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We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 ,mechanical via from layer 1 to 4.
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but Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias
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My question is why manufacturer changed mechanical via to stacked via?
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cost also will increase while using stacked vias?+ N6 L, ]: V1 b% Q$ L
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