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另外我查了一下板厂的板材结构:
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1 oz copper (1.4 mil)% w8 Q9 k* P' O, F0 s& G
6.7 mil prepreg
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47 mil core
7 ?8 O8 s5 \. s6 R- U 0.5 oz copper (0.7 mil)
! U# M0 ^3 L6 f; v3 \ 6.7 mil prepreg
5 ]: l! ?. v! j/ S* R5 k 1 oz copper (1.4 mil)
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The substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。
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这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?
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