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本帖最后由 dbit 于 2011-7-16 19:32 编辑
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所有计算依据:IPC-2221标准制定;
7 Y5 B2 B% \2 A4 q/ qIPC-2221标准描述:是由IPC组织制定的关于PCB设计的通用标准,英文名为:
, x' W% z$ f- DGeneric Standard on Printed Board Design
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/ a9 {1 g" R1 r/ `3 P* Ctrace width calc
8 q2 M) N- V3 I6 b7 g( A; ~# t0 `Area[mils^2] = (Current[Amps]/(k*(Temp_Rise[deg. C])^b))^(1/c)
4 W# C; U, N) j) WThen, the Width is calculated:
, h( b# y* z! q/ Q- A( WWidth[mils] = Area[mils^2]/(Thickness[oz]*1.378[mils/oz])
! K3 }0 {* b( @0 GFor IPC-2221 internal layers: k = 0.024, b = 0.44, c = 0.725 7 |3 I- M1 U% F- ]; x4 R
For IPC-2221 external layers: k = 0.048, b = 0.44, c = 0.725 A$ G/ s3 |' A; O7 Y$ ?
where k, b, and c are constants resulting from curve fitting to the IPC-2221 curves R7 G. `6 m7 |
; X' i# g" H/ q/ a' O) o }PCB VIA calculator
i' l* m0 [; z7 yResistance = Resistivity*Length/Area
3 k; N+ p& m4 `0 e1 L* B N% ~) dArea = pi*(Inner_dia + Plating_thk)*Plating_thk
& g6 a: b; W/ a4 f6 \Resistivity = 1.9E-6 Ohm-cm (plated copper) % Z. I0 E% n+ R% e7 g
(plated copper is much more resistive than pure copper)
* ]: \3 ]; U$ b* ]" a+ \4 yCopper Thermal_Resistivity = 0.249 cm-K/W (at 300K)
) g1 x! B. [4 m2 Q. u1 }1 EEst_Ampacity [Amps] = k*(Temp_Rise [deg C])^b*(Area [mils^2])^c ) F( _3 a$ S* p6 T
For IPC-2221 external layers: k = 0.048, b = 0.44, c = 0.725 4 ^. y0 h9 S+ r- ~( f* c L) I- J
我做的一个xls方式的计算式,可以算电流的。; J% W" y' a9 q+ v7 P+ Y8 {8 @
VIA trace IPC-2221.zip
(2.94 KB, 下载次数: 505)
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/ M( y& }1 J' x7 k" R$ |补充内容 (2011-10-7 16:39):6 T9 W% f3 c9 p. ?; P" B
公式有修正,详见31#0 F) Q5 \9 a, `% w
4 ^/ P }9 q7 T# E& n( l6 g! A0 j补充内容 (2011-10-7 16:44):2 d# I4 w4 O- ^% D
本人目前等级有限,不能直接修改这个附件,请大家到31#去下载,谢谢。另外如果管理员有看到的话,可否帮忙去掉这个附件,把31#的附件放在这,并加注说明。 |
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