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一年一度的全球高速设计盛会Designcon 2018圆满落幕,Cadence与思科、富士康、英特尔等客户的演讲资料已开放,干货满满,快来下载哦!& z* N, p& O" h- p! a
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# B1 y/ u9 o# x9 S XKen Willis, Product Engineering Architect,Cadence发表演讲
# @) E1 Z$ ^( h/ M演讲资料大纲: Reduction of Mode Conversion in SerDes Links Performance Analysis for Next-Generation PCIeInterface Backchannel Modeling and Simulation Using RecentEnhancements to the IBIS Standard Temperature- and Geometry-Dependent Analysis ofHigh-Speed PCB Traces DDR-4400 IP Model Development Using AMI Builder Advanced IC Packaging Trends and Their Impact onEDA Tools HSSO - Physical Structure Optimization forHigh-Speed Interconnects Brand-New Electrical and Thermal Co-SimulationAnalysis A New Platform Power Integrity Design Approachwith SPIM and UPIT DDR5 Modeling Using Automated IBIS-AMI ModelingTechnology 5 k( [- c6 k+ {! L
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# T' l) l$ s. `) X- D% f欢迎您的评论! 您可以通过PCB_marketing_China@cadence.com联系我们,非常感谢您的关注以及宝贵意见。
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