Designcon 2018 演讲资料免费下载

Cadence_CPG_Mkt · 发表于 2018-3-14 09:40

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一年一度的全球高速设计盛会Designcon 2018圆满落幕，Cadence与思科、富士康、英特尔等客户的演讲资料已开放，干货满满，快来下载哦！

Ken Willis, Product Engineering Architect,Cadence发表演讲

演讲资料大纲：

Reduction of Mode Conversion in SerDes Links
Performance Analysis for Next-Generation PCIeInterface
Backchannel Modeling and Simulation Using RecentEnhancements to the IBIS Standard
Temperature- and Geometry-Dependent Analysis ofHigh-Speed PCB Traces
DDR-4400 IP Model Development Using AMI Builder
Advanced IC Packaging Trends and Their Impact onEDA Tools
HSSO - Physical Structure Optimization forHigh-Speed Interconnects
Brand-New Electrical and Thermal Co-SimulationAnalysis
A New Platform Power Integrity Design Approachwith SPIM and UPIT
DDR5 Modeling Using Automated IBIS-AMI ModelingTechnology
8 h" L6 K" Q5 H