Bond wire crossing near die , far die

karpcb15

DIE1 and DIE2 bonded in Different profiles. In model 1, the bond wires are crossing near DIE as highlighted in M1 picture. Is this bondable ?In model 2, Bond wires are crossing far DIE  as highlighted in M2 picture Is this bondable without short?
) h8 o+ D% y( S( VExpert pleas guide me on this
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' N9 C$ k0 u3 f7 z; a9 LBlue Color - Profile 3
Red Color - Profile 2
/ y$ v" R; B0 k0 S! \White Color - Profile 1

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zltwin

学习了

karpcb15

非常感谢

tencome

20u 最多2500um， 再长容易出现wire sweep。  
Transfer模封时，线会被模流冲弯的。很容易短路。

$ L. @$ K9 A( P/ c当然了，除非有钱可以换成Compression-M， 模流小，金线可以再长点。

karpcb15

Thanks amao!!
For my case , wire dia is 20u and the wire max length is 4300um in 2D , What's the problem in greater then 3000um bond wire length ?

amao

Hi, case by case, in gerneral ,it constraint by wirebond diameter ,height profile , and lenth of the wire bond.  all this can be confirmed by different package factory. So you should determind which package assembly factory. max length less than 3000um is acceptble.