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本帖最后由 Cadence_CPG_Mkt 于 2018-5-31 23:03 编辑
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) D* |. M6 K9 G/ v2 f0 l2018 Cadence - PCB, IC封装设计、仿真分析 - 全国技术巡回交流展圆满落幕，相信北京、深圳、上海、西安和成都的粉丝们都是收获满满~
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2 o0 g5 H, z- E. n现场演讲资料已开放免费下载↓↓↓
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演讲资料大纲：
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( P" d: N# I$ t$ Y6 O" wTrack 1: Allegro PCB and IC Package Allegro Real-Time Co-Work and In-Design DFM Check High-Speed Optimization: Visual Results for Analysis and DRCs Allegro System Design Authoring Routing Vision: New Routing Check Tools Co-Design Using OrbitIO™ Interconnect Designer: Die-PKG-PCB Interconnect Planning and Optimization Enterprise ECAD/MCAD-Collaboration Environment * N1 F6 m0 z1 o/ j7 _1 q
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Track 2: Sigrity Solutions An Innovative Methodology for PDN Design and Analysis Using Allegro and Sigrity Technologies Responding to Rapidly Evolving Thermal Challenges: Including but Beyond Conventional Approaches Performance Analysis for Next-Generation PCIe® Interface Designing Next-Generation DDR Interfaces Today Using Advanced IBIS-AMI Modeling Technology to Facilitate High-Speed Serial Link and Parallel Bus SI Signoff Simulating High-Frequency Electromagnetic Fields in Full 3D ( y: g0 {+ ~# o) a% y% R
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下载链接：
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) D) R; q5 Y" n' b; R; V. M欢迎您的评论！ 您可以通过PCB_marketing_China@cadence.com联系我们，非常感谢您的关注以及宝贵意见。 : F. Y3 ~8 I8 P3 R" O: ]) K0 A
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发表于 2018-5-31 23:02
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