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另外我查了一下板厂的板材结构:$ I7 ^2 L, P! }4 u1 |9 k/ o! w B$ P. H! T
4 Layer Board Stackup and Specifications :
k% E% S, g: ` 1 oz copper (1.4 mil)
8 H( Y3 X1 ?4 w( x 6.7 mil prepreg# n" g. G" r3 s* f
0.5 oz copper (0.7 mil)
2 I4 J! u) X* a* B: O8 _' y! T 47 mil core
9 M% z- t% \+ e+ i7 b" i, W 0.5 oz copper (0.7 mil)
* k9 k/ y) [( ]$ n, Q8 ?9 I, Q 6.7 mil prepreg
/ I! ^% Q; R" _ [! Q# K7 k/ ^4 \ 1 oz copper (1.4 mil)1 r. I. R" X+ }5 A4 a$ u+ }6 n
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The substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。6 {+ F+ j9 w1 M# Q9 B# `
) R4 X- M. b W4 r& R2 u这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?
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