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; o+ k- k& d: i5 S1 a* g9 Y7 l DRC - (Final DRC)
1 o- h: R. ]5 o/ C -----------------# e; n" h. I; T( r5 v9 X" I' Y' d
* `) \7 x" _" s( y y
04:46 PM Thursday, April 16, 20156 }7 m* N/ m9 M/ I
Job Name: E:\WorkSpace\Doppler\Hardware\DS120\PCB\Board1.pcb1 k% o" I, q+ h* p) K# [8 @/ s
& e) `' F. W% \. ^( C: I2 n4 w* u& Z" H: J2 r
---------
1 E1 t9 k" H ?2 Y: v H7 R6 t PROXIMITY
# `: n0 R. P0 i& o' Y4 [, k2 G ---------
( h7 {" \$ I6 x( C( i
- K) Z' E4 t. F+ |! I, q Use DRC Window : NO
* ^: w9 l0 j$ k" Q# X) s# X. l! N0 \$ a+ v# C
4 k Q& Q6 m/ R# K+ f: T1 V Disable Same Cell Pad-Pad Checks : NO$ Q* y4 J, G) k' ?
" z3 t# R$ I$ ?' f( m* v0 q+ {2 x
5 u1 J3 y- o! Y+ d$ q- A Enable Same Net Pad-Pad Checks : NO8 y& k9 j& Z% E8 w) {, z
( W8 M+ b: z9 Q7 e( C
4 f1 |7 l! z7 o3 ~: v( }2 H Layers Specifed To Check : Layer 1/ c: O! s& y, A7 w2 L
Layer 2! j+ \( H/ _# \ K, }2 T6 P9 n
Layer 3
3 |/ p! G/ o: h: c Layer 4* ~. A4 I* h, h
/ d3 n: c8 L! v, t& _* a$ k% F0 B. M2 n
/ H f& I2 D& p+ j- V2 Z' `- R1 o7 Q3 m7 E: a% `/ i
Net Class Clearances And Rules* x' s8 Z9 e! e9 u# }4 Y
------------------------------
& ^- G8 Y/ f: R: x7 e
; @! L* V" i4 X. ^: E9 B; M7 h Components Layer 1 TO Components Layer 1; z$ s# H6 C* d
No Hazards.
; Y- l, Z, y' R8 ]0 P6 Q9 u0 f6 A
) m& k& c- y2 T) V; ? Traces Layer 1 TO Traces Layer 1+ L& _" e+ u3 |, M( [
No Hazards.9 i3 i& Q+ L7 | R4 w
( l. C) Z4 y- o# } Traces Layer 1 TO Part Pads SMD Layer 13 u# M- E; p2 H) ]. |5 ]8 k( n
No Hazards.
6 s. U1 S+ c) K$ m! M8 p2 q# q
$ _. O* A8 W5 Z' q9 v2 D* J Traces Layer 1 TO Part Pads Thru Layer 1/ V5 B: h* t0 e3 h9 d& C1 `6 m5 d
No Hazards.3 U. _4 V$ J, V& @; M3 s" ~
i, @) m! v I Traces Layer 1 TO Part Holes Layer 1* Y+ K9 U: G! b0 O: U& l u
No Hazards.
* I7 G3 J4 Z% G3 P9 ~( r1 k* S% T5 Y2 d, i4 G- m3 |6 q
Traces Layer 1 TO Via Pads Layer 1
+ l, Q2 n4 `( @; c9 s No Hazards., a" D- s; v8 r1 Q
# b. C+ h4 [* `' {, c0 O& A$ Z Traces Layer 1 TO Via Holes Layer 1
; |" a+ F) n' d: j. }# a No Hazards.' a" h4 y+ V% L9 }! V! G
$ @$ N& ]1 t5 u0 Y0 f Part Pads SMD Layer 1 TO Part Pads SMD Layer 1" K- q, e. ~( E5 K
No Hazards.; ]1 e( b% X% m, \9 \( K
; ~7 p Y: z$ V5 F; @
Part Pads SMD Layer 1 TO Part Pads Thru Layer 1) x, n o; ^4 O P l* o
No Hazards.
6 f X1 u7 X' ], C5 r- t
) W( h* b! N: u: C( L) _/ @ Part Pads SMD Layer 1 TO Part Holes Layer 13 N: _+ g( I) g" |( I
No Hazards.
6 Y- R0 P* H* c* R
7 o& S; x; Q7 G+ W) u2 P Part Pads SMD Layer 1 TO Via Pads Layer 1# u8 A# F6 b+ h- D+ Z) R. D; }) s
No Hazards.
: A' o" s' k9 e0 F' u" P
4 @/ x9 @9 q7 K) |( r, O Part Pads SMD Layer 1 TO Via Holes Layer 15 v1 X+ j: p8 h( n2 R" e
No Hazards.% I( N7 O) v/ P) l
& N0 n/ ~6 j: q
Part Pads Thru Layer 1 TO Part Pads Thru Layer 11 f1 R! o4 e1 z1 _. S e
No Hazards.
1 f8 [1 g& N/ m5 s1 q" [% P. A- }8 ?
Part Pads Thru Layer 1 TO Part Holes Layer 1
: ^0 U. {1 I4 q; H0 G No Hazards.. }, n* @" N4 f. f
: r5 f$ k% {. I* n Part Pads Thru Layer 1 TO Via Pads Layer 1
. \$ p! \6 p0 P& a( ? No Hazards.
, O' z% F( u4 p1 d! d, M6 e% W5 S C$ I* r( G: \
Part Pads Thru Layer 1 TO Via Holes Layer 1
! D% r7 w( q* z# h; v, `9 N3 X! | No Hazards.
, c$ b- m. O7 h) h$ U% t6 |/ B7 C7 E+ J0 Z
Part Holes Layer 1 TO Via Pads Layer 1# C/ g8 ]0 m0 F
No Hazards.9 v# g# u( r1 u6 ]9 r$ M
1 g5 N+ \) s+ |. |7 V Part Holes Layer 1 TO Via Holes Layer 13 D9 G! H6 r+ S# f1 `: ?
No Hazards.
4 g4 @7 G7 A" ~% l7 n* I$ @% o! b5 n; x$ J: ]/ z/ X
Via Pads Layer 1 TO Via Pads Layer 1% F7 Z; K5 s0 Y! e; m
No Hazards.2 o; c" |+ [! L% S
7 d5 K. i1 Q* w, U Via Pads Layer 1 TO Via Holes Layer 17 |8 ~4 e' j: w; Q x% R, T
No Hazards.
! n/ Z+ Q' C$ J+ g, [$ w7 D0 M2 i1 K5 A, G+ D& H
Via Holes Layer 1 TO Via Holes Layer 1
, h+ T. H+ M9 X% q S No Hazards.
' u7 m1 ?3 r* L. T" t I) \0 g* g W8 ^3 T0 m
Part Pads Thru Layer 2 TO Part Pads Thru Layer 2
3 @& S. c* _4 F1 U1 t9 v No Hazards.
2 m9 o9 B, [0 p+ x+ f# }% t* ^4 o Z( L4 C8 W' E( }
Part Pads Thru Layer 2 TO Part Holes Layer 2( B- q. b: j: u$ ^1 b
No Hazards." \3 {* r' r R3 L& }
1 ~* k9 q5 s9 B9 Z! y, m4 z Part Pads Thru Layer 2 TO Via Pads Layer 2
. S! J" C) g, f) X No Hazards.
6 z7 T5 {# }9 t2 M) ^/ B9 r) r! x& ~! {; D7 p K3 w A6 i
Part Pads Thru Layer 2 TO Via Holes Layer 2
; ]; u1 ^% l$ ]0 Q6 x# B8 ` No Hazards.
! o2 \, P# H! U& [1 u; U6 M3 n! _. e7 Q
Part Holes Layer 2 TO Via Pads Layer 2
Q$ ]) m4 m$ r* |! [+ S2 f No Hazards.
# a% ^) p d$ v" k$ m, |( _$ g. y( m8 A: W; P* p* c
Part Holes Layer 2 TO Via Holes Layer 2
1 n+ T7 ^5 T! l& _# T4 I2 | No Hazards.
. u- h" k8 ?7 F; L! K" I1 F, e5 n2 v
Via Pads Layer 2 TO Via Pads Layer 26 C& v$ R2 d8 Q X# n4 o' m/ c
No Hazards.& c% u$ d$ p; [! x0 h' S+ g- x
% ]+ M$ G+ D1 v
Via Pads Layer 2 TO Via Holes Layer 2
' b! e+ Z) w4 O' R0 M; w) t No Hazards.- F9 L) f% s4 f' G" J9 Q
, x' {3 o. R4 t6 `2 O% k/ e* ~
Via Holes Layer 2 TO Via Holes Layer 2
' R1 ?; b% j! r9 k* R/ Z$ U- u No Hazards.
' j" d! @: A3 Z3 I$ V! ]. k: ^- [3 l8 Z5 F( A- H
Traces Layer 3 TO Traces Layer 3$ I7 a/ u. g- @5 Z
No Hazards.& A- {1 d/ k) F5 }. G) ?
" s8 k, Q, m4 [2 |& B, n3 t
Traces Layer 3 TO Part Pads Thru Layer 3! P& u9 K2 E& k" E2 M" w
No Hazards.
V8 y% w9 a4 X" L |& Y) \
3 }# r8 E; D8 W9 e8 y( c1 x Traces Layer 3 TO Part Holes Layer 3# Y- k+ {: D! a% j, [+ ?+ ^
No Hazards.
/ K, [" p* m0 @% W, w! U) w1 G, S& R
Traces Layer 3 TO Via Pads Layer 3
, Q. j+ [* I$ I3 h7 Z No Hazards.
$ ^2 R4 O& i" z8 X
: [9 T, Z! U7 }4 ] Traces Layer 3 TO Via Holes Layer 3
/ [% |+ D4 U* b; I( U! u No Hazards.
- U/ X" j2 O1 ?! u3 z: x1 P3 H8 ~/ |6 L' z& W! a$ y! m7 L) B+ W
Part Pads Thru Layer 3 TO Part Pads Thru Layer 3
7 s. o0 q v2 k! e6 E' V No Hazards.
! I1 q# [* y$ d. n2 i1 T* g$ H
! H! ^. ]7 C: z. c9 F# o- u Part Pads Thru Layer 3 TO Part Holes Layer 3! J; P4 s* z9 u0 U- W
No Hazards.
$ [0 U; M0 d$ B {3 w, D, v. ^& j& P; \, Q+ r& G4 W/ n
Part Pads Thru Layer 3 TO Via Pads Layer 3
" ?6 v$ R3 P w% v0 H- `4 P No Hazards.( Q- { |7 H9 [& `
/ C& j" q) D! B2 @7 ?
Part Pads Thru Layer 3 TO Via Holes Layer 3
0 b5 V8 T1 s ~ No Hazards.
$ P& N+ o% E7 r: l0 C0 J! Q: D7 k d
Part Holes Layer 3 TO Via Pads Layer 3! N0 _: R9 K. P2 j: g$ G
No Hazards.# B7 P8 t! {# s: k( r2 P
3 B/ |% O9 m7 Y; |0 m4 f9 i' T Part Holes Layer 3 TO Via Holes Layer 31 U5 g% ?( z3 U" p0 K. x& i
No Hazards.5 y% B% I* E* s" f
& X @7 l' t4 v8 f
Via Pads Layer 3 TO Via Pads Layer 3
6 }. A* }& x; h5 R y No Hazards.' y8 s1 @6 r6 M! [0 Y- q
1 N" I S: `( |
Via Pads Layer 3 TO Via Holes Layer 37 i* U3 ?, n1 |8 l$ @6 X
No Hazards.
' S* r3 R0 @: q( I% m0 i. G+ j, k5 P* Y% q% w- s- u4 i
Via Holes Layer 3 TO Via Holes Layer 3$ s3 ]2 S8 m$ c* L8 Z6 R! }
No Hazards.2 Y, L9 y" z4 i/ ]
5 c; L1 X( [1 F' ^% I5 c+ ?2 W
Components Layer 4 TO Components Layer 43 a$ J2 K9 X$ h( Y6 g# {; n
No Hazards.+ ^, [) Q: X+ d% q
@' _& x) [7 k
Traces Layer 4 TO Traces Layer 4
& {7 Z: o" F: _* O+ I No Hazards.
6 p- y2 F7 {; d* f8 L, h) b2 J
4 [" \) m: v8 O% s9 R7 W: w Traces Layer 4 TO Part Pads SMD Layer 40 C6 K0 P+ q6 \% }9 g. o/ G
No Hazards.
' F `( | z/ w' a
8 X2 w* b! p, b ?% Z9 C$ } Traces Layer 4 TO Part Pads Thru Layer 4. g/ `: x, I" @1 h3 W- H- R# A
No Hazards.
* P; X. ?, Y$ v+ k3 C* l( V( e7 W" O }4 n) L8 ?
Traces Layer 4 TO Part Holes Layer 4
, z; g h# |4 y! _ No Hazards./ l! `0 U: u3 }+ j4 {# B1 X
2 L( l! W' F6 x0 @7 Y
Traces Layer 4 TO Via Pads Layer 40 A2 d( g# S; y0 j
No Hazards.2 d( i# _! V5 V: R$ ~% q
: v' j# H7 I; t+ H5 T$ @
Traces Layer 4 TO Via Holes Layer 4# B$ n) Z$ H# ~9 q7 h8 ^
No Hazards./ n2 O% X0 }- L6 s& W" i
+ }: A- y0 c& G" L
Part Pads SMD Layer 4 TO Part Pads SMD Layer 4. V& p5 p2 ]. P, h
No Hazards.
( X; ~8 g7 t2 [$ m2 i& ~6 @
9 ^7 ~7 J: K v Part Pads SMD Layer 4 TO Part Pads Thru Layer 4+ L3 s! w9 V0 ~ s! m
No Hazards.7 X5 l6 B" S' \' w1 I- Y( ]5 v$ Q
: } ]2 r5 M& N' k; w% ] Part Pads SMD Layer 4 TO Part Holes Layer 40 U! p+ |$ q( q+ W- o3 w7 z
No Hazards.; J& _, T3 ] j9 p. ?
# l% l3 `+ C- j" a, ?& @, M' e) B
Part Pads SMD Layer 4 TO Via Pads Layer 4* T; S" x! \( ]. Z5 q. r5 I* E
No Hazards.
: E; ^: _" ~. Q: g: e; Q$ a$ h, f; l, w7 ]9 q% ]/ h$ \/ X6 V
Part Pads SMD Layer 4 TO Via Holes Layer 45 J9 F2 a6 w8 w0 n
No Hazards.
0 Z ^ @- i0 x/ X# z: j: u4 p* ]6 R2 u# B) g2 }) g& i, A
Part Pads Thru Layer 4 TO Part Pads Thru Layer 4' ~& ?8 ?- T2 n" Q$ W+ L8 E. ~
No Hazards.- e0 h$ g$ v, K9 {
! J/ Y" ^3 J) c6 ]- e, ?4 w- b; G; g5 | Part Pads Thru Layer 4 TO Part Holes Layer 42 Y# B, u* b& l/ t; r/ E- I
No Hazards.
7 k8 P7 u; }. @: u X6 I
" H" n/ B; C# A9 I+ ~) s1 Z+ B8 r Part Pads Thru Layer 4 TO Via Pads Layer 47 N( H! a% U% N, [
No Hazards.* K' D) K' o! Q
" o- L7 @% [* F; l Part Pads Thru Layer 4 TO Via Holes Layer 4
" j6 B+ S! D# D, J& z6 [ No Hazards.
! [# [+ ^" S+ G1 Z& B
/ e; e+ n/ W0 r/ B+ v1 O, ?2 p Part Holes Layer 4 TO Via Pads Layer 46 d6 n0 K6 g2 [8 u( d$ C
No Hazards.
" m4 `6 D x7 _( M, A
1 a% \. A" k" L) { Part Holes Layer 4 TO Via Holes Layer 49 T' z5 J! K) _) K: |- X
No Hazards.
) v; k6 G4 e a
8 r/ _0 s( \0 { Via Pads Layer 4 TO Via Pads Layer 4
, T% ]0 n5 i) p9 A3 f1 _, n+ I No Hazards." E0 y0 t5 w* q* v1 b0 q
! o+ A' M' O! u/ f; D2 {9 c Via Pads Layer 4 TO Via Holes Layer 4
, z1 i8 `4 r" g* w No Hazards., o9 ?, n% `, L7 e+ W" ^/ Z/ @* ]
, R% I3 }5 B' J8 q4 m% R Via Holes Layer 4 TO Via Holes Layer 44 U' G/ C; Q* c w2 U* ?7 e, O. Y& c
No Hazards.: i' o7 u8 B0 I ^7 j' ?
, f! v, ?" `- G# d
. h* b' R! ]9 V& | Total Hazards Found : 0
: H( P& U( O% W7 i' l; ?. Q! u S! }- _3 j& s. Z
0 y+ }$ F1 Y8 w$ t: \
8 J1 i v7 a x0 G
( A- Z& o( L" d+ d1 N5 H
Planes Clearances And Rules3 U3 \& a! Y, }& V8 L
---------------------------
1 z# a( ?" t8 L( d% F$ n+ }# P. s8 j9 Q. W
Positive Planes Layer 1 TO Part Pads SMD Layer 1
, a1 u4 ?" z9 o- z/ C No Hazards.
4 e7 d- I; n4 {- R
! N s5 I4 T( [( r Positive Planes Layer 1 TO Part Pads Thru Layer 1
" B) ?& q; ^( ?, e# P No Hazards.
$ b2 K* I# w3 X; x0 K( b' ~2 I- k; l# S7 {
Positive Planes Layer 1 TO Part Holes Layer 1& e2 Q& G( N7 H, b4 d+ `6 n
No Hazards.
) h. D5 T* C- \2 M. @5 z5 y8 M' G- ^7 K& u' a. G8 ^( b2 A
Positive Planes Layer 1 TO Positive Planes Layer 1
1 W! a2 U) o) _- W No Hazards.7 _+ d D: a6 P& }
2 s" N" x/ a1 d$ J2 u& J
Positive Planes Layer 1 TO Route Border
7 }# Q/ L- k* q/ R- V x8 Y/ R No Hazards.' c; I! f; m5 c* s- \
J) | Q: `- S7 B( P" M- b Positive Planes Layer 1 TO Traces Layer 1! S% z5 w2 ]' Q, c6 T! f' ~
No Hazards.
' Q* o7 x0 z$ T2 U- L) n; o- _& b" D3 |" B# t, M7 o3 @$ E
Positive Planes Layer 1 TO Plane Obstructs Layer 1& Q( c0 ~. L$ ]4 F; d
No Hazards.- H E9 _( T" r; O8 A0 O
& H; ^+ U3 B/ n- F) G+ J Positive Planes Layer 1 TO Via Pads Layer 18 ~1 v5 w2 r& c/ v5 _4 P
No Hazards.
& i& s3 B! {1 z, o. l
- R' x8 Q' ~) f7 F1 t9 m& I Positive Planes Layer 1 TO Via Holes Layer 1! ^7 a1 G5 p: L& b- b
No Hazards.
2 ]5 d& ]# W7 m* ]" M7 k' p6 a
7 {, M6 R# P2 w- A& b+ k" B Positive Planes Layer 2 TO Part Pads Thru Layer 2- I# K. b* x5 m: V4 @
No Hazards.5 B. U) X: g" x! L' v
& k3 o0 r6 E8 Y% N0 u6 Q
Positive Planes Layer 2 TO Part Holes Layer 2# C0 L! M9 R0 T2 s5 q& S
No Hazards.
j& {! D* R2 i0 W0 g3 [9 s
0 ?4 N4 X, l) e- ] M Positive Planes Layer 2 TO Route Border% E8 M& S$ x, d+ a/ i; l8 v
No Hazards.
, C9 L w) M$ w- g+ L" }- X5 Q5 s/ S) K y0 O' g3 r' i" l
Positive Planes Layer 2 TO Via Pads Layer 2) ]- f7 s" }5 a+ a) i1 ?
No Hazards.3 W/ X o# C! U
$ Q- Z2 f. Q; X) ?2 V+ q Positive Planes Layer 2 TO Via Holes Layer 20 B$ ?) h9 {1 T- H7 f: R9 c- b' f
No Hazards.
. |' N7 x" O* |9 A" I/ R+ Z/ G
& |9 Y2 r5 R$ N3 m, q Positive Planes Layer 3 TO Part Pads Thru Layer 3+ r( ~0 H+ y/ H; H- n l
No Hazards.: z$ _) o, L2 a1 _% `
7 h: Z o" P. w6 f' ?
Positive Planes Layer 3 TO Part Holes Layer 3& e5 i4 t- e0 D3 {, U
No Hazards.
+ T- i0 G1 p: f* K1 @, [! z% t. G9 h' t" o! P D
Positive Planes Layer 3 TO Positive Planes Layer 3, P% E2 | W) n# s* I
No Hazards.
( S: V/ `$ [5 [5 |6 |
5 s6 O; Y7 t7 d0 `' U& J. ]4 z Positive Planes Layer 3 TO Route Border
! b: l0 [( J. n; C/ c+ y, P: c No Hazards.
: U3 d4 J9 L3 e1 Q0 k' T, y0 T2 R g5 G' E
Positive Planes Layer 3 TO Traces Layer 32 T. J. \- S. K! l- q
No Hazards.! c+ z6 {& L9 K& s8 \/ r$ a
8 H3 y8 G6 G$ E1 [- t0 o9 h5 z Positive Planes Layer 3 TO Trace Obstructs Layer 3
" v! z3 I3 `3 {" P. i No Hazards.. G9 i! U o+ H, F$ m/ k D1 ^
6 h4 W' I" @) q! c6 l0 `
Positive Planes Layer 3 TO Via Pads Layer 3. ~0 F( a( W8 n& v/ d
No Hazards.
4 g; R+ B( j5 ^6 F& q! h: _* [6 H p" c! A
Positive Planes Layer 3 TO Via Holes Layer 3
9 b" z" }/ M8 i( A' q9 f No Hazards.
; H& r7 K) P7 w* c; ?, T Z' G p. q, \3 ?# u6 A5 y1 o- h
Positive Planes Layer 4 TO Part Pads SMD Layer 4
8 C: c \% n5 s- z: \ ]5 O No Hazards.
' x( k- F1 o% @5 k0 p: f, H6 A9 ?: C0 F9 A) J( k% e( P
Positive Planes Layer 4 TO Part Pads Thru Layer 4
, ^3 p3 U$ A/ v$ }, a4 a% T No Hazards.
$ w3 ] R. A2 z" z9 N' y( g9 U
# H% U: c! b1 ? Positive Planes Layer 4 TO Part Holes Layer 4" a! k: z% J8 B$ A9 ]2 k! m" d; u
No Hazards.) C6 k4 Y& B7 A0 L
0 q% C3 j! C3 c Positive Planes Layer 4 TO Positive Planes Layer 4
# m6 o$ \- o4 g3 C6 n0 m+ V' t# ` No Hazards.
" N1 l3 k$ `; \' y/ `% K! V, h* L s" h7 V. K% ?( t: A! I
Positive Planes Layer 4 TO Route Border
5 K: M0 W' p! }/ G5 P/ o' l* p' Y No Hazards.' P3 l) t1 l5 O/ n8 e6 ~
" @5 q) {7 J6 m/ [% G$ Y
Positive Planes Layer 4 TO Traces Layer 4% f- I* [6 J( }8 g: l! H( J
No Hazards.
' H3 a: ?$ Q6 P' k0 B# O) N1 X; Y( e) i/ E1 l0 b4 b z9 y; ^
Positive Planes Layer 4 TO Plane Obstructs Layer 49 q- |* t3 [% A$ o
No Hazards.
6 V+ f5 k1 A P# o# Q
2 o# ~8 T: O2 ?/ d6 {1 A Positive Planes Layer 4 TO Via Pads Layer 4
# ]2 E( T7 T$ Y. N* }: B% k. [9 l No Hazards.+ Z' _$ s) \2 X# a0 X7 m% }
/ @) r$ X7 `8 A8 N8 e. s4 ^/ v Positive Planes Layer 4 TO Via Holes Layer 4' A. ~ K( ^0 s1 o1 I
No Hazards.: T9 g# H8 `( T( t( D* j1 [% m* @
* n2 A5 \; a ]
+ C6 d3 c" n! C! o" c6 J) k Total Hazards Found : 0& u! b2 F, _' w9 y1 l
. B; z0 r! }. w2 z, A1 U: I7 L# z
4 F( Y2 g! w8 \% G8 t4 l/ c8 @% @/ Q' ?) o& ^1 H6 \: y
" }% ^. T$ U9 [" Z1 ]5 [ U. h
Non-Net Class Element To Element Clearances And Rules0 c4 D a1 c* I- W
-----------------------------------------------------% D2 q% G' F7 t2 ]9 x) ~! }& _
( X8 t5 D" y2 J6 V% t) c Route Border TO Via Pads Layer 1 Clearance: 0mm
; e. L2 Y. `5 s, S- | No Hazards.
2 ]/ s: J! x1 C7 x2 c8 v2 b5 y8 f) @) b) x6 p
Route Border TO Traces Layer 1 Clearance: 0mm S7 r" c1 p* X. I, r8 P
No Hazards.
" z9 @3 L$ g5 O; E7 X a$ [& W; I; x9 d$ j. R9 W7 Q9 U7 B; h9 R
Part Pads SMD Layer 1 TO Route Border Clearance: 0mm
& i& B, Z8 y9 T1 {$ W8 O5 v* x No Hazards.0 K( S4 E- `+ B( o, r; c
0 F! O6 y' {- U0 M, S) a
Part Pads Thru Layer 1 TO Route Border Clearance: 0mm) B2 v# P ?: ?0 g6 D2 Y
No Hazards.# B& N2 a* V7 I6 }- K
9 s* q$ H& j2 [
Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm3 X. H4 s: c( a* h, N6 Z# ]
No Hazards.3 ~* n) m) v% f$ s, r, E/ q7 h
: M) Y, ]6 p+ N8 U f0 P6 V9 ` Board Outline TO Via Holes Layer 1 Clearance: 0mm
d$ [% r4 _9 D' y8 t5 K No Hazards.# Y2 A8 W" W O( ]2 _: i& v
7 q& F2 c4 z {
Board Outline TO Via Pads Layer 1 Clearance: 0mm" @9 m4 g* ?/ E
No Hazards.
" \; C% |8 j( a; b$ H0 l e( u
. M8 V, d8 e2 r& E" I: G7 h7 Z Board Outline TO Part Holes Layer 1 Clearance: 0mm+ I8 K' L3 M( F& V: F, S
No Hazards.
# i! L1 @( E( l/ P, K( D9 C5 X+ O; ~' |" L8 K8 ^ O
Board Outline TO Placement Outlines Layer 1 Clearance: 0.25mm( B" x! C) A( x' e+ g: U E! p
No Hazards.4 _0 y" A5 s3 k
2 v& m6 B, e9 N, H5 d, }
Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm
9 g+ A/ |5 D/ y) V No Hazards.
& R+ R4 R# N7 p1 r6 U3 L' U$ j0 C! C5 j- i
Board Outline TO Traces Layer 1 Clearance: 0mm% T; @9 }7 y* }8 M5 l
No Hazards.
( o9 Y+ q" S* t! m3 i' S6 V
" }& Z: U6 I$ ]+ y9 y* n5 ? Route Border TO Via Pads Layer 2 Clearance: 0mm& [5 N2 X* m; C0 O3 @+ U- Q2 O) z
No Hazards.
- }7 j* r, G8 |, y2 _- w6 I; m
+ y" ?) V2 E& k: A2 N5 B6 r, _ Part Pads Thru Layer 2 TO Route Border Clearance: 0mm% q5 }" O: s3 u' H
No Hazards.6 F( O' R* W% @( y5 J0 {. I F
7 @% A$ X/ @; e* e% |# l
Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm% ~, s. k1 }" p0 C! ]& I
No Hazards.( f. H2 ]/ O' }7 o! i. D, k z
# a8 o; b$ o% H7 r: y
Board Outline TO Via Holes Layer 2 Clearance: 0mm1 W$ F8 l0 S' {5 {4 o, N( E
No Hazards.1 i% H1 Y+ @6 T1 E3 i2 _
# d$ P$ Z, d& t! S. q
Board Outline TO Via Pads Layer 2 Clearance: 0mm" y) d! w7 m" ^
No Hazards.
4 P. R& \+ j% ~* a* s) K3 t% G- C2 P
Board Outline TO Part Holes Layer 2 Clearance: 0mm
" d! `5 x3 r j: Z/ y No Hazards.$ Z+ ?7 p/ C# O1 @2 M
+ U$ T2 F4 Z# B. V
>> Via Obstructs Layer 3 TO Via Pads Layer 3 Clearance: 0mm- l' Q: ]& O7 ?. {. y) N5 v' e, V; O: W
Hazards Found : 69 s# H- X0 F& I1 F, L
% T. B+ [# b6 ]& q5 w >> Via Holes Layer 3 TO Via Obstructs Layer 3 Clearance: 0mm
4 Q1 h' P2 A2 k Hazards Found : 6
) X$ M' s0 u; H" o, Z/ a
- S4 d, c$ a+ ]" {1 _: w >> Traces Layer 3 TO Trace Obstructs Layer 3 Clearance: 0mm
' e) ?' A# l# G2 j w5 F2 x' |$ E. b Hazards Found : 1
7 b. b8 C$ e3 p/ @9 J9 V+ C
: z& X7 _% N8 i3 }5 t' i) W Route Border TO Via Pads Layer 3 Clearance: 0mm
: C# e( H7 T3 J No Hazards.7 v) \( g' Z5 q/ n
7 i& a$ D# j+ i Route Border TO Traces Layer 3 Clearance: 0mm7 n; Q3 m3 ~. J8 q4 B
No Hazards.
1 U6 F. e6 B; f: w& H" o
6 D. u! z5 g' b* E+ J0 e Part Pads Thru Layer 3 TO Route Border Clearance: 0mm, H0 N% N0 ~. X
No Hazards.
" v) l3 h9 m; ?& O) a# f/ y' g; Z* {( e% v$ Q. \3 J
Board Outline TO Part Pads Thru Layer 3 Clearance: 0mm
! C7 J: q7 c) A9 I No Hazards.
2 q- Z5 p0 U0 g
9 Z# j- m/ `) A+ N# o8 P* O Board Outline TO Via Holes Layer 3 Clearance: 0mm6 Y9 C: X: Q5 ] \" N
No Hazards.
" s1 @ u" [5 t% U% ^
0 q8 s6 m4 i0 j0 X Board Outline TO Via Pads Layer 3 Clearance: 0mm
5 d9 K% _3 y. E7 }6 t' n) Q1 B0 K9 D No Hazards.) R `* t' @- N: K6 [! ^# ~
% |$ G% b1 n- g+ l3 @ Board Outline TO Part Holes Layer 3 Clearance: 0mm
& w' X4 J" X) O" h3 h2 x8 L4 f No Hazards.
, w: s! [8 s7 n% U/ P1 v5 q% D' W- b3 {
Board Outline TO Traces Layer 3 Clearance: 0mm
2 _+ _" E* ~* y% c/ |- h7 \7 j, l No Hazards.. U4 g) I* N# e2 Y
, J4 U# c) {- D Route Border TO Via Pads Layer 4 Clearance: 0mm+ n ^7 J4 z+ N4 {* u' H1 o
No Hazards.% ]0 L, R* q$ s8 r8 l
* P5 P8 m J7 k2 ^' s8 `" E6 e4 q" ^( ~ Route Border TO Traces Layer 4 Clearance: 0mm0 B5 Z3 `" ?, L4 X3 d W# h7 H- U# o
No Hazards.6 R, C/ c) [2 I; p# {5 l$ M
7 A4 z* D% k3 c' b, c Part Pads SMD Layer 4 TO Route Border Clearance: 0mm
! k3 s/ E$ }# |9 J8 p No Hazards.
4 V2 b3 h: ~+ X0 ~, {" D0 b1 A* W8 A/ c; W2 E# q7 v
Part Pads Thru Layer 4 TO Route Border Clearance: 0mm
# \: {. f; E7 c* c" C ~ No Hazards.& t7 S ^8 w( q3 U
: W9 L% r: X8 d
Board Outline TO Part Pads Thru Layer 4 Clearance: 0mm6 x* m# U& G2 O6 `
No Hazards.
7 e" q( H7 L7 m& K6 H8 p+ g, w/ c0 o! j# x8 m
Board Outline TO Via Holes Layer 4 Clearance: 0mm8 f, S% ]/ h, B1 H p
No Hazards.
0 ]; M( S; D; T2 n2 S: u* }) y. g% m$ M7 h+ d
Board Outline TO Via Pads Layer 4 Clearance: 0mm
' w" ^( w. A+ N Y3 S2 v7 w No Hazards.
8 l1 H) T, s- V- ?% x# x0 z, x
* e) f) u4 P. O' L) a0 ` Board Outline TO Part Holes Layer 4 Clearance: 0mm
. ?( _" A" S) R; y No Hazards.
% ~2 A8 P! x( c4 i0 K, r# @2 x, X( _3 i A/ I
Board Outline TO Placement Outlines Layer 4 Clearance: 0.25mm% m) }- |! y0 s- M/ {
No Hazards.
- _9 g7 E M5 n/ z) i5 ]1 [2 X/ I- U% L+ }
Board Outline TO Part Pads SMD Layer 4 Clearance: 0mm$ \: n; v' q2 T
No Hazards. X! Z/ V4 ]4 R0 g8 f
3 E! c2 j; K \9 }
Board Outline TO Traces Layer 4 Clearance: 0mm
( \5 G1 o; P6 \1 x4 X) K No Hazards.# f0 A: o. L C- R, Z: w7 c
9 N. r8 x' y- j4 i# n% b
3 C9 p; Q; ~+ Z7 z Total Hazards Found : 13
' E/ X/ @3 {/ n$ W9 E* @
5 o% v3 ]: P& g# h/ [) p' K& X2 V% G; k
! ]% N4 @# p4 x- _8 R& m% R Total Proximity Hazards Found : 13
. I4 x7 {! r, W# s
# N G! _) K8 q) I* k( F F5 f1 S
! p9 a1 @$ ?" b- {, _2 K
1 S% V# J' R+ T, v ----------------------------
; G% `1 h' Y( `; E2 V CONNECTIVITY & SPECIAL RULES
4 M8 G' R( p) g9 Q ----------------------------0 a# J9 R, z; u+ x
7 P0 z; k/ r/ |4 h
- J/ b3 m9 ~4 w; x/ G# ^ Check For Unplaced Parts : YES# W0 I. T, g4 T% e# ]
No Hazards.2 ^* `! K6 i* B( _9 ]/ g2 |! T" S
' t- x K5 b3 v& r
( I8 X$ }- p0 Q! e) D Check For Missing Parts : YES
& U% F. F4 p. Y4 ` No Hazards./ q1 o ~5 U O0 v/ `& I4 K
) d, p( u; H7 r4 ?) _/ D" q, h
: ~4 C" ]2 O! f3 o5 ~
Check EP Component Hazards : YES: p/ {7 [% x: G; v7 m
No Hazards.
6 }; v) \7 c+ E
, X" s: L2 q0 e! J7 r7 z
/ j$ E5 o; F; E. h Check Trace Hangers : YES
9 t* g) |5 h1 O6 Y% G0 c0 p No Hazards.( f) D P; k0 C4 H
" d+ k6 `& x; `) b9 M: o
/ S, m8 V8 @% Q+ R Check Trace Loops : YES
) ?/ ^" @5 J6 ~+ R% p No Hazards.
) K. ~; z8 M0 w k9 B0 z; B# g0 K! A* [4 t& M4 h) g
4 l, G& r8 {. M+ a4 P
Check Trace Widths : YES& G* C; e) \4 s6 t7 v
No Hazards.$ }6 j' v. V# M- N: H$ b" g
; i; ^) S: ^5 d8 S/ G2 P
$ c( t n- Z; Y
Check Single Point Nets : NO
5 n$ R s1 x3 X* u: [
: @- X- h- s7 M" K5 W. J/ y1 ^+ `5 D
Check NonPlane Unrouted/Partially Routed Nets : YES
1 `3 o3 b" Z/ c. C& v' F No Hazards.8 Y2 `9 L9 N, G9 M; P1 q# i" N% k
; n" U" |0 [/ \1 `
3 H5 R! ?% |6 N( S' ~
Check Plane Unrouted/Partial Routed Nets : YES2 \% @3 A/ b, P p$ E9 D
No Hazards.
5 q( z9 H" f& p, q4 F
2 s, o9 ^, D% \" e
" E7 b6 L; d+ G$ R4 T+ P/ C0 i* h Check Routed Plane Pins : YES( d6 @7 i6 E- b5 I: _" O
No Hazards.# }- Z \& [ j4 g
2 J6 g8 `" v8 i* ?
1 I' J j1 \" j1 \) u: |- j' N Check Plane Islands : YES
7 X7 f- C, ]2 m- W. ~- q: `4 f No Hazards.
5 u4 w) K' Q) a* R2 b# E6 |5 N/ I# ]
+ v# t) g$ ?! l& {2 d" ]& d7 K5 A% N4 a. P" ~: T2 I6 U
Check Dangling Vias/Jumpers : YES
3 F, i) F% ]% D% L No Hazards.
- u8 [- h6 Y# Z2 N
# D4 A$ l8 N0 b2 f
5 d& U% H; ~' U4 Z, L5 R( r Check Unrouted Pins : YES. v( j% i3 k S0 r& i6 x+ R
No Hazards.
, O5 r/ Z; Z8 @7 S2 p6 H- `& T" ?8 P; n& b/ t
* n/ I6 U( x% l: L
Check Routed Non-Plated Pins : YES
0 |/ p1 v2 d$ t5 }) z% } No Hazards.
2 {& V+ p u9 b8 p
3 q3 h! n" r# ]
- G# }, r8 @2 [% ~! p( B+ ~- b2 \ Check Minimum Annular Ring : NO
7 z, K! R5 I7 o/ K0 M, S; U# ]; R, C" u+ o I3 k
7 p$ L6 K9 t+ p+ V' @
Check For Vias Under SMD Pads : YES T. p( _* C# G! o- l1 n
No Hazards.
. l* Z( a5 ?* I* ?3 g% w$ c+ g, R5 }5 q/ M# K$ Z/ h
" h k( v- d+ A6 w1 K- I: O Check For Vias Under Top Place Outlines : YES
4 ]* L. D5 n0 M- `6 s$ v7 V Hazards Found : 25
" d5 I, {5 d( b/ P
( b3 T x. P% ~
% d8 {* T1 L7 T: Y" F1 ?7 B Check For Vias Under Bottom Place Outlines : YES
, ?& s$ D1 [, k7 i; R& @ Hazards Found : 11 j. @9 D$ G0 F1 P1 P, D" B
4 m+ F0 R* y6 x% ~
) t! s" v3 P. r0 Y9 A3 h Check For Missing Conductive Pads : NO
) y4 K. d, P: u8 X9 ]5 V8 M
$ B: \. V) T5 C. N+ p' N4 Y/ i# E+ a V, m5 I
Check For Missing Part Soldermask Pads : NO
& R7 ^0 f8 N' @2 D2 h/ ^1 @8 B3 }" i" `4 o6 E7 r# f/ n5 q: b
- O; Y% _- f) t" g# x Check For Missing Via Soldermask Pads : NO+ a* s' `6 d2 i# V+ T, ^; {5 ]
( T% b$ g9 x4 q3 T9 r9 W8 W+ G' l8 H' T6 q8 w8 j% n" t
Check For Missing Solderpaste Pads : NO
/ p+ g. d p; O& o# r2 m, E8 Z7 x
2 q1 ]1 A7 S$ S: {# X7 o+ e1 e5 X
D X) x$ r; r; m; b8 Z3 e7 g: B5 r! T2 O1 ]& q( S
Total Connectivity/SpecialRules Hazards Found : 36- W- ^/ Y2 J$ n$ Q
. L; W& U& H) P; h# T$ T
( Y6 r* Z6 E# t' [# S* f) D3 C/ P4 F! C( @: V
====================================================================
1 @% \3 c2 b9 r4 D" X6 j; N% A' k, x8 s) b/ n
8 g* i& z' q4 e, j) f/ B
" {6 }7 `5 d/ `6 ^( B2 p Total DRC Hazards Found : 49
# d' ^- w. ]: v+ D. k! F0 k
' ]9 y' b! V- {" M s' m
; [8 \8 k4 I) @# G! K
; q$ O3 g3 e1 g 04:46 PM Thursday, April 16, 2015 |
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发表于 2015-4-16 17:04
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发表于 2015-4-16 17:11
