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PCB Designer’s si guide

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发表于 2008-5-26 11:07 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式

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PCB Designer's SI GUIDETable of Content
. Y, k" Z4 T' F( u* a  DBasics of SI___________________________________________________________________5
2 H$ i! e7 i! U+ o1.1 When Speed is important? _____________________________________________5 : z- h8 |- Q2 a) ?7 O
1.1.1 Acceptable Voltage and timing values ________________________________5 . X- w6 Q8 A& m$ A* e
1.2 Signal Integrity ______________________________________________________5
+ D0 Q' r" p. v1.2.1 Waveform Voltage Accuracy _______________________________________5
. ~2 a8 O) L  C; ^# c* F1.2.2 Timing_________________________________________________________5
5 {8 D7 ?+ s+ s$ ?1.3 Speed of currently used logic families ____________________________________5 # `3 f* g2 Z) \( W" Z$ E
1.3.1 Transition Electrical Length (TEL) __________________________________6
( q" `) y: S8 K- ^( W/ A1.3.2 Critical length ___________________________________________________6 # j: r# X0 u8 U$ C' C; [
1.3.3 What is Transmission Line? ________________________________________6 $ J& o  x/ L: Q) q
1.3.4 What is moving in a Transmission line?_______________________________6
) L' B$ Z6 b; z3 S- ?1.3.5 Power Plane Definition____________________________________________6 4 ]. w' f" Z3 ^$ j2 s
1.3.6 The concept of Ground ____________________________________________7
0 `" b2 C- ~, ~1 a" E/ K1.4 STRIPLINE circuit with Electromagnetic field _____________________________7 8 @! ~0 J/ t0 W
1.5 RLC Transmission Line Model _________________________________________8
- q0 M" C2 r) e' h8 J" \1 Z- A, M1.5.1 What is Impedance? ______________________________________________8
( y% M% u2 G% h& n1.5.2 A Practical impedance equation for microstrip _________________________8 % ?. U  N& W9 `/ n1 U% g# J; I8 }
1.5.3 What is relative dielectric constant Er? _______________________________9
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2 Interconnections for High Speed Digital Circuits _______________________________10
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2.1.1 Summary______________________________________________________10 3 B$ i4 ~0 H* R& p: b9 f
2.2 Examples of dynamic interfacing problems _______________________________10
# N' z  p1 r2 B. }: L+ ^* N2.3 IC Technology and Signal Integrity _____________________________________12 & N& G$ Z# s9 K3 ?% o' f' T3 U" s! l
2.4 Speed and distance __________________________________________________14
5 ]( k& N: l- k  p2 e5 z9 Q2.5 Digital signals: Static interfacing _______________________________________15 : h+ s& X- v- R3 D# g4 j
2.6 Digital signals: Dynamic interfacing ____________________________________16
/ P) B6 p5 G' s5 ~; ~7 ]2.7 Review questions ___________________________________________________18 & c" w6 R& p: u

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3 Interconnection Models____________________________________________________20
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3.1 Summary__________________________________________________________20
7 l$ A- S% w) R8 V. k( e( n3.2 Reference model for interconnection analysis _____________________________20 % c4 Y  ~$ }+ F/ v5 T
3.3 Receiver model_____________________________________________________21
( m1 D8 S9 ^0 f* ^$ U3.4 RC interconnection model ____________________________________________23 7 y" D! A$ X  m0 p7 Q) L% Q! {
3.5 Parameters of the interconnection ______________________________________25 7 P: ^6 `7 l1 U. p; r* y
3.6 Refined models _____________________________________________________26
% a$ s( v( _  ?9 n) W2 k3.7 Review question ____________________________________________________28
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4 Transmission Line Models _________________________________________________31
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4.1 Summary__________________________________________________________31
+ g6 e! z; s8 X3 K* s4.2 Transmission line models _____________________________________________31 $ O- ~* _  F/ J" F
4.3 Loss-less transmission lines ___________________________________________32 6 @5 \/ q( e. Q/ M) v1 \
4.4 Critical Length _____________________________________________________34
/ H+ o5 c( g' n# L4.5 Reference transmission line model______________________________________35 ! R( b+ i7 @4 m% s) e
4.6 Line driving _______________________________________________________36
% V0 S/ `' c% S4.7 Propagation and reflected waves _______________________________________37 , k. \) E# U% v  W: ]8 ?
4.8 A sample system____________________________________________________39
0 Q6 h7 M# N9 w& I$ S; N7 x0 M+ @4.9 Review questions ___________________________________________________42
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PCB Designer’s SI Guide Page 2 Venkata
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5 Analysis techniques _______________________________________________________45

5 D8 L' n2 J! s+ Q& {. x2 g: O5.1 Summary__________________________________________________________45 + J, J" P2 z1 `: K& U. c8 H
5.2 Transmission time and skew___________________________________________45 5 u: K( {$ J4 Q2 Z$ }6 e4 I: T
5.3 Effects of termination resistance _______________________________________46
2 \8 m- D( Y2 M6 [  S: ^# k; l8 T5.4 Lattice diagram _____________________________________________________48 . Y0 C! X0 e. R0 d# J0 }: l, }% U" P" p
5.5 Examples of Real Lines ______________________________________________49 8 l4 v. L7 h* e
5.6 Simulation code ____________________________________________________51 % [- q: j$ W6 h% T: u, v  E
5.7 Examples of results__________________________________________________54
6 t0 k; v# P( Q; B8 d3 K7 |2 D0 a5.8 Review questions ___________________________________________________55
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6 Design guide for interconnection ____________________________________________57
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6.1 Summary__________________________________________________________57
8 H0 s! g- G  Y3 |8 m+ s! ~6.2 Incident wave switching ______________________________________________57 8 B& x) Y) k& N& W, ~" S6 J, q
6.3 Effects of capacitive loading __________________________________________58 . ?  I( V& L& T+ n6 [) Z
6.4 Termination circuits _________________________________________________59
! S* I  l/ b7 _# }7 b- @4 r6.4.1 Passive termination______________________________________________60 ! u) {8 J. L4 G8 e, E4 V
6.4.2 Low power termination___________________________________________61
+ {+ S# c* ~  _/ \2 r$ _% r1 _- x* T6.4.3 Active low power termination circuit. _______________________________61
% Q' w# p' |# z% U( y) T4 z8 W6.5 Driving point-to-point lines ___________________________________________62
5 ]- D' w- t# N, w: [& T- \6.6 Driving bused lines __________________________________________________64
' S( v8 X* x, M$ p! P  [5 V! Y6.7 Design guidelines ___________________________________________________67
; ]; F# S3 W1 R% e; b# @2 J, E6.8 Review questions ___________________________________________________67

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 楼主| 发表于 2008-5-26 11:09 | 只看该作者
Signal Integrity in Digital Circuits ___________________________________________70 / F# g  s% E# ~) D& `7 b: v3 ]$ ?
7.1 Crosstalk __________________________________________________________70 . u1 a: J# @3 J; D
7.1.1 Summary______________________________________________________70 / U: ~5 z" V2 [/ c6 u
7.2 Examples of signal integrity problems ___________________________________70
2 ?# V- K" ~+ w7.3 Simplified Model for Crosstalk Analysis _________________________________71 $ l* |) H6 l8 E- Z* b+ M2 B
7.4 Forward and backward crosstalk _______________________________________74
8 A. b! b2 l: U; m7.5 Examples__________________________________________________________76 8 G& J" l" l2 B3 V* P
7.6 Near-end and Far-end crosstalk ________________________________________80
" J. S9 e8 R$ R7 k$ Z7.7 Review questions ___________________________________________________81
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8 Design Guide to Handle Crosstalk ___________________________________________85
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8.1 Summary__________________________________________________________85
9 |9 [6 L) A& `% H- A- u8.2 Effects of Crosstalk __________________________________________________85 5 G5 N' c+ L/ s) w
8.3 Passive countermeasures _____________________________________________86 # F+ f8 Z# E/ B% l2 d/ s
8.4 Active Control of Crosstalk ___________________________________________92   q6 p3 z% L' {) h+ D
8.5 Review questions ___________________________________________________94
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9 Ground Bounce and Switching Noise_________________________________________97

& x" J# d" O# j# c% m# ^! E9.1 Summary__________________________________________________________97 2 Y0 \" \3 U" F. P
9.2 The totem pole Current Spike__________________________________________97 $ F8 b1 Q4 x( O
9.3 Current flow in the output capacitance __________________________________100
% k# Q2 |! O# I0 Y  z: F9.4 Total Ground Bounce _______________________________________________100
  {4 f4 g0 F# L1 r7 y% ~9.5 Review questions __________________________________________________105 ' j+ ^5 u) I: k7 T( B$ ~
10 Design Guide for Ground & Power Distribution _____________________________107

1 o. k- X) @& v+ X  d10.1 Summary_________________________________________________________107
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PCB Designer’s SI Guide Page 3 Venkata
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10.2 Decoupling Capacitors ______________________________________________107 " c, G. c, ~4 @! V% ~
10.3 Placement of bypass Capacitors _______________________________________113 ) j: P$ R0 _- j" X. J
10.4 Ground and power distribution________________________________________114 8 {, Y1 J6 _& A( T; X1 P% v2 z
10.5 Clock distribution __________________________________________________115
* D; O. E! g8 t* m1 O; r10.6 Review Questions __________________________________________________118 2 ^  }& N- _# Y7 ?
11 Laboratory Experience _________________________________________________120
  I) ~2 z. ?* B7 Y/ g5 p* U11.1 Summary_________________________________________________________120 " `+ {" O9 X5 @. a( O) ~# m
11.2 Aim of the experience_______________________________________________120
" u& d( G( J% T8 H$ K11.3 Generator Parameters _______________________________________________122
: U  u' K0 F7 l11.4 Cable Parameters __________________________________________________123 8 P2 S" K0 g5 o+ ~4 H
11.5 Mismatch at driver and at termination __________________________________124
. }/ z- J2 {. }4 Y0 Z/ g& d8 g11.6 Capacitive Load ___________________________________________________125 5 E; y8 c: v- [' H& d
11.7 7. Time-domain reflectometer ________________________________________127
' J. w. D) W. ?# a: W5 F  {) r11.8 Driving the line with logic devices _____________________________________128
9 A* M( O  d0 L" ^0 [. Y* Z6 |9 d12 SI Analysis Strategy____________________________________________________133 " o* V6 c! E: z  F
12.1.1 A modern high-speed design methodology must involve the at least the following: ____________________________________________________________133
: k% Q! }0 o9 h4 a7 Q12.2 POSSIBLE HIGH-SPEED DESIGN APPROACHES ______________________133
: J; t& Y6 \+ q( p$ F! T12.2.1 There are two fundamental types of conditions that need to be considered for solution space analysis:__________________________________________________134 2 h; s/ x: T  d5 U$ V; d- x  y8 d, ?
12.3 SOLUTION SPACE ANALYSIS _____________________________________135 7 \( e! v" Q7 M9 j
12.3.1& f6 Q* v' ~* n2 X, W- p
STEP 1 — DEFINING THE INITIAL TOPOLOGY __________________135

& i7 O; H& M6 X, \, ~( N12.3.2 STEP 2 — DEFINE MANUFACTURING TOLERANCES AND THEIR MIN/MAX VALUES ___________________________________________________135
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STEP 3 — DEFINE THE STARTING POINT FOR DESIGN VARIANCES 136

9 {, L$ c8 r8 Y3 z7 x$ R12.3.4
! _( o8 ?9 t1 f- E1 R# p0 Q4 w' MSTEP 4 — SET UP AND RUN A NUMBER OF SIMULATION CASES _136
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12.3.5 STEP 5 — EXAMINE THE SIMULATION RESULTS, IDENTIFY WHICH CASES FAILED AND WHY ____________________________________________136 ( U# B' i" Y5 C" r
12.3.6 STEP 6 — ADAPT THE TOPOLOGY AND DESIGN RULES AS APPROPRIATE _______________________________________________________137 4 |; d( x$ g( O0 {4 t7 V. W
12.3.7 STEP 7 — REPEAT STEPS 4-6 UNTIL THE TOPOLOGY CONVERGES ON A SET OF VALUES THAT PASS FOR ALL CASES ANALYZED __________137
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( i, k" y. f$ @; G. E) xSTEP 8 — DERIVE DESIGN RULES FOR THE TARGET CAD SYSTEM 137

# M4 @6 _9 k8 J; r5 z& Z) N12.3.9 STEP 9 — DRIVE THE CAD RULES INTO THE CAD DATABASE, AND USE THEM TO DRIVE THE PLACEMENT/ROUTING PROCESSES ___________138
' q: ?; `5 r  a+ Z# N! v* N9 Z& y12.3.10 STEP 10 — POST LAYOUT SI ANALYSIS ______________________139 2 v5 b( B2 H& v/ F& z, w: p
12.4 CONCLUSION____________________________________________________139
3 l% K* l# C4 D13 Glossary _____________________________________________________________141
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PCB Designer’s SI Guide Page 4Venkata
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