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contents
4 J: D0 e# P# F$ ^, q
5 {( r6 `: G" r+ s, E. T1 Introduction ................................. 1$ l/ i) l( T7 ]' I5 Y
What You Will Learn from This Book ............ 1
4 E( x8 w: I A. s5 h8 k) L6 NWho Will Benefit from This Book ............... 2( A& z* l# i. K' T
The General Format of This Book ............... 2' ] N' \+ ]. a3 `. F8 ]$ }/ u q
Why Measure .......................... 30 X4 W1 Q; n7 s. s
Obtain or Validate Data ................. 3
0 J# x0 l4 g9 L5 N8 q. pDesign, Selection, and Optimization ....... 5. G& d9 a4 P7 @& ]% R
Troubleshooting ........................ 5
. _$ D5 u; s0 j/ MValidation or Verification ................. 7- ?3 S! T4 v% p) O0 V. Q
Terminology ........................... 7
+ \' E! Z* F. k6 u# v: q5 c) P9 K 2 Measurement Philosophy ..................... 11
7 d9 u: c$ r5 m7 G2 mCause No Damage ............................ 11
9 c" l% t, d6 z& B7 m" J/ bMeasure without Influencing the Measurement ... 11
! g3 N$ V1 |5 r* s5 W+ PValidate the Test Setup and
9 y! ]2 C# q5 U( ?- dMeasurement Limits ........................ 12. G. z+ f! V8 a/ m+ r
Measure in the Most Efficient and Direct Way .... 14
' U# J6 o$ q- X2 e9 W. zNoninvasive versus Invasive " ~- T% G# m2 }& R$ n5 X
Measurement ........................ 146 O8 s) N; Y: Y- ]9 ]" _5 h2 Z( x
In situ Measurement .................... 14, E2 e6 T, R7 y* ~* y/ v0 p
Indirect versus Direct Measurement ....... 14- c# W1 q6 B( {/ ~# Z; `% c
Document Measurements Thoroughly ........... 159 O; q- b& }$ m9 j3 S0 i- _# T, G
The Test Engineer and Contact
/ l/ i5 }) ?- r; {! ~' |Information .......................... 15
; t# ?& ?5 O$ `# D [8 OThe Purpose of the Test .................. 16
0 P, m6 k3 X6 p0 aSimulated or Expected Results if
* w* h/ u4 ~, A7 B, |5 gAvailable ............................ 17
0 e5 _+ L) x" x4 F" r" W) [- hThe Date and Physical Location " Y; h$ |, Y/ w2 s R. S3 I
of the Testing ........................ 18
* J( r. q! q9 o! W( ~: d/ Y0 ^Operational Test Environment 8 Q/ d5 @0 G. K( w* t/ ~4 V5 [
and Conditions ....................... 187 W3 l& j B3 ?- E9 l/ m
The Model of Each Piece of Test Equipment 9 ]) Q* c' P+ @: i4 }
(Including Probes) and Verification That
! w6 U s* Z1 x: h6 `, q: t( NThey Are Calibrated .................. 18
' z; M$ z k l& ySetup Diagram and/or Picture ............ 19
4 S8 o4 u4 @7 d, O) yMeasurement Annotations and # e& w6 C: S( t/ Z. B
Comments .......................... 20
6 Z6 c" h& F6 `* BAny Observed Anomalies ............... 200 A u# U% M( K; f7 |: j
8 \$ w0 a! e9 v7 E, c& ~2 l3 Measurement Fundamentals ................... 215 j! ?: r) p, @2 \* u9 Q1 ^
Sensitivity ................................... 21. E) B0 K1 B2 ^! q6 t
Noise Floor .................................. 22; Q0 P6 s2 {" S' T' x
Dynamic Range .............................. 223 v1 x) E9 e% y) ?& a
Noise Density ................................ 27
3 z3 N" k: S$ QSignal Averaging ............................. 313 g8 |% |6 u: O
Scaling ...................................... 338 ~, V/ g( j a) W& ]
Attenuators .................................. 34& g6 A r+ V' d1 y( j4 I8 b
Preamplifiers ................................. 35$ {3 }" e ^: C B$ ^
Linear versus Log Display ............... 36
4 A, j. m: x& K, a9 G' YMeasurement Domains ........................ 38" e8 d5 \8 U6 ~
Frequency Domain ...................... 38! R6 z4 S( ?$ E, p# b
Gain and Phase ......................... 386 [7 i( R, u6 Z% N
S-Parameters ........................... 38
4 D# T) W# b- ?2 S- uImpedance ............................. 393 y1 W9 u# N9 I3 @5 `3 P( R' o( u& x
Time Domain ........................... 40
% H% Z5 E9 G" V6 Q& j9 v8 B9 n5 F, ASpectrum Domain ....................... 42
, [7 p' S2 d$ D) i7 f8 Y1 K8 _Comparing Domains .................... 44
+ c: m0 V7 ^* N8 }Endnotes .................................... 46
) `. w1 X- \1 U+ {. Y1 m8 @, v$ k3 U6 F 4 Test Instruments ............................. 47
$ @! D* f: I5 T/ S/ w! ]5 |! EFrequency Response Analyzers and Vector 8 t+ i4 u7 E4 |" F, P: S- F! |
Network Analyzers ......................... 47
5 l. e o3 A" ]4 Y, N: T! BOMICRON Lab Bode 100 ................ 49
2 A# p" M+ D4 \* r5 ~0 BAgilent Technologies E5061B ............. 50
# z6 p/ E8 s) {$ _8 t. M5 ZOscilloscopes ................................. 50
0 F1 m/ N- g/ sTeledyne Lecroy Waverunner 6Zi ......... 51: F9 I9 y" t/ m& P
Rohde & Schwarz RTO1044 .............. 528 `2 G) A- l- L0 B# `
Tektronix DPO7000 . . . . . . . . . . . . . . . . . . . . . . 53( A/ o. u& I# B6 ` V
Tektronix DPO72004B ................... 54 Z8 B: W9 @! {
Teledyne Lecroy Wavemaster 8Zi ......... 55
; S$ W- u* P9 e: l/ i, @. M, nTektronix MSO5204 ..................... 56 k) B; I, s6 b
Teledyne Lecroy HDO6104 ............... 56
$ ^6 O& ~$ P. a. {3 MTektronix MDO4104-6 ................... 58
- @& a. A/ [$ M, YOMICRON Lab ISAQ 100 ................ 59
Y; W9 I( z' X |8 i8 [! q! s! m6 USpectrum Analyzers ........................... 59
0 C* F# m0 V0 I" L6 H' h* B* oTektronix RSA5106A .................... 59: E- V; _8 r/ ^( Q+ s% {
Agilent Technologies N9020A ............. 60
0 x/ L7 g4 d& H$ N3 @( DAgilent Technologies E5052B ............. 61
% s6 S3 I. E0 V( `9 ^5 P& ~Signal Generators ............................. 622 E9 A* [+ W( C4 d
Agilent Technologies E8257D ............. 62' F8 u; M3 |: j
TDR/TDT S-Parameter Analyzers ............... 63
% t: ]7 \! S" J" h' GPicotest G5100A ........................ 63
K/ l8 J, |* e8 J- I
+ S, Z6 v: W7 P( E% L8 i: l' e1 e* r6 F! UTektronix DSA8300/E8010E .............. 63/ m( B3 P- [/ `0 X
Teledyne Lecroy SPARQ 4012E ........... 655 j' Z9 S) t7 m3 l# k& F( T+ u
Agilent Technologies E5071C ............. 66 _- O3 `( [& J+ k* Y- |
5 Probes, Injectors, and Interconnects ............ 69
1 D/ R' F! p# p3 B6 iVoltage Probes ................................ 69" E9 @5 Q1 J+ |+ z/ x
Probe Circuit Interaction ................. 70
% n, X9 r9 z1 h3 nFlattening the Probe Response ............ 72
) z9 v6 ]! a! z- ^$ K2 HConfirming Measurements ............... 74
$ n2 u2 V3 A7 @ _6 \: pSelecting a Voltage Probe ................. 75
2 N/ J0 B: I b# B+ j+ APassive Probes .......................... 77
/ [* l. v0 O5 v7 Y9 E+ H6 y2 UActive Probes .......................... 79) \: r3 Z# `7 I- S E* Z1 W7 [
Differential Probes ...................... 79
: l$ f; S3 h8 P$ |) W- a5 u0 o! zSpecialty Probes ........................ 80
( ^9 a8 c0 a& B+ z6 e# u9 T+ mOther Connections ...................... 91( V2 l0 U$ ^2 A" i# e7 ^1 O" Q0 D/ Z
Endnotes .................................... 913 P% v r* E! ~; U
6 The Distributed System ....................... 932 x+ n5 I9 b7 Z3 `
Noise Paths within a Voltage Regulator .......... 93# U, h( u2 Y" r" F
Internal Noise .......................... 95, o$ z7 f, h# w: J+ ?
Power Supply Rejection Ratio (PSRR) ...... 95! d! a; F+ R7 |0 X3 _! L
Output Impedance ...................... 99
0 B1 _: d1 ~! t8 x0 mReverse Transfer and Crosstalk ........... 99- O* n, U1 x9 M
Control Loop Stability ......................... 101
% T: j Y2 ^( [* y7 MImpact on Output Impedance ............ 101/ [& Y5 v) U3 s+ I( ^
Impact on Noise ........................ 102" `- Y6 r3 F2 e) ~8 ]
Impact on PSRR ........................ 102
0 ~/ k& b9 _! G1 PImpact on Reverse Transfer ............... 103
* B' a$ J0 `" t) q0 a- fHow Poor Stability Propagates through
/ o3 x$ W8 ~' C6 V$ Z9 pthe System ................................. 1031 S" x3 n% t2 e( D4 e, c( Q
Adding the PDNs ....................... 106
6 R, G* f" |& Z9 g; _/ k. f/ M I- gEndnotes .................................... 108
+ }: F9 y% w/ F6 J/ P 7 Measuring Impedance ........................ 109
/ P, k p, J4 t, M& \1 wSelecting a Measurement Method ............... 109* x4 C7 s) y4 a' D% z; |
Single-Port Measurements ............... 1092 {; E+ P/ U6 h; j0 B& v1 k8 V
Two-Port Measurements ................. 123
& F/ H2 t M% T6 A& J' vCurrent Injection Measurements .......... 139
; K3 O2 t( ?6 f/ W, T7 L E4 mImpedance Adapters .................... 142
' G- \' B8 Z0 gEndnotes .................................... 148
- C& [2 M0 z; a/ {8 d$ [ h6 N 8 Measuring Stability .......................... 151
; C r- ?8 o. e: t; i) J7 DStability and Why It Matters .................... 1519 ?8 a* v0 j/ |# Y: s
Control Loop Basics ..................... 151
5 c; v. ?4 e* h* HGain Margin, Phase Margin, Delay
' S' i- S8 g2 `8 H! jMargin, and Stability Margin ........... 153
3 z5 v$ \5 Y% t0 g- QBode Plots and Nyquist Charts ........... 1545 I r4 Z% K' D4 J9 y8 p- }
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+ m( J5 e( f3 z% o Contents
! E* e8 c; g8 W4 u- M$ R5 DOpen-Loop Measurement ................ 159
) s7 ]% p% f6 n0 uInjection Devices ........................ 161
3 }5 a2 P) d) r5 b4 l4 X; mSmall Signal versus Large Signal .......... 164
" r; |$ h& n0 B0 s' JClosed-Loop Measurement ............... 169% u' n8 r i' Q" m! p
ON and OFF Measurements .............. 170
) L7 s% B- T: L, P4 @% F$ ^ ]Forward Measurements .................. 171
6 P- `, O0 M: G) u2 c! t2 KMinor Loop Gain ....................... 171! Q) E) K* m, y P- E# K9 c, M$ O6 O+ J
Noninvasive Closed-Loop Measurement ... 174
2 `' x F# w& i6 IEndnotes .................................... 1794 b0 F. q0 u4 l0 g
9 i" l1 a5 ]) Z0 d( K9 Measuring PSRR ............................. 1819 {% E9 \1 c2 V- b% L# |5 n
Measurement Methods ........................ 182
4 i/ o! w# A7 D3 qIn-Circuit or Out-of-Circuit ............... 1828 A" X$ i9 b/ C
Direct or Indirect Measurement ........... 182
1 \, B7 Z# K L( a# d9 p+ K- n. h S3 QModulating the Input ......................... 183
( }/ V3 R! h6 E0 v# \7 cLine Injector ............................ 184; G% C) Q( h a8 o5 G0 y
Current Injector ......................... 188. v2 J4 w- ^ q. y# s4 h; ^' h* E
DC Amplifier ........................... 189
9 e+ B" b/ c( B/ l0 aChoosing the Measurement Domain ............. 189. P% H/ {, u. H3 z, B
VNA .................................. 1899 {# M$ \6 D, q. {$ O
Spectrum Analyzer ...................... 1890 G5 |4 X1 g. [0 y
Oscilloscope ............................ 1901 V2 K4 |0 ?5 _
Probes and Sensitivity ................... 190
6 `: ]1 l/ @% OEndnotes .................................... 200
8 Y( N# i$ K- ^: i8 n3 @ 10 Reverse Transfer and Crosstalk ................ 201- `5 P b- T! V2 U9 H
Reverse Transfer of Various Topologies .......... 201
: Y; Z5 i1 l% z: P$ nSeries Linear Regulators ................. 201
) p, A1 }, H+ {+ B5 NShunt Regulators ....................... 201
- h$ J& I6 |4 Z+ d+ n4 tPOL Regulators ......................... 203
/ j/ s7 ~' B: R# x, HOperational Amplifiers .................. 204
/ A+ D( ^' ]. ], R( I6 qModulating the Output Current ................ 204
& ]' v% J( b$ i- d+ n3 DCurrent Injector ......................... 205
0 \) u$ H# Q6 ?3 C: p0 Y" M" lDC Bias Injector ........................ 205
% [/ L& a& U7 j- ]' IMeasuring the Input Current ................... 205% A! {" R$ F0 b) k+ j" |8 q
Calibrating the Measurement ............. 205
7 `0 U, X/ X& ]1 Y' n9 KMeasuring the Input Voltage ................... 207
6 L, u( d( c9 Y: L" |Calibrating the Measurement ............. 209
4 h: S1 w& M2 ?, n8 e6 @4 tIndirect Measurement ......................... 209* f- s6 J) q0 @, y& t
Endnotes .................................... 216, V5 F4 \6 k, W9 ~& b
11 Measuring Step Load Response ................ 217" O/ d1 @6 b) T" o
Generating the Transient ....................... 217$ R/ ?4 n, W1 K. S. y* b% ?- W
Current Injector versus Electronic Load .... 217# {7 s; n8 {- p8 K5 w/ \! s8 G4 k
Slew Rate .............................. 219
8 [0 R8 K$ R( u. Y' J) ~ p0 nCurrent Modulation Waveform ........... 221! `7 o0 G, ~; x8 j/ y% `* J
Contents
9 }( q1 Y' b7 X. z$ j- ixi
. E8 U8 ]# F" ZMeasuring the Response(s) ..................... 223
* {# ^$ ?- r! j. V4 Y$ s: f3 {Large Signal versus Small Signal .......... 2239 s) }3 a K) n6 n9 j
Notes about Averaging .................. 2241 z4 n! o. v& ^ i1 {* t4 @1 d: {$ e
Sample Rate and Time Scale .............. 226
3 x! W/ F! S) _: xEndnotes .................................... 232
# L$ V' y, e8 f9 e 12 Measuring Ripple and Noise .................. 233( u- z0 q* @+ m: R. y
Selecting a Measurement Method ............... 2340 Z/ V, k5 Y0 E) V3 ]
In or Out of System ..................... 234
9 c9 o: q; k( i4 l8 N+ H r5 N. hDirect or Indirect ....................... 234
: Y. K( Z4 }6 N# D5 M5 j9 {Time or Spectral Domain ................. 2343 k3 E. } V- J/ Q2 h
Connecting the Equipment ..................... 235. K" b! {+ t+ \& o2 D% ~2 S) r R
Passive Scope Probes .................... 235. S: N9 A# P. E8 b1 s( r
Active Scope Probes ..................... 236
! M. S% x, G5 @Direct 50-W Terminated Connection ....... 236
g, C. i" M! v% K& l: oChoosing the Equipment . . . . . . . . . . . . . . . . . . . . . . . 237/ g- `) m( U. A7 q9 k
Averaging and Filtering ....................... 252
$ E( D1 [! ~ X q4 g1 v8 SEndnotes .................................... 252! ?. g7 y" P3 `2 r
13 Measuring Edges ............................. 253$ e4 c0 Q: |( U' g9 I- K. x# B% @- U
Relating Bandwidth and Rise Time .............. 253( m1 V. [+ k' ~$ ~' S1 b
Cascading Rise Times ................... 256
, k$ T: h( u l- i" u& P* k& tImpact of Filters and Bandwidth ! u3 q' d9 E6 e' E! Z" N* Q
Limiting ............................. 257
j3 f5 j/ o0 X6 H# z* YSampling Rate and Interleaved Sampling ........ 261
- B/ \9 M2 R% O- vInterpolation ................................. 264
6 G: z/ J" o% I% W) MCoaxial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265
* ?% V6 U$ H) tEffects of High-Frequency Losses ......... 265
) h1 p1 D; J6 b. W% xThe Criticality of the Probe Connection .......... 2672 z6 q) B- }. }$ `6 v
Printed Circuit Board Issues ................... 269
9 H# M: M* H" t; ~6 x* t1 T3 yProbes ....................................... 269
Z2 @2 U* _# X$ N% B2 Y4 {) sEndnotes .................................... 273) K$ K' g1 R" |, n
14 Troubleshooting with Near-Field Probes ........ 275
5 _1 a' g& l8 i8 jThe Basics of Emissions ........................ 275* J, }2 Z. C2 G2 w# c# _
The Near-Field Probes ......................... 277! d0 J4 s; h, i
Probe and Orientation ......................... 278# ~6 P/ I/ C: h3 A A( |
The Measurement Instrument .................. 281
; @9 B2 g; r5 w2 @7 [% u0 aSpectrum Gating .............................. 281# c* @5 ~! |% {" J& R- c3 ]
Endnotes .................................... 295
- n3 ?( G2 V: S0 r" t( {* j 15 High-Frequency Impedance Measurement ...... 2972 {% h* z0 H0 ]4 `: O7 I9 v
Time Domain ................................. 297
3 `# K/ K6 g( [2 x; ITime Domain Reflectometry .............. 298
9 J3 o7 w2 r$ D$ Q6 h* FCalibration ................................... 299
6 m0 {; l4 P8 t6 k$ R- zReference Plane ............................... 300
" U1 p8 B5 G6 gxii) X, ~7 Q5 }+ c9 H
Contents
5 W5 n) U4 _6 [$ g! o# [Setting TDR Pulse Rise Time ................... 303/ O' T" h" j& z/ Q6 w* ?9 g) q0 G
Interpreting TDR Measurements ................ 3044 Q. z' ]9 n. C4 [/ i
Estimating Inductance and Capacitance .......... 307
, ^$ e( V; ~3 M$ y/ T/ x, IS-Parameter Measurements .................... 3142 d9 m1 S0 Y3 ^. ~# T' y
Endnotes .................................... 316& `4 v( f# D8 `" @: A. f% w
Index ....................................... 319 |
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发表于 2015-6-24 00:59
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