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PCB Designer’s si guide

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发表于 2008-5-26 11:07 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式

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PCB Designer's SI GUIDETable of Content
) Z0 S) Y' d( X- \( b% r4 zBasics of SI___________________________________________________________________5 & h: J# ~  H" ?. t* O4 d
1.1 When Speed is important? _____________________________________________5   B! Y: P& u1 G, r) T9 |) T
1.1.1 Acceptable Voltage and timing values ________________________________5
1 W. p( C: K% K: d3 ~6 K% e/ w2 C* R1.2 Signal Integrity ______________________________________________________5 8 f0 R0 z. B$ u; J1 c
1.2.1 Waveform Voltage Accuracy _______________________________________5
$ j  N: d% y; D1.2.2 Timing_________________________________________________________5
0 y$ J0 B: U' ]5 _1.3 Speed of currently used logic families ____________________________________5 1 F+ n/ {  T+ F9 G6 E
1.3.1 Transition Electrical Length (TEL) __________________________________6 - X) n( L/ L% H1 P7 Y' [
1.3.2 Critical length ___________________________________________________6 6 z% q5 u9 Q1 \" f
1.3.3 What is Transmission Line? ________________________________________6
6 }( k( l& k. l8 t8 J' j/ e1.3.4 What is moving in a Transmission line?_______________________________6 , C1 p9 I- ^/ [1 H  F
1.3.5 Power Plane Definition____________________________________________6 * A% o' m! v3 V" z1 R
1.3.6 The concept of Ground ____________________________________________7 ' Z$ L0 R* S( |# x- o
1.4 STRIPLINE circuit with Electromagnetic field _____________________________7
6 A9 Z) k) G4 ?: C) M# P" B1.5 RLC Transmission Line Model _________________________________________8 / d1 n4 [* b" n9 D
1.5.1 What is Impedance? ______________________________________________8 , ?- y, k+ x! j) V8 q" J% O( T
1.5.2 A Practical impedance equation for microstrip _________________________8
( W3 k7 W8 l& w6 E  ~) h2 H' v1.5.3 What is relative dielectric constant Er? _______________________________9
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2 Interconnections for High Speed Digital Circuits _______________________________10

  e& L& W$ s% K7 L7 v8 Q+ Z( r2.1.1 Summary______________________________________________________10 ( b5 A1 l/ z& e4 I& e  }( J
2.2 Examples of dynamic interfacing problems _______________________________10
# c$ _- w1 {# B2.3 IC Technology and Signal Integrity _____________________________________12 $ ?6 T' U! j. X6 q) |$ s' Z0 r
2.4 Speed and distance __________________________________________________14
# y! E1 F9 ~4 f3 M4 W2.5 Digital signals: Static interfacing _______________________________________15 ' D% D9 k. r: v/ }) N; ?
2.6 Digital signals: Dynamic interfacing ____________________________________16
# u! t( V! e8 B4 ?. I& v' Q2.7 Review questions ___________________________________________________18
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3 Interconnection Models____________________________________________________20
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3.1 Summary__________________________________________________________20 . s# j1 A4 i+ B% u3 u: |) t
3.2 Reference model for interconnection analysis _____________________________20 1 p/ G5 Z: J9 i! f6 r
3.3 Receiver model_____________________________________________________21
' x% j) ?3 f# p9 f' ?& f5 p3.4 RC interconnection model ____________________________________________23
! H( X; d, `1 f/ R3.5 Parameters of the interconnection ______________________________________25 - @& n% V8 t! q0 O9 x) Y
3.6 Refined models _____________________________________________________26 ( k' T6 W& U# ~7 J2 z
3.7 Review question ____________________________________________________28 5 f% \2 R0 O! O4 n8 a* H* Z3 F; K
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4 Transmission Line Models _________________________________________________31
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4.1 Summary__________________________________________________________31
' v7 [3 o5 J1 n% L8 p; }3 A- c4.2 Transmission line models _____________________________________________31 # B% T' H0 R, ~8 K( F3 O; n( o
4.3 Loss-less transmission lines ___________________________________________32 ( F" T+ c$ L* I0 H% @1 s) Q
4.4 Critical Length _____________________________________________________34 / F# J) H7 `  r* S3 {( }
4.5 Reference transmission line model______________________________________35 6 h! ^* w& m0 ?
4.6 Line driving _______________________________________________________36 $ L! b2 N% \9 h5 A
4.7 Propagation and reflected waves _______________________________________37 # U( [5 C% R' k
4.8 A sample system____________________________________________________39 1 I% f4 U( u7 M5 M* L# x7 P4 M7 B
4.9 Review questions ___________________________________________________42
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PCB Designer’s SI Guide Page 2 Venkata
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5 Analysis techniques _______________________________________________________45

  T- q4 X, S6 I# [5.1 Summary__________________________________________________________45
5 F7 S# k7 y/ T2 [3 v5.2 Transmission time and skew___________________________________________45 : {, n( S; a) D8 E9 }
5.3 Effects of termination resistance _______________________________________46
5 I+ T  l+ d8 s& S+ e5.4 Lattice diagram _____________________________________________________48
3 Q/ C9 ~* a7 {6 d* A5.5 Examples of Real Lines ______________________________________________49
% v3 f  P# c, Y* v) g& ^+ j- {5.6 Simulation code ____________________________________________________51 * z, D/ f) K# ^6 g+ K: _
5.7 Examples of results__________________________________________________54 & q) w2 B% i: E, A- `1 s5 j
5.8 Review questions ___________________________________________________55
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6 Design guide for interconnection ____________________________________________57
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6.1 Summary__________________________________________________________57 : l4 H6 B$ G( I) o# ^
6.2 Incident wave switching ______________________________________________57 # m" I* Q' d, U2 l  W
6.3 Effects of capacitive loading __________________________________________58 " z3 t4 m  M- {) ^
6.4 Termination circuits _________________________________________________59 2 ^/ [. Q1 P' _- A4 C1 U# L
6.4.1 Passive termination______________________________________________60 # }1 O7 ~( k! |5 Y
6.4.2 Low power termination___________________________________________61 2 T4 B3 R# u$ w5 \
6.4.3 Active low power termination circuit. _______________________________61
+ _; l- Y( j* e6 }6.5 Driving point-to-point lines ___________________________________________62
' Y! v; H7 u$ D8 G7 r$ W$ C1 l6 ?6.6 Driving bused lines __________________________________________________64
% Z$ s: j5 a5 l# W/ o, t6.7 Design guidelines ___________________________________________________67 & R0 G* |5 k" ]1 ?# c
6.8 Review questions ___________________________________________________67

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 楼主| 发表于 2008-5-26 11:09 | 只看该作者
Signal Integrity in Digital Circuits ___________________________________________70 ; H" }# I/ H8 b3 ~$ Y5 G8 t3 s% C
7.1 Crosstalk __________________________________________________________70 4 l0 I5 C& J% z$ R8 C# g3 q1 E
7.1.1 Summary______________________________________________________70 5 s: q6 b0 V5 z8 ?/ n% o4 b( s
7.2 Examples of signal integrity problems ___________________________________70
" C% V# H, a- G% E! ]7.3 Simplified Model for Crosstalk Analysis _________________________________71 : t7 g' j* o7 d4 R5 A
7.4 Forward and backward crosstalk _______________________________________74 6 r' M% b0 A3 g
7.5 Examples__________________________________________________________76 ; O: [$ S, C+ r* w# P. Z( c6 n
7.6 Near-end and Far-end crosstalk ________________________________________80 / w* N2 \& x1 K3 @# j. Q2 f
7.7 Review questions ___________________________________________________81 " o( c) S% u. b# |! z

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8 Design Guide to Handle Crosstalk ___________________________________________85
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8.1 Summary__________________________________________________________85 4 `' g- P4 c  J9 b
8.2 Effects of Crosstalk __________________________________________________85
, H4 X1 J* K' q) \# _) Q/ Y! _, I8.3 Passive countermeasures _____________________________________________86
5 ~0 u% e  w1 n, o2 [3 y  e8.4 Active Control of Crosstalk ___________________________________________92
/ F. v/ L- e: Y, q8.5 Review questions ___________________________________________________94
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9 Ground Bounce and Switching Noise_________________________________________97
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9.1 Summary__________________________________________________________97 ! A6 ^5 x) N; J7 H  @2 h
9.2 The totem pole Current Spike__________________________________________97
* a% X, i) c& e! ^9.3 Current flow in the output capacitance __________________________________100 . Q4 c3 f  J* S& D* V; U
9.4 Total Ground Bounce _______________________________________________100
$ V$ D* B! }5 u4 O9.5 Review questions __________________________________________________105 5 @8 p% t6 _6 u: Y; G! j% |
10 Design Guide for Ground & Power Distribution _____________________________107

0 M, T" r6 n' [  a" H7 F7 I/ h10.1 Summary_________________________________________________________107
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PCB Designer’s SI Guide Page 3 Venkata
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10.2 Decoupling Capacitors ______________________________________________107
; N! l. x# q% k10.3 Placement of bypass Capacitors _______________________________________113
; L- D* l: L0 J/ p% e* G# ]10.4 Ground and power distribution________________________________________114
% e  z3 J. H' {10.5 Clock distribution __________________________________________________115
8 \0 a9 y# A" Y: n: Z10.6 Review Questions __________________________________________________118
7 E' ^1 J* u& \1 a6 i3 E: n11 Laboratory Experience _________________________________________________120 2 N' I7 A7 N* Z% Q9 P
11.1 Summary_________________________________________________________120 % z, B9 t. P0 A. d' I, l& N
11.2 Aim of the experience_______________________________________________120
" B3 Y: C  G0 u0 v/ y9 x/ j/ H/ h11.3 Generator Parameters _______________________________________________122
" r+ v8 l8 B8 E8 c! f' f' h8 o+ x11.4 Cable Parameters __________________________________________________123 + U/ H3 w( I1 K: i6 D! Z) m9 l
11.5 Mismatch at driver and at termination __________________________________124
1 I# w' i2 D; r4 ?+ s11.6 Capacitive Load ___________________________________________________125
9 Q+ v5 U+ ^0 z- t; z  b11.7 7. Time-domain reflectometer ________________________________________127 : d1 `) T2 ]! {! x4 D
11.8 Driving the line with logic devices _____________________________________128 3 P5 Y& @; `- |  U3 B
12 SI Analysis Strategy____________________________________________________133 / t4 h3 p0 h/ C
12.1.1 A modern high-speed design methodology must involve the at least the following: ____________________________________________________________133
. g* D+ I' N$ R7 ?" O/ F/ v& K12.2 POSSIBLE HIGH-SPEED DESIGN APPROACHES ______________________133
: d* p' F- z) M, Q0 N/ W12.2.1 There are two fundamental types of conditions that need to be considered for solution space analysis:__________________________________________________134
$ k# ~' I) p5 W12.3 SOLUTION SPACE ANALYSIS _____________________________________135 4 f# x+ e5 @( B0 d; \& J
12.3.18 q9 P$ E/ I' U5 k1 W
STEP 1 — DEFINING THE INITIAL TOPOLOGY __________________135

: Y0 x) \0 E2 K4 b1 J12.3.2 STEP 2 — DEFINE MANUFACTURING TOLERANCES AND THEIR MIN/MAX VALUES ___________________________________________________135 $ @( y; O6 d5 ]% Z' m
12.3.3
$ ~2 a& ?8 E1 OSTEP 3 — DEFINE THE STARTING POINT FOR DESIGN VARIANCES 136
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12.3.4
, X* p' ~2 p3 J4 \2 dSTEP 4 — SET UP AND RUN A NUMBER OF SIMULATION CASES _136

/ W$ v4 n5 N! ~5 a$ ]" N12.3.5 STEP 5 — EXAMINE THE SIMULATION RESULTS, IDENTIFY WHICH CASES FAILED AND WHY ____________________________________________136 5 `1 H! P$ }' R: N, m0 W
12.3.6 STEP 6 — ADAPT THE TOPOLOGY AND DESIGN RULES AS APPROPRIATE _______________________________________________________137
9 @9 ], z! v9 W2 \( i+ O12.3.7 STEP 7 — REPEAT STEPS 4-6 UNTIL THE TOPOLOGY CONVERGES ON A SET OF VALUES THAT PASS FOR ALL CASES ANALYZED __________137 * }& X- @# _# x, T+ L1 y6 K
12.3.8
7 h  z4 }" I9 c! q% E! [: VSTEP 8 — DERIVE DESIGN RULES FOR THE TARGET CAD SYSTEM 137

& F3 f' v) Z, h) a. l: Z12.3.9 STEP 9 — DRIVE THE CAD RULES INTO THE CAD DATABASE, AND USE THEM TO DRIVE THE PLACEMENT/ROUTING PROCESSES ___________138 " [3 m5 R4 B+ i4 H- Z: H1 l% {
12.3.10 STEP 10 — POST LAYOUT SI ANALYSIS ______________________139 " B) G, J$ {, Q  P' O2 v
12.4 CONCLUSION____________________________________________________139 % r2 U( p& a5 U
13 Glossary _____________________________________________________________141 ) n" O6 x( n0 x& i! R
PCB Designer’s SI Guide Page 4Venkata
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