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另外我查了一下板厂的板材结构:
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6.7 mil prepreg$ w" b" m; h8 C" L; H
0.5 oz copper (0.7 mil)( l9 t1 a" y' [7 H, C8 ~& [1 E1 q
47 mil core
; j9 N) D |" ~$ P: W5 \' Q. e2 V 0.5 oz copper (0.7 mil)
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1 oz copper (1.4 mil)' M* F5 T+ X1 P4 v
+ r, {8 g/ a. EThe substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。
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这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?
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