标题: Both TH and Blind/Buried Via together? [打印本页] 作者: karpcb15 时间: 2018-3-7 20:51 标题: Both TH and Blind/Buried Via together? I designed 4 layer substrate using both Through hole (L1-L4) and Blind(L1-L2 , L3-L4) , buried vias(L2-L3) . Is this possible to Manufacturer? % R+ V% G+ `4 \ K0 I作者: xyylucky 时间: 2018-3-8 10:16
这样做的话，怎么压板啊？想不出来。* s2 \, h/ _# I7 B7 E( ^2 U' x, K: B
如果是埋孔加通孔，L1+（L2+L3)+L4这样压，还可以。3 }2 u4 c3 u- i, y, M
要不改成6层板，问问工厂能不能按假6层做。% |7 a! m% R& u% l1 a+ f k* z 作者: karpcb15 时间: 2018-3-8 13:40
We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 ,mechanical via from layer 1 to 4.+ i7 G* Q% V S1 q6 I
" }' K$ A5 L; Q8 @- S4 sbut Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias. E) y1 b, C3 |1 I6 X7 ?0 m
3 v6 @- M/ O' t3 E( Q% p' pMy question is why manufacturer changed mechanical via to stacked via?6 F4 T( K% g' P }$ `
J( ?$ Q$ w3 a1 U4 m& w6 j
cost also will increase while using stacked vias? 4 c9 g! c, \& p9 X
