allegro中的bond finger指的是什么物件？

jordanli22

看到英文解释：Bond fingers are pad stacks that are used in Package Designs (Allegro Package Designer). These 'fingers', which are single layer pads, allow you to add a wire from a die to a finger. From the bond finger to other pins in the package, such as a BGA, you would use traces/clines just as you do in Allegro Editor to connect pins of packages.

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但不是很理解。求解释。
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jordanli22

a2251247 发表于 2018-7-2 14:51
' @: A* P# e3 R" g7 Z$ P' \就是一个焊盘，通过金线连接到die上面，这个是芯片基板设计才用到的吧

可否贴一个例子看一下，没遇到过。谢谢
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2009zhaoqf

okok

a2251247

就是一个焊盘，通过金线连接到die上面，这个是芯片基板设计才用到的吧