|
应该是13+(N-2),这样算,N代表多少层
% X# W6 K7 Z9 d; r顶层Top (copper) Layer : .GTL
3 c, x3 y, X7 j: y$ |
% i# B% P6 z+ d: f底层Bottom (copper) Layer : .GBL
# Q8 P/ g) r. i, \6 j$ \" U1 g* R
3 N3 f) t& ^7 [+ j9 V1 r中间信号层Mid Layer 1, 2, ... , 30 : .G1, .G2, ... , .G30
9 q/ e1 C$ P# R- S, f& S& c. @2 w+ m( K j
内电层Internal Plane Layer 1, 2, ... , 16 : .GP1, .GP2, ... , .GP163 e1 r3 `2 u/ g+ L+ ^1 `8 H$ `
8 b* _: c8 Q. |8 ~% a% n顶丝网层Top Overlay : .GTO5 C3 [5 k4 G7 ]
! y) ^9 b3 b" G/ M3 T$ P
底丝网层Bottom Overlay : .GBO
1 l: G: d3 R4 P8 D/ q3 Q; w/ F% ^- l3 a& N* k- l3 i/ |: Y5 g
顶锡膏层Top Paste Mask : .GTP
/ K* \ I! ~( G" t
/ Y4 }$ V l/ K8 C9 r) k$ V+ n底锡膏层Bottom Paste Mask : .GBP6 k4 G4 c3 B8 P: E
; N8 T. i7 m+ q& i
顶阻焊层Top Solder Mask : .GTS2 S; e; c& r9 D7 q+ ]0 \" L
$ W+ Q8 i- W. _. R5 c0 y# F1 J! l
底阻焊层Bottom Solder Mask : .GBS8 O+ e+ m/ G8 D6 x+ U& Z: i: w
, F# d) j) x* K( d% j6 r禁止布线层Keep-Out Layer : .GKO
' P4 p: n+ n, P3 h * q% e9 O H- o a# V2 C
) l2 o; v( G4 J* F: I
顶层主焊盘Top Pad Master : .GPT; h5 k0 P* S- R4 z( R3 k8 T) |
2 p5 }5 N8 p4 J6 l8 F9 N底层主焊盘Bottom Pad Master : .GPB% w/ k+ X. [; ?8 d* c! [6 \( _
& [$ T- H9 s# t4 j/ {$ k - X$ v& q, h- b G6 ^0 U, b2 y8 g
2 e' n. R0 E" E" G0 F钻孔图层Drill Drawing, Top Layer - Bottom Layer (Through Hole) : .GD1
0 \4 D! A$ g" z7 L( v9 s% b8 N5 l: a5 [- X, n9 _7 {7 [
Drill Drawing, other Drill (Layer) Pairs : .GD2, .GD3, ...
2 |0 w% F: ?5 a% l$ Z" {8 b1 ^ I- ^. C4 S- J
0 _ V+ j9 q% |
1 f8 [- S% r [/ Y+ k! T
钻孔引导层Drill Guide, Top Layer - Bottom Layer (Through Hole) : .GG1% Y6 R; l! o$ V$ q9 S
( T T5 @1 U/ i( x1 j, v% ]Drill Guide, other Drill (Layer) Pairs : .GG2, .GG3, ...
! A' B$ l' q& l# k+ P注:这里面不包括机械层
8 m& \% y: T2 }! d* Z$ |9 ?) F |
|