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标题: 逻辑电平接口 [打印本页]

作者: liubingbuku    时间: 2017-11-13 16:15
标题: 逻辑电平接口
1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5) H' c6 t* l( C" b/ c
1.1 半导体三极管及其开关特性..................................................................................... 56 C. p; N' f; S
1.2 MOS 管的开关特性......................................................................................................7
! l  M2 \* a) y) O2、逻辑电平简介.................................................................................................................... 87 @6 P3 P* x. L+ Z* ]3 D: o
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10; c6 v/ P8 E9 K. w1 B+ x, ~9 P
3.1:逻辑电平的一些概念............................................................................................... 10
( `" _5 X% q* w$ |3.2:常用的逻辑电平....................................................................................................... 11
$ M2 R# I0 _" t3 [3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 118 `" W+ J1 W) q
4、TTL 和CMOS 逻辑器件.................................................................................................... 13& ?% @% V5 c! ~& v' S3 m' q
4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13
* Q! o; Z& u1 N4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
( `' {0 v1 Y; x4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
0 G4 j% t/ Q4 w" B4.4:包含特殊功能的逻辑器件....................................................................................... 14+ t7 U; ]* R+ b: f4 l  H* y
4.5:逻辑器件的使用指南............................................................................................... 15
8 ^5 R0 `% ~+ f' [! I% z  K5、TTL、CMOS 器件的互连.................................................................................................. 16
" V* n7 E5 n* d" H2 t( F5.1:器件的互连总则.......................................................................................................161 ~# v) V& ~1 T' O) ]5 k. l
5.2:5V TTL 门作驱动源..................................................................................................192 K% Z; h. p- l$ C
5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19
: a. l2 W2 C9 G( o/ r% X# \% b: R5.4:5V CMOS 门作驱动源................................................................................................ 19
& _/ c- u: j4 |/ E: k5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
/ V5 h# R+ O* l6、ECL 器件的原理和特点................................................................................................... 20
/ c0 |8 Z! O" M7 }3 ~6.1:ECL 器件的原理........................................................................................................20
0 t1 o0 @# A  U8 _6.2:ECL 电路的特性........................................................................................................211 V1 @/ ^: h4 E2 [8 P7 c% {2 v
6.3:ECL 器件的使用原则................................................................................................ 22
, B! z  u9 u, @" v6 j7、GTL 器件的原理和特点................................................................................................... 23
) |3 {: y$ Y" K( {7.1:GTL 器件的特点和电平............................................................................................ 23" I" r3 O& `, Z: c/ F: N9 E
7.2:GTL 信号的PCB 设计................................................................................................ 24
* s$ o  |0 N# a7 O7.3:GTL 信号的测试........................................................................................................252 }$ x$ E1 K1 |, @0 I
7.4:GTL 信号的时序........................................................................................................255 M/ i% U& |1 y' c1 [- _
8 HSTL 电平......................................................................................................................... 257 K7 V/ K) d0 v. u' \1 b% \
8.1 基本定义..................................................................................................................... 25+ w9 O2 j# x, C% Y$ L1 C& u
1.2 HSTL 分类.................................................................................................................... 26
; C4 E6 C2 T8 J5 V# V. U8.3 HSTL 特点及SSTL .....................................................................................................26
; L2 ~8 q" q& E9 t4 Z' p9 PECL、LVPECL 电平........................................................................................................... 27! T2 M/ X% ~* E- F
9.1:PECL/LVPECL 器件的原理和特点............................................................................27) y- N# b$ W# |: P* J% V) C
9.2. PECL/LVPECL 电平输出结构................................................................................... 27
: o5 T, F% `3 W9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
+ F# V7 @& Q% M! N2 r% y10 CML 电平......................................................................................................................... 30
: {& C- r8 g9 S! o10.1. CML 接口输出结构............................................................................................... 30
$ F0 f0 C& Z, s9 j$ W  @10.2 CML 接口输入结构...................................................................................................30
4 s) {3 ~7 d5 I' y# S10.3 CML 电平的输出门和输入门的特点: ....................................................................31$ w6 `: c) ?% w2 {# W( c9 e* q
11. LVDS 器件的原理和特点.......................................................................................... 32' A# w8 j+ ^/ b1 W
11.1:LVDS 器件简介........................................................................................................329 F: p5 o3 s! A8 c2 H# B
11.2 LVDS 器件的工作原理.............................................................................................. 33
9 l8 v1 _, w# Y+ b2 d1 R11.3 LVDS 输入输出结构.................................................................................................33
8 ^9 H& I* a/ }4 k' P$ I11.4 LVDS 电平的特点...................................................................................................35
. s" r; v( v! _+ O, ]12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
; ~# @4 A% X% C. P, s- x12.1 CML LVPECL LVDS 简单比较..............................................................................35
, V; A/ h( K8 o0 C12.2 CML LVPECL LVDS 的互连综述..........................................................................385 X0 r5 W4 D  q
12.3 LVPECL 的互连........................................................................................................39* G+ P: S- u/ y8 C. V) B4 D# k
12.4 LVDS 的互连............................................................................................................44: t$ O8 @% C' c
12.5 CML 的互连..............................................................................................................456 B2 U$ o( h& _8 M' ~- p3 L
附录:.................................................................................................................................... 47
7 [) ~# Z* a4 X; ^+ |8 C; ]% L附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47
+ e4 m6 A$ ]- r' g3 H6 s. T附录2. CMOS 门电路及其特点.................................................................................... 596 N. E# k) }" Y/ c& m
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