看到英文解释：Bond fingers are pad stacks that are used in Package Designs (Allegro Package Designer). These 'fingers', which are single layer pads, allow you to add a wire from a die to a finger. From the bond finger to other pins in the package, such as a BGA, you would use traces/clines just as you do in Allegro Editor to connect pins of packages. 7 m8 }) L! j, j* |3 ~3 ~; s0 w) o; [2 |7 d" f; o
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发表于 2018-7-2 09:03
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