" ^5 _- }+ h% J) X * c/ E, p0 E+ F3 K FIXED: 2 v0 R) O+ o# ~% J+ R/ w: e. l6 X; m8 v1 O1 J5 g1 ~* U
Assembly Outline User Preferences 5 x8 ~, @5 z) P DPAK Thermal Pad Solder Mask Swell9 z* N$ K" {' R& P
Success/Invalid Indicator and the Courtyard Origin + _% |% ^$ g- F. u" m Through Hole Lead Width Ignored in SIP Package8 U, }/ o0 O: y* ?8 _2 x) h
Courtyard Origin Box Greying Out. s/ B; O [4 L% G' o* ?) w, s: h
Stencil Export to Expedition Incorrect , R" ~# N6 e6 { Eagle upgrades for proportional fonts% a" \$ G8 \( X6 v3 J
SON Pin 1 Building Too Short 1 \1 h$ W+ I7 w. h* |1 Y PLCC – Fixed the graphical errors! h) V# h: C) z3 Z1 ~( H
3D STEP Export User Setting% b5 a. h! c% O4 w" L
D STEP – Up, Down, Left, and Right orientations should now work properly% e7 k0 E. t. G* k, v( o