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We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 ,mechanical via from layer 1 to 4.4 \8 ~+ u- M8 o
+ d. Z; e, B! |+ ^
but Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias" \, K! E( r5 f' b
: @5 j t$ m' B, ~& H/ GMy question is why manufacturer changed mechanical via to stacked via?$ m$ N/ \9 p* q% z! h/ B2 V+ n' x0 y
. ~9 n' j- E3 ?0 Jcost also will increase while using stacked vias?6 }3 B( [- ^* }/ J( A, ^2 ~. o8 w2 z
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发表于 2018-3-7 20:51
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