最新拿到一家IC厂家的推荐设计文件; K/ ]5 P4 E* F% R, H
发现里面的大封装电容的两个焊盘全部贴的很近,1206封装的电容,焊盘间距大概只有10mil左右。 & r, ]# j) |1 M5 d; h: sThe +V and GND traces between the capacitors should be as close to each other as possible.so that the gap between the two nodes is minimized.9 n- A/ ^7 Q: z
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这样处理的意义何在? $ q* J9 r Q, N' m# ?0 S减小ESR吗?