Designcon 2018 演讲资料免费下载

Cadence_CPG_Mkt

一年一度的全球高速设计盛会Designcon 2018圆满落幕，Cadence与思科、富士康、英特尔等客户的演讲资料已开放，干货满满，快来下载哦！
1 S0 |1 t2 R, i5 c; S/ C# y

Ken Willis, Product Engineering Architect,Cadence发表演讲

; ?* O8 D/ S" [: f

演讲资料大纲：

• Reduction of Mode Conversion in SerDes Links
• Performance Analysis for Next-Generation PCIeInterface
• Backchannel Modeling and Simulation Using RecentEnhancements to the IBIS Standard
• Temperature- and Geometry-Dependent Analysis ofHigh-Speed PCB Traces
• DDR-4400 IP Model Development Using AMI Builder
• Advanced IC Packaging Trends and Their Impact onEDA Tools
• HSSO - Physical Structure Optimization forHigh-Speed Interconnects
• Brand-New Electrical and Thermal Co-SimulationAnalysis
• A New Platform Power Integrity Design Approachwith SPIM and UPIT
• DDR5 Modeling Using Automated IBIS-AMI ModelingTechnology
  
  

下载链接：

https://www.cadence.com/content/cadence-www/global/en_US/home/company/events/industry-events/designcon-2018.html?CMP=NA_INT_EM_MKTO_0218

欢迎您的评论！

您可以通过PCB_marketing_China@cadence.com联系我们，非常感谢您的关注以及宝贵意见。

- N" ~  m2 z/ s0 o; {

7 k$ A/ Q" n0 L9 H$ O- ?

逸步舞秋风

感谢分享