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另外我查了一下板厂的板材结构:
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1 oz copper (1.4 mil)
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47 mil core; R0 D' R' G% p: g _; |, j4 V
0.5 oz copper (0.7 mil)
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0 H: X! l7 [ _0 x3 o& L 1 oz copper (1.4 mil)
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# f! d0 J! O0 {3 z- g9 b1 Y5 y* yThe substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。
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这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?; g4 d$ p+ w& Y( c5 m$ g
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