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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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| 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发2 D" {2 [* T5 e9 K8 E7 u5 A3 ~
目录
3 w6 C* [ J- r' ^3 U1 概述(GENERAL)................................................................................................................................ 1
( d; k9 B9 V% C: L; Z1.1 目的(Purpose)........................................................................................................................... 1
. v/ R' z$ N' c }8 B. {$ l- T+ r1.2 范围(Scope).............................................................................................................................. 1
# y' [; T* V0 m- i1.3 术语和定义(Terms and Definitions)......................................................................................... 1
/ E% @: S2 E( W: \* r2 应用文档(Application Documents) ..................................................................................................... 38 r* {2 c) L* j$ L5 P" M
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3( E4 L6 A" j& f4 i+ S* }
2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 37 X5 g& C/ u# r
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3
! E2 n6 x6 e( B7 b* p: _2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
8 s) F9 R. I2 i/ l7 |. I2.5 国际标准化组织(International Organization for Standardization)........................................... 3' c8 w( z% l4 G% C
2.6 参考文档(Reference Information) ............................................................................................ 3; J! F7 N8 ^ S# l
3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
. E' u; \8 R! y& ^/ m! S+ J3.1 最初输入(Initial Input).............................................................................................................. 3
* x3 s- y; T% o2 G4 i* |' s3.2 设计方案(Design Options)........................................................................................................ 3
' `/ t9 ]; D/ d2 a' L: A' X3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3/ [3 B! r6 _; k! }) j2 q
3.4 电气设计(Electrical Design)..................................................................................................... 3; N8 U$ X* T# s( c7 E( v
3.5 机械设计(Mechanical Design).................................................................................................. 3
/ b) h1 h$ H* S8 e3.6 设计预审(Preliminary Design Review) .................................................................................... 3
+ l' r- j- N l, G [8 y+ J/ O( P3.7 电路实验板(Breadboard).......................................................................................................... 3- Z( M) ^6 o8 j$ {
3.8 原型(Prototype)........................................................................................................................ 3( \1 \# r4 m& b: J0 a* W2 h8 \
3.9 文件编制(Documentation)........................................................................................................ 3. P# z" k s _0 e1 B+ u; A
3.10 最终设计评审(Final Design Review)..................................................................................... 3% x% e3 N9 f d( W# Q
4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
' n' ] Y- L. `6 j4.1 产品特性列表(Design Features Listing) .................................................................................. 53 P9 u' [0 r0 E5 K- Q/ }
4.2 原图(Master Drawing) .............................................................................................................. 5
1 q- m7 c" Q! c2 ~+ `# \4.3 原始图形(Master Pattern) ......................................................................................................... 5
4 P" U+ P8 z( F! @0 U5 材料(MATERIALS)............................................................................................................................ 55 G! {& c( o# f j# J
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5- I* U( t3 F1 e
5.1.1 基材选择(Substrate Selection)....................................................................................... 5
- _6 N% k# k% _6 ~* r8 @" W5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5, ^- r/ V$ ]# \3 @7 G( z
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6! ~+ m5 e' L6 w) n2 v; }' H! w" D
5.1.1.3 厚度(Thickness) .................................................................................................. 6
9 s8 M2 R- D. a% y+ m1 B0 J5.1.1.4 环境(Environment).............................................................................................. 7
: {. ?% J5 n6 x( Q1 P% }7 L5.1.1.5 成本(Cost) ........................................................................................................... 7* H+ u! `! w( a% O% D8 X$ w1 U
5.1.1.6 供应商(Supplier) ................................................................................................. 7/ ^3 ?4 p" ]9 `+ f0 G
5.2 粘接膜(Bonding Films)............................................................................................................. 7/ p) O4 d4 s$ R$ G) h6 f, h
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 72 n# A* D j: L- ~
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5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7. a% E! e" X% Y% R6 ^
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8* L: \, k3 q' A- [; V' C$ o; o
5.3 金属(Metals)............................................................................................................................. 8
4 g" j1 S' P+ S/ Y9 j& f6 B8 t5.3.1 金属覆层(Cladding) ....................................................................................................... 8
$ q5 O. r! D4 [% a; I& J1 [3 M! f5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8- `) H" o9 c2 N/ E& s+ x( M
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8
9 a2 \6 m; E8 Z* ~0 a$ e1 b5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
4 G9 f6 G& a1 j. c9 J5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9
& z' V( B- e( r# y% Y5 q5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9 c5 Q( ?1 c! ^
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
+ t% j; Y1 s9 \& G# ?9 V5.3.2.4 镀金(Gold)........................................................................................................... 9% B# H" I2 G! i9 Q4 [) r
5.3.2.5 镀银(Silver) ......................................................................................................... 9
& @+ A7 S4 S+ ~5 g, _" a3 G b9 i, c7 B, n5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
$ R2 ?/ |6 w/ L9 }, G4 F; y- B5.3.2.7 焊料镀层Solder Coating...................................................................................... 9
& ^4 S" m4 G. V7 o0 \$ w5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 97 B1 C8 N4 ^+ s& P O
5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9
# J% U9 F0 R4 @1 E* S5 p5 H8 @5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
7 x V' d3 k' f3 s* `5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10( v# R" r9 |! J
5.4 仿型涂层(Conformal Coating)................................................................................................ 10- z7 ~1 ~. b2 \- c9 D# [
5.4.1 一般注意事项(General Caution).................................................................................. 10, |) }; ?3 i7 a8 s6 J- |# Z$ _
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10/ N9 G- y4 h5 ]! Q2 \
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10
& T; o" V% F" @6.1 带状线(Stripline) ..................................................................................................................... 11# V0 v3 ] m5 J8 D, a$ a, z; p1 z
6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 119 n: P, A) B" w8 L& i/ D( C9 Q1 t
6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 114 \- g$ u/ R. L; H) N& o
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12& p4 i: D& `- t
6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12$ R/ U: N0 K) J+ z8 Z D
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12) ^+ r3 t& d5 y5 e3 K' t
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12$ N4 w: s; ?$ C7 l" U3 [$ Y) H
6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13( c! C4 |* R% {* a" ~3 @; L
6.3 微带线(Microstrip) .................................................................................................................. 139 x7 b3 r4 o1 i5 I5 U+ @1 i3 n- v
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective& k2 c& W9 t: E1 t! {$ ]. H
Permittivity f Microstrip)................................................................................................................ 136 {& D1 D: t% ^0 N& j
6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 153 L' h3 ]7 y2 x$ T, j6 B' D. L
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15
' D3 w- E) d' h7.1 机械特性(Machined Features) ................................................................................................ 15
1 H7 j% P6 V: \/ ]# S7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15
6 o- F9 N) E, S( v4 ?7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16
6 N2 O: q, r# S: \/ _4 |) t7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 173 Y) w$ Q- Y" u+ F
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IPC-2252
3 c( w2 g9 ?5 x% k" t7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
5 c0 R/ J6 i2 n$ X+ l7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
z( e3 g- u# R% r" f9 m7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18
2 D; }! @" }4 x% F4 f2 R7.1.6 外形(Periphery)............................................................................................................ 18- E/ U* S G2 e
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18
8 K; O; X5 Q6 {$ i7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
6 O$ Z4 J' h" @* ~, c( x7.2 出图(Imaging) ......................................................................................................................... 18/ C" p3 H0 W/ e+ C- a: Q" c
7.2.1 底片(Artwork).............................................................................................................. 19
8 o. v" N5 A9 X2 u+ w7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19
8 r% o+ Y6 p! o/ z# x- c# S! r7.2.3 环孔(Annular Rings) .................................................................................................... 19- ?5 m8 X: i; p. i( T, }
7.3 PTFE活化(PTFE Activation) ................................................................................................... 19
7 w1 o) f/ o# J7.4 金属化(Metallization) ............................................................................................................. 19
9 b/ H5 f& N/ A' ~7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19
! U. ~1 Z0 l4 R) S1 M% g) A Q7.4.2 镀铜(Copper Plating) ................................................................................................... 190 H. E2 x1 p$ G* o* T3 ~
7.5 蚀刻(Etching) .......................................................................................................................... 20* `+ K& Y* W& T5 `( c" C
7.6 粘接(Bonding)........................................................................................................................ 205 W2 s- p9 i2 q! s
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21; L+ S! R1 X( B7 w/ e/ P k
7.8 测试(Testing).......................................................................................................................... 21
0 M$ I! j o- l8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
- E3 T0 h3 D8 d' t8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21/ \& s% C# o6 m" O
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
0 Q8 g4 L8 F: q! }1 l8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21
3 k: ~5 o& I/ l: J" t/ B8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
& D2 y4 E6 |" \; }9 u1 }+ v8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22
2 r/ ^" i) G5 P* U/ U+ G0 G8.1.4 软钎焊（Soldering）................................................................................................... 22
3 ^) V" V# ~: [# z8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
: a8 a9 O& ]/ r/ W- s1 P# _8.1.5 直接粘结（Direct Bonding）...................................................................................... 228 F. p* L! j0 F: J3 n
8.2 连接器安装（Connector Attachment） ................................................................................. 22
. v# o% H3 y; B8.2.1 边缘连接器（Edge Connector） ................................................................................ 22# p9 m7 N7 f' S. A2 F
8.2.2 表面连接器（Surface Connector） ............................................................................ 23
! A3 g+ n7 f+ z' |4 A& J8.3 器件安装（Device Attachment）........................................................................................... 232 K2 {8 o0 n' ^5 g- g0 t6 `" \
8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
5 Y6 z; m7 \7 c b. m6 l8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23/ M" F; D" f! P! j# x8 ]; \
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23+ w( H+ Z* A# G& j3 r2 E) z
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24( S3 `2 }+ b0 H# u0 r" h# @- l
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
7 j; j- w5 I$ E5 ^0 F7 j8.3.1.5 软钎焊（Soldering）........................................................................................ 24
) w- |' g/ v& j2 u2 r+ J5 _1 C: s8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24& r# \- f' n& J( h
8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24* ^1 J$ G5 j# G& F: A" C
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
" B1 _1 z: b$ E0 `2 I5 }8.3.3 器件安装（Device Attachment）................................................................................ 24
, E( m5 b0 V Z7 i: u7 V4 P8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24# D7 A3 i! i/ n- b3 `* M" e
8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
0 Z1 K" L' k' ?/ a8 V5 U; N8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 250 t' R; C$ k3 a- q; v, k
8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25
6 e8 X5 o7 f6 C8 Q8 F8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
- c0 k: b# b; @& k9 n9 质量保证（QUALITY ASSURANCE） .......................................................................................... 259 X- i1 i: K& a. n" @) r2 _
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
- B0 `% h& x( P5 q l0 q, U9.2 可靠性（Reliability）............................................................................................................. 7 p- t' b" U" V: Z$ Y8 z$ V- u0 m: Y( A
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发表于 2010-11-30 12:42
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