看到英文解释：Bond fingers are pad stacks that are used in Package Designs (Allegro Package Designer). These 'fingers', which are single layer pads, allow you to add a wire from a die to a finger. From the bond finger to other pins in the package, such as a BGA, you would use traces/clines just as you do in Allegro Editor to connect pins of packages.! V' d' d% v# V1 i
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但不是很理解。求解释。 2 ^/ _2 ]% i3 u K3 e, l' b; U
/1 
发表于 2018-7-2 09:03
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