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! _* b3 h6 }8 J- S2 A' ] DRC - (Final DRC)' ]# M9 b) J0 z
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0 P; e' |+ p% s$ g+ _
! k+ P% s$ X, L2 ]6 z1 e7 p" D; _ 04:46 PM Thursday, April 16, 2015# {0 I# r% f( c& Z' h& {6 L$ Z8 i/ ?
Job Name: E:\WorkSpace\Doppler\Hardware\DS120\PCB\Board1.pcb2 J: z; k5 E2 S" o( P
6 p0 J9 b+ D; Z9 L" {! ?1 y
+ k E0 t I/ {+ Z$ S& {' H" m ---------% F4 G3 W+ K6 P6 {
PROXIMITY! O7 V6 m# y2 m+ \9 m. ]* V- J) ^
---------
( ~0 ?6 w9 q" H; |. @+ p. O 6 R* u3 j$ f7 t$ w0 N0 ~
Use DRC Window : NO
* [0 |" x5 t( f, p; h/ }6 }' G: ]$ {/ W0 W
+ U5 d2 A6 ?) r& ]( e
: i! r0 ], s/ Q' e" X- J' U Disable Same Cell Pad-Pad Checks : NO
8 i( {( o3 l& T; \5 }4 d' l5 L8 q! J1 V/ Z6 g& A8 X4 e3 S
4 L0 i, R% L5 [3 F) X
Enable Same Net Pad-Pad Checks : NO7 X& }+ k6 O/ j5 O
7 n v' @: z6 p( b- l% G) O2 n) V x
- b1 w9 U* @8 t Layers Specifed To Check : Layer 1( X$ J6 }% |# C- ~
Layer 2
2 S7 ?) v) r+ K6 L2 | Layer 3
/ f' k7 ?( |6 P, M Layer 4
2 N6 D* y; Q$ R, M0 a( e5 O0 t5 t5 o& c' X# Z+ B* l' D2 [9 c
5 q8 H. X y4 D! g2 S# I% z
( ~6 D" _2 z- }) @
; n0 e8 e# C# G h0 U0 \1 Z, k Net Class Clearances And Rules- H5 E' b5 v0 c7 U& h2 e! ?: L8 x
------------------------------( D. H( G. ^# D# y1 a; @! T4 O" H1 I
+ L/ ?- x; I2 i4 d7 z3 L- b Components Layer 1 TO Components Layer 15 z. p' y) K. S( X9 U( X
No Hazards.
5 U+ x- Y: q- h- L# V/ I4 @9 W
0 @4 s _; p2 Q3 r Traces Layer 1 TO Traces Layer 1
) a! o: w) z7 r- q/ W/ N No Hazards.
* f3 S- k8 O6 N& Y1 i
( w0 ~. g. ]( G0 e6 ~ Traces Layer 1 TO Part Pads SMD Layer 1
& y9 Q/ F; }% K9 A4 T I# _ No Hazards.1 b) G) `6 Z$ M% J* Y
/ L: E* ?: m5 S* }' n r
Traces Layer 1 TO Part Pads Thru Layer 10 l+ D% U: N5 z( J3 W' \
No Hazards.$ S" P. l: Z3 }( o/ q
9 [9 I* U% z+ ~* p7 |0 l Traces Layer 1 TO Part Holes Layer 1$ O& K# A# j9 n p2 A t- m
No Hazards.; |! d9 Y8 y( A. W* Q
2 A' \( v9 K! L# j" K0 Q Traces Layer 1 TO Via Pads Layer 11 e. w5 E. P' s+ W9 s* e1 L
No Hazards.
9 W' [/ S3 A* o1 v/ M7 f6 w
8 i, h5 d5 U* j5 z/ L Traces Layer 1 TO Via Holes Layer 1; s+ C. ~* |: t/ ` `+ m
No Hazards.( n' }0 L, R$ e5 J, e$ g3 D8 P1 D5 _
$ _6 J5 c9 ?. u9 k9 |, W
Part Pads SMD Layer 1 TO Part Pads SMD Layer 1" A) s0 T- o/ E
No Hazards.* \% C$ ]- t- E" ~. J7 c& I& ^$ C% |
9 \# ~$ E: s) l/ H Part Pads SMD Layer 1 TO Part Pads Thru Layer 16 n3 y% z) i2 h; V9 A0 y
No Hazards.
7 j. z3 V, ^* i7 x0 g4 B0 F5 R0 {! s8 H3 a a
Part Pads SMD Layer 1 TO Part Holes Layer 1
- Z4 M# B( i( Q% q, L7 T No Hazards.
4 P1 b# g0 d- A/ `* j" t$ ` R
# M9 f# E* T% l% c- K. D Part Pads SMD Layer 1 TO Via Pads Layer 1; ?3 h" c( [5 u% w
No Hazards.
5 h8 F% ~4 }7 s6 p& }% t
7 }! o1 Q. I- v" l Part Pads SMD Layer 1 TO Via Holes Layer 1
/ L8 t! {- c4 o. N; U* k) u- _ No Hazards.
J( J' n# p" [' j' L+ w9 H' n1 a" `% Q2 ~ l' ]9 V$ g: ~& _' m5 C
Part Pads Thru Layer 1 TO Part Pads Thru Layer 1- O. r6 V0 H1 r) F' U. P/ ~
No Hazards.1 M6 A7 h0 R: b$ z
4 \2 r5 C- p4 o. `! }
Part Pads Thru Layer 1 TO Part Holes Layer 1$ R& H: e% R6 S0 J( Q3 h1 d N
No Hazards.
! F( s& ~" {% v( o( u* A b% ?- ?1 x) y; H
Part Pads Thru Layer 1 TO Via Pads Layer 1
% j5 X" F$ O' i/ o6 _$ { No Hazards.# }5 |9 G6 h4 }/ a# d+ `
/ W4 y2 r7 t6 C/ c1 O- }) N7 r
Part Pads Thru Layer 1 TO Via Holes Layer 1
5 C" z- E' ^0 ^& q, d. I No Hazards.
& F; _. z0 ?: f ^+ ]: k9 D5 a0 ~" d, R# j
Part Holes Layer 1 TO Via Pads Layer 18 j; d/ }1 F# y" {7 {
No Hazards.
, t& k! S% i! r' b1 I+ z: c/ h0 g: ^: Z" n+ |6 z
Part Holes Layer 1 TO Via Holes Layer 1
$ Y X0 K! ^; H2 g, V No Hazards.
. u7 d+ P6 i# q( Z; l# w+ |$ T- N+ |* X
- L9 z& ~9 Z3 }) `# q+ U1 w Via Pads Layer 1 TO Via Pads Layer 1
4 @! e9 e/ D# x/ a/ X7 l No Hazards.( g) L1 R5 T- i. j' r; y! d% }
8 Z- n9 w# U2 F9 a2 c
Via Pads Layer 1 TO Via Holes Layer 1
* L$ g9 f4 y) k6 y. f No Hazards.# G+ D, h* o' k4 ~/ D
" A" r% _7 A; `7 P# ]
Via Holes Layer 1 TO Via Holes Layer 1
+ i+ ^5 Y+ x: i; T3 s! F+ ` No Hazards.
: U- t+ ^) P/ I2 Y8 c" v
4 Y' O, j. y5 r$ t Part Pads Thru Layer 2 TO Part Pads Thru Layer 2
R3 n, ]0 m* q1 Z2 s% F No Hazards.
9 S) \- ^1 l7 O/ J$ ~% F# F; O# v x5 s8 H) D3 m" }0 F) Z- I
Part Pads Thru Layer 2 TO Part Holes Layer 2
: v: d2 Z. o: |* O& Q( K# E No Hazards.
* c- t) E$ p i+ L% ^! `3 N! y
) F8 a) @& W, w0 `5 v Part Pads Thru Layer 2 TO Via Pads Layer 2$ b3 a( G' S" X) X5 x) U, A
No Hazards.
+ ? f2 G: v4 y2 }0 x7 c% ^4 D- }: N% L: I* U8 x: {! |
Part Pads Thru Layer 2 TO Via Holes Layer 2
5 W: A0 t! L0 x! | e No Hazards.) j, C+ \" R ^- s! E/ W0 u2 w
4 I4 |6 V! Q( K: e1 L h X
Part Holes Layer 2 TO Via Pads Layer 2
! s0 i- t* K! o$ Z# Y1 s1 D j I6 ` No Hazards.; x' P9 V0 { S$ E, |
3 R0 N! ~7 M; f' y. y& R1 l7 [ Part Holes Layer 2 TO Via Holes Layer 27 O% h( f( S' B2 \
No Hazards.
6 k" B" w# u% P2 R- h* j
; O* \8 T f& K q Via Pads Layer 2 TO Via Pads Layer 2
; Z g' u6 }* f ~# i/ e+ \2 { No Hazards.( R: S! Q+ E, O- _- }) U; v9 b
$ s B- x; Y% z# `- S. Y Via Pads Layer 2 TO Via Holes Layer 2( p4 Y( u6 U" y4 C- X
No Hazards.; b$ F$ ^" i4 y& A7 D$ l9 |( D
" B8 w/ T7 u: U1 ~5 t& U Via Holes Layer 2 TO Via Holes Layer 2; K: G4 J# I* |3 ?
No Hazards.6 K% O1 N) j" ~- C/ d8 P9 p# C: B9 Z
+ l; Z, x" S* y; B$ Q4 ^/ g, Z' d/ O
Traces Layer 3 TO Traces Layer 3
0 h% p$ Y; q9 Z3 v# s8 z No Hazards.- E& h d) K$ k
' E, O3 ^* S' N2 j Traces Layer 3 TO Part Pads Thru Layer 3
/ I) ]0 R' x, f/ d No Hazards.
+ _0 N8 F/ V" d- \. M1 w6 k# C
Traces Layer 3 TO Part Holes Layer 35 t6 ^7 R* Z/ Q" _3 x3 \
No Hazards.: t, @( s1 d; r& l) f U8 f
* y; o# v* ]# N, `8 X- ~% f1 a
Traces Layer 3 TO Via Pads Layer 3
. {% o4 X$ a$ Q% B5 N$ l5 \) Q( q No Hazards.
% s/ i+ g$ d4 |, G( m0 j! P& ]0 v3 [! A6 r+ o1 `) v2 k6 K
Traces Layer 3 TO Via Holes Layer 3" o' j& d8 `/ A# c6 h0 m
No Hazards.
8 [4 q. i7 q+ W! A% J5 _ f4 h* S, _
Part Pads Thru Layer 3 TO Part Pads Thru Layer 3- E9 r) R" X, z0 }& K0 c
No Hazards.' H' Z/ j1 O0 y7 }+ x
1 s' n7 A! i0 @) n. B g) ?0 X! m
Part Pads Thru Layer 3 TO Part Holes Layer 3$ h& _' `- x" R+ G% d+ e0 s
No Hazards.
) G$ u$ E: R2 T \$ p3 D
% L. L1 J* r, W Part Pads Thru Layer 3 TO Via Pads Layer 3
- `/ [7 N7 W% y6 k: x No Hazards.5 R. x$ N* `1 _1 Z% Q- a
7 O( A; k/ e% E5 [ Part Pads Thru Layer 3 TO Via Holes Layer 3
2 t& i4 H: F" A) q No Hazards.# {5 W, `2 w% l$ S" O4 w" G
, N2 }1 e: ]$ f" B5 g$ f Part Holes Layer 3 TO Via Pads Layer 33 B* |* W. }, l& y& ^1 m
No Hazards.
% J' Z+ _* J H) ?& p b
# V4 W9 b* [4 z' x: o Part Holes Layer 3 TO Via Holes Layer 3
- {6 b$ C; K, c0 D- B No Hazards.
H5 t, g+ w; `+ n
' C! G& w( v$ y3 C" w6 A Via Pads Layer 3 TO Via Pads Layer 3
6 ~3 E$ G3 t9 t& t; B& V+ ~: b No Hazards.
7 @& H# s0 v9 t" u1 V' |5 s9 ^! x3 B6 [) k; K
Via Pads Layer 3 TO Via Holes Layer 36 `, A3 C# l( R) ?4 D
No Hazards.
! g5 {/ Z8 c; m/ z; t8 q, K# t7 K B) Z! R5 x) Y; Q; L5 T0 E
Via Holes Layer 3 TO Via Holes Layer 3
5 t; o& {4 M3 n4 B4 P% n; l No Hazards.
' C, ~. J- J) q% J4 V" r5 @, \* f2 F" G# z
Components Layer 4 TO Components Layer 4
( d. ~/ h( S4 s+ L No Hazards.
7 a- Q- S" v* r( ^+ X7 I
; q! b3 `1 n2 {0 e; ]2 @* F Traces Layer 4 TO Traces Layer 4
8 |. N) W. g3 V1 J2 F/ O( e& M$ M/ r No Hazards.
" M" y3 Z9 _" q+ e8 P! l/ J M& N
3 f5 r0 E% G: e Traces Layer 4 TO Part Pads SMD Layer 4# I! @1 Z# i% j. O/ \8 f
No Hazards.7 z1 p# t1 R( K% V: r7 e
8 A; i# ^& {+ |+ d
Traces Layer 4 TO Part Pads Thru Layer 4
7 L5 H: R! a* _# m/ X No Hazards.
/ M! a* G0 \3 g4 E3 @; u4 T' [7 o1 L9 P) Q) w% B
Traces Layer 4 TO Part Holes Layer 41 v4 ~- A5 c) N
No Hazards.; F/ } _. E0 g! H# _' D: R
. P9 M; i1 g9 s* k+ G Traces Layer 4 TO Via Pads Layer 4
7 w) I9 B6 o$ M+ y$ O No Hazards.
1 n, N% J; E+ x o G: G
6 }% N A7 u: D8 o1 K Traces Layer 4 TO Via Holes Layer 4
+ o$ _+ @! d, [1 j6 x No Hazards.
# M) i8 n) t2 G4 Z9 j; N" s# @- ~/ F* F4 M2 [
Part Pads SMD Layer 4 TO Part Pads SMD Layer 4
1 x G" r9 o) J No Hazards.
' ~4 H; t6 }% ?! S. G K* Y: P8 `
; p' ?5 o; a4 t; M9 I9 A0 }$ s3 ? Part Pads SMD Layer 4 TO Part Pads Thru Layer 4
" A5 D" [( [* O' a No Hazards.; O3 ?* v; K m. o7 Y4 w' Y; R
9 p6 j8 M& s6 T& x) K1 R! H2 t, c Part Pads SMD Layer 4 TO Part Holes Layer 4
+ q5 ~# e" n8 X/ h3 u0 ^( s" A No Hazards.
1 N0 G, Q6 p0 D- b% z
5 n' D3 e- ^( m( ] Part Pads SMD Layer 4 TO Via Pads Layer 4
1 Z% ~; ?3 t; M) e7 i6 V No Hazards.
; R1 @$ Q$ I" \. M/ w2 i2 `0 y6 j- [ q) a' u* h7 V
Part Pads SMD Layer 4 TO Via Holes Layer 4
- b' j# M* x# M3 S0 h. V No Hazards., X( z* M+ ~8 d/ n: f! |
8 P7 G G4 {/ h: p3 {
Part Pads Thru Layer 4 TO Part Pads Thru Layer 4- v2 s5 N5 r5 u3 [( Z8 N ?+ g/ V+ w
No Hazards.
: U8 t) e/ F# D8 ?9 O) t: c8 c
" o: R3 y. a. x8 x Part Pads Thru Layer 4 TO Part Holes Layer 42 _1 t5 U) B, M4 E% R2 J5 T
No Hazards.8 ]* d& Y! I5 X+ e3 g! V0 t* f7 e
4 J7 f% W3 A8 ]( l- V# i3 q Part Pads Thru Layer 4 TO Via Pads Layer 4
6 ]8 ]$ I8 [% m: f$ m0 z* ~; L No Hazards.. P" t1 I# s$ G& H9 n, P
( u/ G( Y* Z% V/ M: v, l/ C; b
Part Pads Thru Layer 4 TO Via Holes Layer 4/ o# w# A- x2 J* g
No Hazards.) j* E0 U- y+ R" C
5 S3 T; o( J/ }* m Part Holes Layer 4 TO Via Pads Layer 4
1 Y9 |% P2 l' S: d No Hazards.$ L1 c, w7 ^& J5 o
: U+ v0 v; n- Y9 ]$ N
Part Holes Layer 4 TO Via Holes Layer 48 w, B% L. |0 S; B4 C2 a8 G% G
No Hazards.6 S; ?# n f) R8 h" v: g p
- l0 O" O! n7 o, E8 q) A
Via Pads Layer 4 TO Via Pads Layer 43 L ~; k; b: w6 A
No Hazards.
/ u1 J/ l1 j- ^1 G9 c
! b* b! K0 s$ ]+ b' N Via Pads Layer 4 TO Via Holes Layer 4
: Z5 f, j! Y# }, I/ H No Hazards.
. [* R* ~ W' E3 |0 z0 Y+ L* x. F0 x
Via Holes Layer 4 TO Via Holes Layer 4
0 B; \6 b* u j! B4 Z+ f5 i" _! p No Hazards.$ D( z9 G; _" _$ z0 f) d) j. i
4 e% S$ t2 }; f3 f% w! Z5 C2 G# P& K
Total Hazards Found : 05 I! V1 h+ ~% V. q& l" A* X7 p
@; j0 r- G0 V4 d1 h3 W/ B8 y, q- Y6 C1 d7 ~
/ q" ]* {6 A! B; Q9 L. m% f
; R" M& v# u% b2 \ u* [ Planes Clearances And Rules- t' n6 M S8 k u+ q+ [; S
---------------------------! ~- k3 M# N- U
* A: i3 v/ J2 _* @$ ^ Positive Planes Layer 1 TO Part Pads SMD Layer 1, C7 P0 X5 _/ K1 }4 h0 R: `
No Hazards.6 n k% B5 q6 s
* A) i$ j3 i9 q Positive Planes Layer 1 TO Part Pads Thru Layer 1
5 C; f4 j0 ~' D# d4 M No Hazards.0 q0 F7 d/ T! N' S) x2 l
2 h E* D+ W3 } Positive Planes Layer 1 TO Part Holes Layer 1
0 e b1 i$ ]4 K5 @$ Y No Hazards.7 J9 e; d$ A, a
( d( Y$ H1 X7 Y- o Positive Planes Layer 1 TO Positive Planes Layer 1
! C3 z8 | \$ S: r" h No Hazards.
9 e, f1 j+ ]7 C+ M/ t4 g. Z8 g5 P2 p8 `- R; z5 V+ }
Positive Planes Layer 1 TO Route Border
7 d( \' K/ Z9 I: h$ e No Hazards.
% d. ~/ f* Y3 `. `: [2 i+ n- P& f5 D2 ?" Y
5 n m( E3 i7 r& H! \; S& w Positive Planes Layer 1 TO Traces Layer 1
, v& o/ R0 p% K6 K No Hazards.
, |3 f+ L( A/ v
% p2 x4 A) Y( o" Z, P9 o! {' q$ o9 a Positive Planes Layer 1 TO Plane Obstructs Layer 1; S3 d @/ m4 _+ Q5 M* p- M& `
No Hazards.
/ F, [6 w1 P2 u T; { \! H. h9 d# Y/ J9 {6 w5 K- H. ?# I
Positive Planes Layer 1 TO Via Pads Layer 1
: l$ X# ]6 `9 D, r5 U7 M No Hazards.% Q7 h; O& F; r8 J1 {
2 Y6 v0 t3 l) U7 W1 L
Positive Planes Layer 1 TO Via Holes Layer 1
% y! x$ X$ F# r# r8 U. d No Hazards.
" h' i+ y9 s# x+ w1 F) B8 g7 e" m, l
1 _; L# K6 Q3 h/ @% z Positive Planes Layer 2 TO Part Pads Thru Layer 2
2 y3 _! h- R, m7 X: U No Hazards.
( X8 @ i* w% j) g" n' S- q" n8 O) H3 B; o! q
Positive Planes Layer 2 TO Part Holes Layer 2; W3 C7 s/ P9 A4 D9 }
No Hazards.
# p8 N4 k" B' x' L! [( K- ?) i1 E9 i# r* A$ W9 ~
Positive Planes Layer 2 TO Route Border9 I2 l/ H0 _, \+ H5 B+ A! I
No Hazards.4 z( r/ Z1 d: t. F4 E$ c, r0 U4 h
6 q7 ]5 \) B+ q( y( s" }# q6 q Positive Planes Layer 2 TO Via Pads Layer 2
7 ?" X f/ w0 i8 C- z No Hazards.
( `: n; f6 h r& H0 c. f
2 K( }# t4 b5 `! z& X1 E2 E Positive Planes Layer 2 TO Via Holes Layer 2
& O" D8 j9 x5 k No Hazards.2 _2 p6 Q% {3 K# Y7 G
3 i( f7 H, ^. D( f7 r% z P Positive Planes Layer 3 TO Part Pads Thru Layer 3
' o- f6 t5 V# l3 P No Hazards.
* A! Z3 m9 u* I* ]8 u
: P" D& z' i0 P) K6 }$ Y: Q' W/ ^ Positive Planes Layer 3 TO Part Holes Layer 31 F* @9 ~) @- V- t1 P
No Hazards.
- P: C# ^ ?& A7 T3 L2 ^: y% M# _* F0 u" D r L6 H
Positive Planes Layer 3 TO Positive Planes Layer 3; I, @4 I! w1 f& s5 N
No Hazards.. J6 S- m* G: {7 y9 [, b% x3 v5 p
6 N9 A) m1 I- S5 A
Positive Planes Layer 3 TO Route Border$ N) l' ]7 T6 k* o: C" d, w3 W/ E
No Hazards.
! K) {3 z X& h( K$ n
~8 m# r8 }+ y( l1 L Positive Planes Layer 3 TO Traces Layer 3( S( |5 w$ H+ N5 t- _' k! T- @
No Hazards.9 ]7 A$ p' I w, }
7 {! I. i! u) J1 m( T
Positive Planes Layer 3 TO Trace Obstructs Layer 3$ n2 E4 ], S5 Q, e) `7 w
No Hazards.6 M/ u$ B/ h8 D1 ^
i) r% c/ Y5 V' @3 @* h9 P
Positive Planes Layer 3 TO Via Pads Layer 3" t3 w5 M7 `- X
No Hazards.
9 ?4 x2 F( C9 B! `2 l: r& O' P8 v$ ^9 |% c
Positive Planes Layer 3 TO Via Holes Layer 3% D/ D5 {# D* |2 x
No Hazards.
7 y5 F+ s1 E: i, r3 N, ]: U8 X
2 F6 X* T; B, u8 v( F; v. B Positive Planes Layer 4 TO Part Pads SMD Layer 4
5 z( m1 `5 g4 Z" _9 x" Z) v. b No Hazards.( W! `- X R4 i/ y
& S+ s3 g+ l! N$ _( r; Q# \4 `
Positive Planes Layer 4 TO Part Pads Thru Layer 4( Q) M3 A/ ]# ?% Z4 ?
No Hazards.
3 T- u! i3 i4 O/ K+ a
3 Q8 ]: s0 A( B; h8 v Positive Planes Layer 4 TO Part Holes Layer 4
" I* p5 x: W9 D: q- W$ o/ L No Hazards.
# j+ \1 [3 `& r5 }5 {
, Z- a& U, {( a/ s/ @ Positive Planes Layer 4 TO Positive Planes Layer 45 Y. ~2 r* G0 i, U
No Hazards.
+ Y- D+ u W2 y- P$ ~" _2 O! z$ d1 d6 _) ^7 m' ?8 n$ {6 n
Positive Planes Layer 4 TO Route Border4 ~- u$ Y- D, F+ a' R
No Hazards.
, C: ]9 `) l1 U8 @: R5 }3 h% C- C1 \" I
Positive Planes Layer 4 TO Traces Layer 4' U% B- g' k) k* F# D' D4 X
No Hazards.
7 A' a: C$ V; I8 V% @8 o! P" x& Q7 S: [) n0 I% t6 t9 Z
Positive Planes Layer 4 TO Plane Obstructs Layer 46 ?4 `; z# a# I& j- L
No Hazards.4 R+ Z1 V# k' U9 m; u6 I
; A! y- a+ S$ u# F* J) x0 X3 B7 H Positive Planes Layer 4 TO Via Pads Layer 4
( r( L$ k& K$ X x No Hazards.
7 O+ V: U% ~& Q3 {# ^; y2 S$ d6 c. }3 n( L8 a) H
Positive Planes Layer 4 TO Via Holes Layer 4
q3 J; b. {- f2 [, I No Hazards.
- Z1 R, }' }. U1 t' l+ _5 A4 l7 |( q. S0 e4 Y6 F
/ a4 w: ?- \0 ^& C
Total Hazards Found : 0
4 D) d4 w" P! i, c" e! R! ^8 N2 L0 t) Z5 ]# o8 s4 P* x
1 L$ C+ _, t ]
5 f& T& x- o% Z( H+ z+ v) Z: N8 n0 G! j) l$ w/ y9 d- j: h' u" ]
Non-Net Class Element To Element Clearances And Rules
4 T* @; s0 X q% ~/ I -----------------------------------------------------; N. s3 s% R5 }+ ~! s# d
: Q9 D8 g0 V0 D# x Route Border TO Via Pads Layer 1 Clearance: 0mm2 U# c/ W2 a; X. {( p
No Hazards.
$ ^% X8 Z" }3 ?6 U+ d- j% b! r# I1 P, m* ]
Route Border TO Traces Layer 1 Clearance: 0mm
, {" M+ y* T- W) [ No Hazards.
7 ^0 w! c/ w3 h6 V% _/ Q& A/ p0 h; `) ?# R# l
Part Pads SMD Layer 1 TO Route Border Clearance: 0mm6 x. Y5 y; x9 H+ h
No Hazards., Q5 J& p+ P3 y% \
x* @& F! Q( Y4 k8 n
Part Pads Thru Layer 1 TO Route Border Clearance: 0mm
3 A3 r% h$ x0 x D No Hazards.
7 J1 ~3 a! _# ^ i) o: i3 h; ?* P, d
Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm9 a$ _8 f4 y k" a
No Hazards.
9 p, ^7 t `, ?# ]: a' `4 i9 g" }4 ?% r9 `* u9 X1 o
Board Outline TO Via Holes Layer 1 Clearance: 0mm) q3 \: N8 v* r2 j. Q
No Hazards.
1 X# D( N' O& S7 W6 W
6 X9 Q7 o% J* ?; u% Z) Q1 Y% q Board Outline TO Via Pads Layer 1 Clearance: 0mm0 W- T6 x8 {" z8 y N1 |
No Hazards.
# l7 ~6 C7 x3 m8 c: I! D J' Z/ {* j; t
Board Outline TO Part Holes Layer 1 Clearance: 0mm
% Q7 `, ?% l# F+ x No Hazards.
; ]% a. @; z" }: T# q$ ?( D
( k6 Q5 u4 n0 U+ z; ~* e0 j# k Board Outline TO Placement Outlines Layer 1 Clearance: 0.25mm/ s9 ?3 o' L" H' n
No Hazards.5 }2 I) N; O# S, l' N. u' f
- @6 f. P& T+ x4 x- J1 p! t Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm
" X; o K2 p- x5 D" c No Hazards.
8 N1 n5 q( s4 m& N* }- y
$ H; f7 e4 n9 Q, J- C Board Outline TO Traces Layer 1 Clearance: 0mm
4 w/ O. D& F7 e* u5 s8 q* O8 q4 G No Hazards.
; z3 k+ g7 \; ~( `' q
/ b/ C) I) j3 X# ^3 j Route Border TO Via Pads Layer 2 Clearance: 0mm. F" }/ L2 u9 U7 Q
No Hazards.& o) h# j8 U7 E" b/ R
2 g0 ]- b- L) W
Part Pads Thru Layer 2 TO Route Border Clearance: 0mm7 j. V6 v' |* y, k
No Hazards.8 Y- {0 c* |1 S0 o; m+ \
- {, [# C! ~2 B# j! w1 P2 r Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm$ a) l( J9 c5 ?9 x. _
No Hazards.
- x7 L' N' m4 P- h/ {& F$ @# H c# _
Board Outline TO Via Holes Layer 2 Clearance: 0mm
; U( g$ }8 b2 Z No Hazards.
& U; u1 _* L( m. N" Z( I" K$ n$ t- t& D4 B6 ?) N& t5 y
Board Outline TO Via Pads Layer 2 Clearance: 0mm ^$ J7 q% o: f- c' p+ |
No Hazards.4 ^0 M& w4 j$ m- L, p
0 [9 o3 N+ O/ V7 }' I% }$ Q
Board Outline TO Part Holes Layer 2 Clearance: 0mm% l D/ j5 y3 {- b0 J
No Hazards.
/ t' l; R/ G0 S1 S" q* p! `& F* Q. B$ r- t7 @, `% F0 g' T
>> Via Obstructs Layer 3 TO Via Pads Layer 3 Clearance: 0mm
# x8 \" M, ?3 o" F Hazards Found : 62 _9 M9 R+ V7 X, M: m
/ N/ x/ L1 M8 l3 G: [8 \ >> Via Holes Layer 3 TO Via Obstructs Layer 3 Clearance: 0mm, M2 L4 h6 N r- t8 e; V" J) y9 {
Hazards Found : 6' R9 D) @; u# i( ^
! O, X4 T3 S- U, H. a >> Traces Layer 3 TO Trace Obstructs Layer 3 Clearance: 0mm i1 d( h- x& }# v
Hazards Found : 1' f$ r9 ?- ~2 ]" L( P! T
6 _. [3 A) E. g0 r- I6 }+ J# X
Route Border TO Via Pads Layer 3 Clearance: 0mm/ o' P5 U! z$ }# g" @- M! c, ?; {
No Hazards.
6 _5 p: K& d0 }( B# f$ j
; u) E9 k, @: V* S2 O- z/ K8 b" L0 b Route Border TO Traces Layer 3 Clearance: 0mm, @6 M) m1 {6 C- b+ K
No Hazards.4 H: N1 _# f* M) x0 s- e
# J, A- t. h. A* G
Part Pads Thru Layer 3 TO Route Border Clearance: 0mm
\! _8 z5 U, [/ q No Hazards./ z* R8 {" t/ V. P9 W" |
. u' I/ b% w& W6 J" h; p! @+ b
Board Outline TO Part Pads Thru Layer 3 Clearance: 0mm
9 O# E. E1 h0 u, d" X' o No Hazards.
- [& E Y+ ^3 p O; B* ?% s2 a6 b3 `2 r: j O0 d
Board Outline TO Via Holes Layer 3 Clearance: 0mm c# y7 g% _; @% p* @0 ]% C/ _5 r/ c
No Hazards.2 Q5 k. e2 Y* F8 t( R+ A8 h
. i( l0 `' L6 o. e6 b& I Board Outline TO Via Pads Layer 3 Clearance: 0mm# L7 q* e3 {" `2 M) F& e# b9 n0 |
No Hazards.
, Z" t- K& N. R" A# w5 {! J6 ~* U0 c, V
Board Outline TO Part Holes Layer 3 Clearance: 0mm$ I4 z0 w9 d( t0 I2 D5 y8 V
No Hazards.
7 Z% M' \; T7 w" T% y+ h* t7 v
Board Outline TO Traces Layer 3 Clearance: 0mm; v* W, x; q; N5 h L7 R
No Hazards.
. I+ E- M M9 U/ I0 p
3 Y0 c# w/ H @9 }9 K Route Border TO Via Pads Layer 4 Clearance: 0mm
( d. @0 H' K) s) A7 a7 [& ~+ j No Hazards.2 B6 M! |# z' B2 h ^
* A, t, H1 G7 n
Route Border TO Traces Layer 4 Clearance: 0mm
: t- F; |; ]* e2 V8 Z4 u' Z8 Z: p No Hazards.
2 d# Z) D, n5 y/ h
# p& n5 D6 Z# N) _0 E) J Part Pads SMD Layer 4 TO Route Border Clearance: 0mm
1 h& S# W D: F, S No Hazards.# u% ?/ a2 u) ^, k- f7 E( ~. r- X
1 f7 M' H |5 n6 | Part Pads Thru Layer 4 TO Route Border Clearance: 0mm+ W9 g f7 {1 W* A0 z+ R4 j
No Hazards." m# n5 |& L! O
* T I" q) Y2 n' w/ {( [& D2 O, r1 T
Board Outline TO Part Pads Thru Layer 4 Clearance: 0mm; X" [/ ?( T/ I& e% H- F8 \
No Hazards.
( J& ?; Y% \. m3 w/ `' C
8 i+ h/ w- }8 G( e+ | Board Outline TO Via Holes Layer 4 Clearance: 0mm
/ R T' J, |. p: o. b+ n: Y No Hazards.; r3 ?9 I' F' N2 N
u: I. l) W2 q. p9 B( n Board Outline TO Via Pads Layer 4 Clearance: 0mm- J) f6 R9 b( h2 v2 m, [ L
No Hazards.
) K# ?' A* q% Q, G# H. Z0 j" c. N g- p" G0 Z- q1 b
Board Outline TO Part Holes Layer 4 Clearance: 0mm' _& t! n/ f% N% R
No Hazards.
1 m" P7 x* W, P% h/ ~3 }/ q) y t4 Q p, d1 `+ e4 T4 t2 E
Board Outline TO Placement Outlines Layer 4 Clearance: 0.25mm0 e% g7 F' B+ A+ P
No Hazards.
* L$ ^3 H1 c$ D0 u; v4 L/ @: C4 s! o/ X v
Board Outline TO Part Pads SMD Layer 4 Clearance: 0mm& }# j$ f$ L* J2 v4 g1 V. y3 u7 d
No Hazards.1 P6 w: l; W! b" B: ?% S
' H8 I+ F2 m- ^3 [
Board Outline TO Traces Layer 4 Clearance: 0mm* E$ D8 H- F( x V' |" W& \% m7 ?
No Hazards.
& o p" y3 X, _6 c4 p+ m4 ~) p8 x7 i% Z
, `! Q4 \' k% x. }, {) H) u) f Total Hazards Found : 133 p6 T: j1 `, [* ?2 S
3 ?5 N' u; [% \& p& e( _
5 i! M* J" D' j) p1 O: C3 e- o
+ ?- Z( W% x& C0 C' @$ p9 r$ v Total Proximity Hazards Found : 13
9 a* ]* J/ ^5 r+ g1 _9 v0 j' _1 q3 \! k# _. m
& N8 ] l5 b" |0 F" k
6 V8 a, D5 w' ^0 A
* Q7 }8 }6 z# I4 N2 Y ----------------------------
8 ], l/ S" t& Y. T5 ?) I; `& q( f CONNECTIVITY & SPECIAL RULES
, |* |) O# z5 n2 ] ----------------------------5 X' |7 Z. Z9 H/ u, V
8 @& B4 H$ |" e& P6 @
0 _1 W0 w: H c# `4 h5 V, ?
Check For Unplaced Parts : YES
9 \- o& \* a$ ~$ \" E1 O No Hazards.
3 v2 f0 r* J9 R. O u/ y6 h7 G5 ?0 q2 L
% L O3 ?, ~' k4 w/ y
Check For Missing Parts : YES5 d4 n2 P% k- Q% E/ v
No Hazards.
1 }( K. `1 Y# M7 n) t# G6 p; `, @' R) i. C4 x: F8 r# ~
- H5 J! i3 P1 g( Q& r& l# X2 M
Check EP Component Hazards : YES8 P, G& I/ @, D% s7 ?9 E; k
No Hazards.% `$ J6 X1 d9 W/ L: I$ w! O
. m" o* l, G( J
. y, i! |! Y4 R" ^ Check Trace Hangers : YES: O1 z9 P: g# n' O7 |
No Hazards.
/ d( l9 M; b, h9 @' ]8 m: ?9 k" R1 u3 J. s
( V, o9 J1 S1 }' O- E
Check Trace Loops : YES
" S+ O( w5 I4 w No Hazards.: `: p- f+ b G, ]9 [
8 j& ` u; u1 h0 k' j
8 U2 b$ A- c0 ]) O/ @ Check Trace Widths : YES
' I; s7 L. q/ E0 B! t! v$ h: x No Hazards.7 H( a s+ } f/ h
+ ?- h: w7 O* A* h& b% m
. o! J2 B: P' G" X; L& n1 C/ s
Check Single Point Nets : NO
: t7 K, Z3 T1 Y' s
) _4 _2 q" J( ?. L* j' A: Z5 R7 K! g- e6 [7 f" \( \
Check NonPlane Unrouted/Partially Routed Nets : YES
* D9 G% V: B9 x No Hazards.. z7 e3 ?* _3 e' l3 n
9 J }- v) ]( I% M
% L3 {' F& z1 L, g( t5 `5 _. [ Check Plane Unrouted/Partial Routed Nets : YES
3 J5 |, v+ z4 H6 F9 u$ f No Hazards.
6 G: `5 c- a4 M3 z" n4 g
3 M# m; a+ J% m [, Y# G; D' W8 l, c+ f. T0 [
Check Routed Plane Pins : YES
) A0 P: m3 W; p0 e& t No Hazards.& i4 H8 Q% ?+ D- M
: b4 j0 L& s$ E8 n/ t( \0 ?( Q: J" s$ L; ~+ i9 y
Check Plane Islands : YES: y1 L" u; e, q! |' L4 W1 S. t
No Hazards.
1 d2 |% o2 X9 Q. C- D# s- A$ r z7 i* C
1 S' }; G+ ]1 ], r" l9 T' [0 \$ S9 j/ p
Check Dangling Vias/Jumpers : YES
- ^, n0 V! X' l) H. |( W' Y No Hazards.
" T! @% `! ?: d- R+ z. }( D8 c" Q n( L2 r: r7 P1 ~
! O0 a8 I1 t0 T% K# e; Z/ w
Check Unrouted Pins : YES
3 o. P: F- f$ ?' w No Hazards.
9 l+ w0 x0 v& N' D! C( K! A+ m* U% ]% ~3 E7 G: `
% O) `& Z1 n; y8 C
Check Routed Non-Plated Pins : YES/ S K3 h7 _4 f$ Q- K* f+ @4 j
No Hazards.# i m( g0 f4 B# D! t( p
8 c2 j9 Y2 s1 M2 h
7 j2 F0 L2 Z; [; L Check Minimum Annular Ring : NO
$ p% p& V3 E5 B/ o
' m" w" L& s; f8 J$ q* r
3 x; A* x$ d' g: } Check For Vias Under SMD Pads : YES
3 L6 ?, B+ o4 { No Hazards.
, \9 }* I9 G8 j5 T- ^! w2 o# K. K' a, B+ G: N# f
, p6 k5 D) u7 d4 E! H- t$ W+ W Check For Vias Under Top Place Outlines : YES
) d! i/ ~) @, W) h3 G& e& u/ j$ g Hazards Found : 254 P& D3 H2 R5 w0 w! a0 S# N
$ j$ j2 C: z- h7 \+ V, U
) h5 M9 z' a/ S7 e, y0 I
Check For Vias Under Bottom Place Outlines : YES) n, U8 a& |, [% y* d& t
Hazards Found : 116 a- v q0 y I s, e( H- Z! u. m
$ I' O( J/ ~# n& h+ j k U
# H% r8 R$ X$ K5 c' O Check For Missing Conductive Pads : NO
% p. N% \; ?4 E: o2 W7 u3 R* n: T* O4 V# q ^7 Z# u
4 I9 g. d7 C* J& Q+ A0 d' f3 {
Check For Missing Part Soldermask Pads : NO% t; t g B8 s
$ m, G- ^' b1 l# ?! ?3 P/ |: W/ b/ @9 |# T/ L
Check For Missing Via Soldermask Pads : NO
# N1 ]/ @1 w' ^' a1 F* e- x1 {: s& \ ~. p& D1 _) I7 F
. J- W6 h, ?, S G! I
Check For Missing Solderpaste Pads : NO
' ?" d8 F) y, K) R3 W
3 `8 f1 Q8 ]) }! X" t I% _# a1 K
9 @- ]3 n0 d* s' o( l
7 `/ m- D9 O" f5 r3 c) l( r Total Connectivity/SpecialRules Hazards Found : 36) n" V# R/ U) v; r
; F; L. g$ n7 z! H/ s
( K8 m. _5 c; V" u, F" A# e- K3 y) S3 T/ Y/ |
====================================================================
) m% z! C- ?8 ^% a6 F! E- {. z0 y; q+ j9 g/ x" k: K# U! w0 a
# D8 e/ V+ z/ n) @9 x2 [% ^5 V
8 z. I. o$ p+ O6 I2 m Total DRC Hazards Found : 49$ y$ O7 k8 ?8 k2 |2 k' G
+ {4 U- S3 W8 M
; o- V, j6 s+ t& t6 y ]8 t. F$ v3 c8 r C7 w' P) {
04:46 PM Thursday, April 16, 2015 |
|
/1 
发表于 2015-4-16 17:04
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楼主
发表于 2015-4-16 17:11
