灌铜问题求教

Energy · 发表于 2013-1-11 21:47

本人Layout之后分割好地层和电源层，灌铜时报下列错误，如何解决

THERMAL RELIEF ERRORS REPORT -- FPGA2.pcb -- Fri Jan 11 21:44:01 2013

   Drilled pads with                   Nondrilled pads with
less than 50% thermal extensions    less than 50% thermal extensions

Report of Thermal Spokes Generator.

On GND3:
      (2506, 775) # = 0
      (807, 454) # = 0
      (3125, 750) # = 0
      (418, 189) # = 0
      (2199, 749) # = 0
      (1178, 648) # = 0
      (1295, 800) # = 0
      (1256, 839) # = 0
      (1763, 878) # = 0
      (1646, 878) # = 0
      (1295, 878) # = 0
      (1295, 917) # = 0
      (1256, 956) # = 0
      (1685, 1034) # = 0
      (1295, 1034) # = 0
      (1646, 1073) # = 0
      (1295, 1151) # = 0
      (1490, 1231) # = 0

Total Drilled pads: 18             Total Nondrilled pads: 0

Report of Violating Thermal Spokes Remover.

On GND3:
      (1373, 1151) # = 0
      (1490, 1151) # = 0
      (1529, 1151) # = 0
      (1568, 1151) # = 0
      (1373, 1307) # = 0

On Power:
      (2086, 1220) # = 0
      (2334, 760) # = 0
      (1178, 683) # = 0
      (1139, 683) # = 0
      (1728, 882) # = 0
      (1143, 761) # = 1
      (1218, 1181) # = 0

Total Drilled pads: 12             Total Nondrilled pads: 0

binshenliu · 发表于 2013-1-11 22:56

本帖最后由 binshenliu 于 2013-1-11 22:57 编辑

钻孔焊盘非钻孔焊盘
少于 50% 热焊盘（也就是说只连接了一半）少于 50% 热焊盘

你可以按报告上的X Y坐标修改一下，（手动增加走线）

李泽尚 · 发表于 2013-1-12 08:45

没PCB我是看不出哪里的问题~~~~

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