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The
/ }2 r0 C# i2 Q. f5 p) j9 wleads of components are connected to ground 1 N& M! j" H ?" U( E* ^
or power by soldering them into plated through 4 e! a, R0 P; {) r* V- Q
holes. Since copper conducts heat well, solder-* A0 i) T0 X, Z( W7 L
ing to a plane layer could require an excessive
; j! [" J5 w+ z1 b+ X1 G, xamount of heat, which could damage the com-; U9 ~; u& F% W
ponents or the plating in the hole (called the barrel). Thermal reliefs are used to reduce the path for heat conduction but maintain " E; z5 n, ?! Y! T. C
electrical continuity with the plane. |
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