可是，它的datasheet中有这么一段话： The IMU-3000 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB since soldering to it contributes to performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the die. 3 R$ \" o J4 k% J" J+ m% } / D7 I0 C( Z2 `2 K; v1 o" T是不是不要焊接上去阿？
/1 
发表于 2014-10-1 07:58
QQ好友和群
QQ空间
腾讯微博
腾讯朋友
微信
收藏
支持！
反对！
楼主
