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PCB Designer’s si guide

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发表于 2008-5-26 11:07 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式

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PCB Designer's SI GUIDETable of Content 8 s" S; Y) W" [
Basics of SI___________________________________________________________________5 2 Q# e9 m! V3 e
1.1 When Speed is important? _____________________________________________5 " j$ \' q) D/ D- F2 v* f; J& A
1.1.1 Acceptable Voltage and timing values ________________________________5
% }- x1 E0 S  N$ y4 g5 T! h' L1.2 Signal Integrity ______________________________________________________5 " |$ ~5 X4 s) R. T6 {
1.2.1 Waveform Voltage Accuracy _______________________________________5 / c, S, x( y4 W) [* b& N
1.2.2 Timing_________________________________________________________5
, p. v) Z; V) h3 \1.3 Speed of currently used logic families ____________________________________5 : b3 Q% u2 n9 p# [; ~" E8 o1 S
1.3.1 Transition Electrical Length (TEL) __________________________________6 # I8 r+ F: r) D
1.3.2 Critical length ___________________________________________________6 + E( j0 d) ?: k9 Q% ^
1.3.3 What is Transmission Line? ________________________________________6 ; h' J' `* K$ Q# X" g
1.3.4 What is moving in a Transmission line?_______________________________6 ) U) c7 n2 J' H% G
1.3.5 Power Plane Definition____________________________________________6
8 Y4 n' X, t- v2 B0 G1.3.6 The concept of Ground ____________________________________________7
4 a/ r3 a2 {  l9 n# O* x' h1.4 STRIPLINE circuit with Electromagnetic field _____________________________7 9 w, q/ p3 c# k5 V8 J( J& M
1.5 RLC Transmission Line Model _________________________________________8
) g% l! `2 X* i, [1.5.1 What is Impedance? ______________________________________________8 : a5 L2 h' n, v2 a
1.5.2 A Practical impedance equation for microstrip _________________________8 4 K# [: F" s* s  D
1.5.3 What is relative dielectric constant Er? _______________________________9
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2 Interconnections for High Speed Digital Circuits _______________________________10

" |( ^" p- j+ N; ^$ P2.1.1 Summary______________________________________________________10
7 X& ~1 j% @; Q2.2 Examples of dynamic interfacing problems _______________________________10
8 J" X% ^4 p& w) v/ a. k5 W$ b, \2.3 IC Technology and Signal Integrity _____________________________________12 5 t+ @* U& j7 q0 E, X* n  a* A
2.4 Speed and distance __________________________________________________14 1 F2 C* W* b6 k& A- r
2.5 Digital signals: Static interfacing _______________________________________15 ; s8 y% W: E5 }, D1 G- X6 _
2.6 Digital signals: Dynamic interfacing ____________________________________16 0 f) A' L) Q4 e' l' T
2.7 Review questions ___________________________________________________18
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3 Interconnection Models____________________________________________________20
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3.1 Summary__________________________________________________________20 5 N% p" I. C" a/ e" a9 r) [1 b! `
3.2 Reference model for interconnection analysis _____________________________20 ) A8 r' J5 \" ?3 ~5 M7 H
3.3 Receiver model_____________________________________________________21   F$ {/ J* [2 D
3.4 RC interconnection model ____________________________________________23
% |: z0 j: f* }# E3.5 Parameters of the interconnection ______________________________________25 % _: |8 @# r: ]  ]4 f) t! X
3.6 Refined models _____________________________________________________26
; ~  B- J6 \1 y: |3.7 Review question ____________________________________________________28
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4 Transmission Line Models _________________________________________________31
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4.1 Summary__________________________________________________________31 ; H$ _  G5 X% ]7 K
4.2 Transmission line models _____________________________________________31 ! ?/ W# `3 r' b6 k
4.3 Loss-less transmission lines ___________________________________________32
; Q1 _" m8 s# S. m% j4.4 Critical Length _____________________________________________________34 7 f5 f& ^9 Z2 w! M
4.5 Reference transmission line model______________________________________35
  s5 h+ `3 ~- O' s2 ~/ L- z: I4.6 Line driving _______________________________________________________36 , n$ N& I, o) x) Z. R7 W7 X2 {
4.7 Propagation and reflected waves _______________________________________37 * ^" l, ~* z" A1 ?% `/ X- q0 ^0 P. u0 z
4.8 A sample system____________________________________________________39
- ]" ?! K: _7 d5 Q; ]1 Y4.9 Review questions ___________________________________________________42 1 Z+ E3 F$ M1 g  \4 H2 @
PCB Designer’s SI Guide Page 2 Venkata

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5 Analysis techniques _______________________________________________________45
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5.1 Summary__________________________________________________________45
' Z) \0 J4 v" A  }% J0 l% i" W- R2 q5.2 Transmission time and skew___________________________________________45 2 `2 R0 z) w7 a- p7 y, W' N3 L( n
5.3 Effects of termination resistance _______________________________________46 4 P0 _. ]! V- s6 s
5.4 Lattice diagram _____________________________________________________48 7 ]! Q: n" ~! [; g" H
5.5 Examples of Real Lines ______________________________________________49
6 K% U. J0 J0 B  J- R: Z4 {; j; _5.6 Simulation code ____________________________________________________51 % _2 C( M% _( q; q# r
5.7 Examples of results__________________________________________________54
1 Z+ F# W) |/ _3 ?2 L/ J5.8 Review questions ___________________________________________________55
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6 Design guide for interconnection ____________________________________________57
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6.1 Summary__________________________________________________________57
; I: C6 V! z- s0 H" s3 a; u8 j6.2 Incident wave switching ______________________________________________57 9 |0 M4 Y9 ^  g* r0 G. m
6.3 Effects of capacitive loading __________________________________________58 + i  z) o0 E- E
6.4 Termination circuits _________________________________________________59
. ^/ A  t2 `( W/ c6.4.1 Passive termination______________________________________________60   W5 e6 e+ N, ?' o
6.4.2 Low power termination___________________________________________61 9 [. {  g! P4 @- o/ n& i
6.4.3 Active low power termination circuit. _______________________________61 2 Y- z/ ^, [$ A5 }
6.5 Driving point-to-point lines ___________________________________________62 " {% h& n; z2 j% E, @4 b
6.6 Driving bused lines __________________________________________________64
* q. L& K& C; d/ D6.7 Design guidelines ___________________________________________________67
) e* L) ~% {4 v% D& Z6 _# L9 R& @7 h$ O6.8 Review questions ___________________________________________________67

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 楼主| 发表于 2008-5-26 11:09 | 只看该作者
Signal Integrity in Digital Circuits ___________________________________________70 % d( c6 ^, `2 D* i- o
7.1 Crosstalk __________________________________________________________70 4 }- q9 a. G+ M
7.1.1 Summary______________________________________________________70 , h* a% ?9 u7 s, W0 B- `5 q( \
7.2 Examples of signal integrity problems ___________________________________70
9 w# @% F- q7 n8 Z' u4 X7.3 Simplified Model for Crosstalk Analysis _________________________________71
  d  O6 N7 c8 y" `7.4 Forward and backward crosstalk _______________________________________74
5 ^% [# g+ X$ k0 o7.5 Examples__________________________________________________________76
* L5 H( ?# h, l: e  G; m7.6 Near-end and Far-end crosstalk ________________________________________80
& Y4 W" |9 T- j* j" J/ }7.7 Review questions ___________________________________________________81 & m9 u8 m* z  R5 ?  ]; i

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8 Design Guide to Handle Crosstalk ___________________________________________85

% V% I3 h( M1 m8.1 Summary__________________________________________________________85
1 l1 e- h4 r7 c) a& f1 R; U; o$ g8.2 Effects of Crosstalk __________________________________________________85
2 S3 o# r" ^* K! X) D9 a8.3 Passive countermeasures _____________________________________________86 / g* F! `  h( ~2 E0 o
8.4 Active Control of Crosstalk ___________________________________________92 9 @0 O) M/ i9 K9 \% D$ a
8.5 Review questions ___________________________________________________94
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9 Ground Bounce and Switching Noise_________________________________________97

# X# f+ [9 J; _9.1 Summary__________________________________________________________97
  L$ s3 `) f- @( N- g0 \9.2 The totem pole Current Spike__________________________________________97   @9 ^3 @8 w1 n# x+ D1 h. l
9.3 Current flow in the output capacitance __________________________________100
0 w- ^+ s1 `  w# }! B) a9.4 Total Ground Bounce _______________________________________________100
2 L. j1 }0 ~5 r+ D9 [' S9.5 Review questions __________________________________________________105   Z' @/ F/ `. b$ }+ d/ }# b- i/ e
10 Design Guide for Ground & Power Distribution _____________________________107
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10.1 Summary_________________________________________________________107
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PCB Designer’s SI Guide Page 3 Venkata
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10.2 Decoupling Capacitors ______________________________________________107
$ m0 |- I9 @+ [- `! h10.3 Placement of bypass Capacitors _______________________________________113
2 M# r# h( e. i10.4 Ground and power distribution________________________________________114
0 h; ]$ \3 I' S" Z, y2 H& \10.5 Clock distribution __________________________________________________115
1 O8 D3 i6 Z7 t5 g1 I7 I  F: W( a- m10.6 Review Questions __________________________________________________118
  g6 M4 i2 }) J& [  P9 N" g11 Laboratory Experience _________________________________________________120
- v* Q; z+ B% L11.1 Summary_________________________________________________________120 . N/ \) p. i5 M) N( C/ U
11.2 Aim of the experience_______________________________________________120
! d& Y5 f- v3 y+ W3 J4 T" d. H11.3 Generator Parameters _______________________________________________122
0 C, d% l2 y+ @) p, A11.4 Cable Parameters __________________________________________________123 " k" d  X9 w  [6 K9 [
11.5 Mismatch at driver and at termination __________________________________124 " }% @" f; Z& s3 O3 F
11.6 Capacitive Load ___________________________________________________125
! m2 C$ H5 {7 ~) K5 e3 p0 c, P) w4 o11.7 7. Time-domain reflectometer ________________________________________127 0 ~, w( J1 N5 A/ J7 ]
11.8 Driving the line with logic devices _____________________________________128 7 ?" w* q8 S9 s& w" Q+ [8 u
12 SI Analysis Strategy____________________________________________________133
: R+ f+ I" b. [" J12.1.1 A modern high-speed design methodology must involve the at least the following: ____________________________________________________________133 7 Y  H) ]$ P$ V9 p8 C7 m+ B
12.2 POSSIBLE HIGH-SPEED DESIGN APPROACHES ______________________133 ( V# ~% t; B( q1 O# b3 E8 M9 ^2 A
12.2.1 There are two fundamental types of conditions that need to be considered for solution space analysis:__________________________________________________134
3 p0 x% r, {) ~8 e/ C; z12.3 SOLUTION SPACE ANALYSIS _____________________________________135   C  j( I: X1 }& k. [6 V9 g) {
12.3.1
  B1 U6 c. z" B) L# u9 w; ^5 o9 tSTEP 1 — DEFINING THE INITIAL TOPOLOGY __________________135
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12.3.2 STEP 2 — DEFINE MANUFACTURING TOLERANCES AND THEIR MIN/MAX VALUES ___________________________________________________135 # ]1 ?. j! p9 S/ j$ g0 x+ z
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STEP 3 — DEFINE THE STARTING POINT FOR DESIGN VARIANCES 136
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12.3.4
# J  L2 S: f/ @% O/ JSTEP 4 — SET UP AND RUN A NUMBER OF SIMULATION CASES _136

' ~4 R# A4 {" R! d7 v2 P12.3.5 STEP 5 — EXAMINE THE SIMULATION RESULTS, IDENTIFY WHICH CASES FAILED AND WHY ____________________________________________136 2 {" v4 N/ n7 A$ ~5 \5 j+ l; c( z
12.3.6 STEP 6 — ADAPT THE TOPOLOGY AND DESIGN RULES AS APPROPRIATE _______________________________________________________137
* x0 F1 M6 l+ \  w12.3.7 STEP 7 — REPEAT STEPS 4-6 UNTIL THE TOPOLOGY CONVERGES ON A SET OF VALUES THAT PASS FOR ALL CASES ANALYZED __________137
, `: z$ D8 i2 `3 d2 @2 ]# Y1 J12.3.8
1 A: v9 k( c3 B3 o% e. G- mSTEP 8 — DERIVE DESIGN RULES FOR THE TARGET CAD SYSTEM 137
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12.3.9 STEP 9 — DRIVE THE CAD RULES INTO THE CAD DATABASE, AND USE THEM TO DRIVE THE PLACEMENT/ROUTING PROCESSES ___________138 ( q4 O" _5 M( p' I  T
12.3.10 STEP 10 — POST LAYOUT SI ANALYSIS ______________________139
9 I" G3 c/ R; t1 ^) P12.4 CONCLUSION____________________________________________________139   h7 ~/ s* d  T! i1 ]+ Q) S
13 Glossary _____________________________________________________________141 7 |$ c& F( P# Y2 s/ M
PCB Designer’s SI Guide Page 4Venkata
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