|
We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 ,mechanical via from layer 1 to 4.( i$ q; y- p1 k; q0 _7 Q! D6 o0 F
$ N" b. d) Z0 ?5 n& Lbut Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias2 C, k( F% A& g! p3 _
, j5 ?6 n* I7 i5 a, [; [8 WMy question is why manufacturer changed mechanical via to stacked via?* {6 X" c$ \7 Q( J- F- Z _9 v
( P6 D: _0 X: I$ bcost also will increase while using stacked vias?
0 r% z! ]4 N' g* |* `2 b
4 }% m4 ]& R8 W
|
|