|
1) BEGIN LAYER-----Thermal Relief Pad和Anti Pad比实际焊盘做大0.5mm/20mil
x; h3 M$ U; O+ j6 Z2)END LAYER与BEGIN LAYER一样设置
% Y. Z6 `4 r! T2 i$ \" j3 I3 ]2)DEFAULT INTERNAL尺寸如下" a3 Y. `* C! F2 ^" Z0 O
其中尺寸如下:8 |4 A/ ?, n) T8 z- w
DRILL_SIZE >= PHYSICAL_PIN_SIZE + 0.25mm/10MIL & }0 N3 X' O* r
Regular Pad >= DRILL_SIZE + 0.4mm/16MIL (DRILL_SIZE<1.27mm/50mil) Regular Pad >= DRILL_SIZE +0.76mm/ 30MIL (DRILL_SIZE>=1.27mm/50mil)
, u1 B5 H( }- t- p2 m4 H ORegular Pad >= DRILL_SIZE + 1mm/40MIL (钻孔为矩形或椭圆形时)(1mm)
$ [. Z$ R: k4 W+ jThermal Pad = TRaXbXc-d其中TRaXbXc-d为Flash的名称(后面有介绍)
`8 ~7 M0 V X, a3 O- H0 C1 k+ QAnti Pad = DRILL_SIZE + 0.76mm /30MIL
8 g* x" a# j y/ }+ S2 C. ZSOLDERMASK = Regular_Pad + 0.15mm /6MIL
0 t7 P3 _& m0 |" Z* @& tPASTEMASK = Regular Pad (可以不要)
" w6 Y* z0 r7 ] R•Flash Name: TRaXbXc-d
; d6 c3 r# ?+ |/ i: T6 T4 F其中:
1 E/ U, p1 O4 y- d* q l8 g; o; \a. Inner Diameter: Drill Size + 0.5mm/16MIL3 ?% F6 n: I8 U
b. Outer Diameter: Drill Size + 0.76mm/30MIL
" m, r) ~) c1 ?* _. v/ u) N/ Mc. spokes: # n: K' l/ t" p% h
0.3mm/12mil (当DRILL_SIZE = 10MIL/0.25mm以下)
W1 }. @- @1 W2 u1 _6 e) f" F0.4mm/15mil (当DRILL_SIZE = 11~40MIL/0.28mm~1mm)+ R; V5 I5 l7 C4 x
0.5mm/20mil (当DRILL_SIZE = 41~70MIL/1mm~1.8mm)
9 t$ g/ T* H; m( p# O7 w, A: J0.76mm/30mil (当DRILL_SIZE = 71~170 MIL/1.8mm~4.3mm), f0 x9 s, f& l) O+ ?5 R/ z
1.0mm/ 40mil (当DRILL_SIZE = 171 MIL/4.3mm以上), ?' n, `8 q3 _3 _- L# g( S! Y0 R
也有这种说法:至于flash的开口宽度,则要根据圆周率计算一下,保证连接处的宽度不小于0.25mm/10mil。2 S1 g' ^4 R5 P6 j6 C4 ?
|
|