+ a. F- o& j# L! o. Z4 K/ Z1 S我用默认的CDS AIR,仿真的时候报错Metal layer "TOP" is sitting in an air bubble; please change surrounding dielectric material using the Layer Stack Editor / b; r! }! a8 G" r* M# O2 LMetal layer "GND" is sitting in an air bubble; please change surrounding dielectric material using the Layer Stack Editor # c; V Q: V3 LMetal layer "VCC" is sitting in an air bubble; please change surrounding dielectric material using the Layer Stack Editor( e) E. ~! [6 |& z5 Y4 c
Metal layer "BOTTOM" is sitting in an air bubble; please change surrounding dielectric material using the Layer Stack Editor # j% T% N0 {/ V0 U+ i- m作者: cousins 时间: 2015-8-31 08:06
allegro导入的时候默认为CDS_AIR，即空气填充。 # T, h% b$ `# ^8 H3 ^) `; \2 \, ?改成你的PCB介质就好。作者: qingdalj 时间: 2015-8-31 14:10
PCB上各层本来都是铜箔的，加工时进行了蚀刻，才得到我们想要的信号线、电源等，这里的填充介质是PCB压合时填充到该层的介质（该层某些地方被蚀刻后，铜被溶解了，所以压合时会有材料填充进来）作者: yuju 时间: 2015-9-2 14:32
叠层上每一层 除了 铜走线，还有树脂在铜的旁边包围铜。 填充就是这个包围走线的东西作者: hanhan889 时间: 2015-9-8 10:46
谢谢大家,了解了.
