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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
(1.51 MB, 下载次数: 434)
& E6 D6 i5 ^, @% [ | 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发; f5 V7 Q- N4 A6 g) M
目录% [2 a1 J% V1 q- Q& f
1 概述(GENERAL)................................................................................................................................ 1
, ]( l9 e8 V; f1.1 目的(Purpose)........................................................................................................................... 1
1 f D, o1 m' h: p5 h& e4 J- @1.2 范围(Scope).............................................................................................................................. 1$ Z2 w# d/ Q* Z* Z }6 K& @7 r# u
1.3 术语和定义(Terms and Definitions)......................................................................................... 1* }: g8 ]$ t4 j* N, V0 }& B- ^
2 应用文档(Application Documents) ..................................................................................................... 3" ]! j4 L$ t) z0 X; e
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
5 E+ a4 `2 S. @5 M2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3
5 } ?/ w) |# A; ^0 [, h& Y2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3( |7 R. g2 k. p* Z: M' S/ O, Y9 B
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
5 q# M" {& z$ |% |! Y8 Q% Q2.5 国际标准化组织(International Organization for Standardization)........................................... 39 P5 Y# e: ]6 ?
2.6 参考文档(Reference Information) ............................................................................................ 3
0 q) `* a5 k5 A1 z3 M! Y/ \# F" F3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3 C/ F) G$ S! b5 @# f/ l
3.1 最初输入(Initial Input).............................................................................................................. 37 o8 d0 J. W0 i1 I2 n6 `- L
3.2 设计方案(Design Options)........................................................................................................ 33 |2 S, Y# h N5 u5 T: p
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 39 _6 d3 G0 O( H) y# M2 F
3.4 电气设计(Electrical Design)..................................................................................................... 37 v! o8 b, v% {6 y$ @4 \' h' S
3.5 机械设计(Mechanical Design).................................................................................................. 32 V/ w; K1 Y/ m7 c% V& W' F, K
3.6 设计预审(Preliminary Design Review) .................................................................................... 3) _! a& ^) J3 a7 f2 t7 U
3.7 电路实验板(Breadboard).......................................................................................................... 3, F D& s" Y% T4 V
3.8 原型(Prototype)........................................................................................................................ 3( P3 f% H" P/ Y! K
3.9 文件编制(Documentation)........................................................................................................ 35 k9 @3 L! j3 x' e: d
3.10 最终设计评审(Final Design Review)..................................................................................... 3+ i0 k7 o! @- {3 B
4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 59 M! T3 E( U+ D
4.1 产品特性列表(Design Features Listing) .................................................................................. 5
) d- Y0 h' C$ C- \( D4.2 原图(Master Drawing) .............................................................................................................. 5
* m* W2 K4 `- k2 ]6 D5 e" P/ i4.3 原始图形(Master Pattern) ......................................................................................................... 5
5 j( q% z6 c- x. J! X5 材料(MATERIALS)............................................................................................................................ 5
) ? P# s1 j- S) ~5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
5 P: q+ O- ~2 E2 e9 h/ I5.1.1 基材选择(Substrate Selection)....................................................................................... 5/ _" Z/ t6 T% y' V5 W
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5
/ K1 }4 B; \; B3 Q5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
' R1 O, ^! q5 k: z5.1.1.3 厚度(Thickness) .................................................................................................. 6
4 S% V) k0 U3 m( |5.1.1.4 环境(Environment).............................................................................................. 7
! \- q; o$ f( o2 Q9 _8 [5.1.1.5 成本(Cost) ........................................................................................................... 7
j3 @( H7 _9 R- Y5.1.1.6 供应商(Supplier) ................................................................................................. 76 s" [: d) y; S/ _# @% F) i$ s/ I2 O5 f0 j
5.2 粘接膜(Bonding Films)............................................................................................................. 7
- h' q/ Q9 T' d5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7
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; g2 d. \/ e* t4 [/ d, i& i' |% ]4 A& BJuly 20021 g$ D% j3 w% b$ t& h4 i
5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 75 @+ f0 w8 H0 w4 s1 x
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8
4 ?+ c- W* O7 }; I5.3 金属(Metals)............................................................................................................................. 8
/ J0 R2 Y! a% B4 g5.3.1 金属覆层(Cladding) ....................................................................................................... 8
# ]# E" ^* ` D' \: J- j5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 83 X6 a' Q( u1 F" p; ^* V4 x
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 85 a) ]# ~6 l" A7 x
5.3.2 金属镀层(Metal Plating) ................................................................................................ 8& d$ Y- E" T: k# j- ^/ W
5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 94 D) A4 K# x; o) @1 a; ~
5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9+ t4 N* y$ |" A: X; {& ~ W8 ~
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
" _7 O' y. [6 q2 M" T" Y5.3.2.4 镀金(Gold)........................................................................................................... 9# l. v: B- ^& u4 l9 v
5.3.2.5 镀银(Silver) ......................................................................................................... 9
+ n' U0 G: Y5 p! x* d5 o5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
2 ^# l7 K: c# y" Z5 B& f5.3.2.7 焊料镀层Solder Coating...................................................................................... 96 Z# V( ^2 ]0 F
5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9, x$ x0 ~) Z) ?9 U# J
5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9
) Y. {8 B" j3 p5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 96 A$ {' E0 B; U. c. Z0 I, v
5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
7 d" \! [8 L# L& a5 A8 I5.4 仿型涂层(Conformal Coating)................................................................................................ 10/ d) z0 u; M6 `! d: [4 I
5.4.1 一般注意事项(General Caution).................................................................................. 10
4 |' [, t3 c9 T" j2 y5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10
, O4 K2 W; \% a; m! j- a- u1 {6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10% Q( T9 W* ~8 v+ {. H. Z
6.1 带状线(Stripline) ..................................................................................................................... 11
$ D3 Z: ~4 [% { o0 X V' x0 ^6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
$ |! {3 i/ z1 Y7 T6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 113 F2 L' c$ Z1 {: j; r( S, T
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12# e9 j9 h9 U; M; r( X
6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12$ Q1 r1 N' q5 }- M/ P
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12
+ K2 P6 T" S4 _0 s6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12
: H! _- P9 T/ a6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13
, a+ r' k7 A$ e# U& r4 b6.3 微带线(Microstrip) .................................................................................................................. 13
. R# S/ J* c+ U8 n0 P6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective {7 b$ z, i, b% `; d
Permittivity f Microstrip)................................................................................................................ 13
5 ?6 S, y9 i9 u- C6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15: t# J: p- \( k P
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15
. H8 Y' |' c' { F" z( m! o- H7.1 机械特性(Machined Features) ................................................................................................ 15
# r& d# y! ^! e7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15
$ W6 e; y% v5 o3 H( n) S' a7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16+ j5 Z2 K- e; A0 r
7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17) e# n2 v/ ^& r
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IPC-2252
! `8 b( B, J% k7.1.3 非金属化孔(Unplated Holes)....................................................................................... 173 S, ]3 _% d$ Y: [2 b* L5 k
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
5 q( n: k$ c* q/ O% J1 s, O g4 m7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 188 I+ ^# j3 {1 Z o2 N
7.1.6 外形(Periphery)............................................................................................................ 18
5 o+ o- ~& {8 H: ]2 @7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18' B2 ?* K; M% c/ G
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
. }+ A0 Z% M/ Z7.2 出图(Imaging) ......................................................................................................................... 18
" a, }) {0 ^$ u1 H7.2.1 底片(Artwork).............................................................................................................. 19
7 S8 F9 a$ J( G, T7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19* ~7 M" G/ r% d- ]! c4 O0 e/ c0 K, G
7.2.3 环孔(Annular Rings) .................................................................................................... 19
- t% G% X2 Q+ b7.3 PTFE活化(PTFE Activation) ................................................................................................... 19
; k; b/ {0 r6 e4 }7.4 金属化(Metallization) ............................................................................................................. 19
q( _' b7 m" }, P( }1 m8 F7 `' R' y7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19 P; `0 p V1 o3 H4 }# w/ ]- ~/ M
7.4.2 镀铜(Copper Plating) ................................................................................................... 19; o% o3 E# D* e7 ~- ^1 j
7.5 蚀刻(Etching) .......................................................................................................................... 20$ h; M' @3 Q) g
7.6 粘接(Bonding)........................................................................................................................ 20& R$ G% _, K% n# i9 l7 t) N
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21* m: d8 E3 i0 \0 _5 t7 V
7.8 测试(Testing).......................................................................................................................... 21
3 J9 ?; ~* d3 v8 q8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
, j& S4 U/ x+ e. L8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21% Z u5 k$ X! W3 K6 b4 C, z
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21# L7 t# G4 W: q. h+ G2 M
8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21
9 F( P# L' I9 }8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
& f$ w% j( G$ f7 Q% p" K$ i6 ?0 p8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22
3 r* W4 U5 O! {+ n3 v" W4 E8.1.4 软钎焊（Soldering）................................................................................................... 225 s; z. u; F4 \. ~3 p6 R y
8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
+ @: s+ x; u% \8.1.5 直接粘结（Direct Bonding）...................................................................................... 22$ }" s" a) U* _
8.2 连接器安装（Connector Attachment） ................................................................................. 22
0 F) N3 ?. B `/ N5 ^* p) p" u" K8.2.1 边缘连接器（Edge Connector） ................................................................................ 229 ?" Q# D% |; o
8.2.2 表面连接器（Surface Connector） ............................................................................ 23
$ w- ?9 q+ I6 a- b8.3 器件安装（Device Attachment）........................................................................................... 23# b" _ K6 g' i& Q6 O, Q9 w9 K
8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
" e. a) h+ W6 h# j8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23
( {- b% I) W! M5 [8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23
. l2 O3 l! X" h" W8 X5 g8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24, Z9 {: W0 z1 w7 S1 a% k6 X
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 247 K3 r& c' F8 [8 i; ]7 B* g+ M' g
8.3.1.5 软钎焊（Soldering）........................................................................................ 240 E& [2 T! L6 h& k3 H4 B+ c" Y( t
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
; b& P0 e G& f. h8 Q. W8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24; |3 S5 l, d- K
III; G: p1 f0 m( l4 I8 T" l
July 2002
3 x# X; U9 O0 k0 \3 u/ Q' u8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24
# m# Y( ?# P% d$ X# P# d. M: `" v8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 245 c8 ~" y9 Z) A) N+ M0 y2 {' A
8.3.3 器件安装（Device Attachment）................................................................................ 24
- G3 N& I# L' d1 _: K8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
, M; n! b% U0 V* `. q$ d3 k" @8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25- O7 P" s8 q. z0 j
8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
+ _% U! G" B9 f8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25
8 B+ q& N. m% ~8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
) k- V3 J. T5 K) I# L9 质量保证（QUALITY ASSURANCE） .......................................................................................... 257 e. I/ T( B/ q* `$ \# _; r/ U( X; E
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
% |$ Z/ g' u: R9.2 可靠性（Reliability）.............................................................................................................
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发表于 2010-11-30 12:42
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