thickness[oz]*1.378[mils/oz]) 8 w; i+ ~' s* U" Q3 R/ }
For IPC-2221 internal layers: k = 0.024, b = 0.44, c = 0.725
7 U" U$ K. F BFor IPC-2221 external layers: k = 0.048, b = 0.44, c = 0.725 5 G# `, Q- F7 }1 O$ p
where k, b, and c are constants resulting from curve fitting to the IPC-2221 curves
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' E D. Q2 i2 d0 ~PCB VIA calculator
' t$ O% P7 @) CResistance = Resistivity*Length/Area 8 E5 |# l; S; Q, g1 Q
Area = pi*(Inner_dia + Plating_thk)*Plating_thk
: ~$ X0 Q Y+ `* @; \/ ?! dResistivity = 1.9E-6 Ohm-cm (plated copper) " J, }6 C: O* b- M Z& O
(plated copper is much more resistive than pure copper)
8 M1 T/ K1 {) T2 v7 pCopper Thermal_Resistivity = 0.249 cm-K/W (at 300K) . ^3 E* S$ @% D% Z. o7 q
Est_Ampacity [Amps] = k*(Temp_Rise [deg C])^b*(Area [mils^2])^c & Q/ c# o; ]( @% R# Z* e
For IPC-2221 external layers: k = 0.048, b = 0.44, c = 0.725
2 B" Z' b7 a" N9 d$ ]( ~4 d我做的一个xls方式的计算式,可以算电流的。
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VIA trace IPC-2221.zip
(2.94 KB, 下载次数: 505)
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补充内容 (2011-10-7 16:39):
7 r1 v- g3 z3 d6 a公式有修正,详见31#8 q/ E, u* k6 c
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补充内容 (2011-10-7 16:44):2 j( o y1 Q4 H. \; M
本人目前等级有限,不能直接修改这个附件,请大家到31#去下载,谢谢。另外如果管理员有看到的话,可否帮忙去掉这个附件,把31#的附件放在这,并加注说明。 |
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